JPS6451691A - Manufacture of printed wiring board - Google Patents

Manufacture of printed wiring board

Info

Publication number
JPS6451691A
JPS6451691A JP20855387A JP20855387A JPS6451691A JP S6451691 A JPS6451691 A JP S6451691A JP 20855387 A JP20855387 A JP 20855387A JP 20855387 A JP20855387 A JP 20855387A JP S6451691 A JPS6451691 A JP S6451691A
Authority
JP
Japan
Prior art keywords
resin
electroplating
substrate
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20855387A
Other languages
Japanese (ja)
Inventor
Tomoaki Yamane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP20855387A priority Critical patent/JPS6451691A/en
Publication of JPS6451691A publication Critical patent/JPS6451691A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Abstract

PURPOSE:To reduce the manufacturing time of a printed wiring board by saving processes necessary for chemical plating, and enable the formation of an arbitrary circuit, by arranging, on an insulative substrate, a thin film layer composed of conductive resin as a base layer for electroplating, and forming, thereon, an electroplating layer. CONSTITUTION:For resin to form a conductive thin film turning to a base layer for electroplating on an insulative substrate, the following is preferably used: conductor paste wherein metal powder acting as a conductor such as silver, copper, graphite, carbon black, and nickel is dispersed into base acting as a binder such as epoxy resin, phenol resin, acrylic resin, unsaturated polyester resin and urethane resin. The above conductive resin is spread on the substrate in an uncured state or a monomer or oligomer state, and then is cured by an ordinary method. Spreading can be performed either on the whole surface of the substrate, or on the pattern forming part only.
JP20855387A 1987-08-22 1987-08-22 Manufacture of printed wiring board Pending JPS6451691A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20855387A JPS6451691A (en) 1987-08-22 1987-08-22 Manufacture of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20855387A JPS6451691A (en) 1987-08-22 1987-08-22 Manufacture of printed wiring board

Publications (1)

Publication Number Publication Date
JPS6451691A true JPS6451691A (en) 1989-02-27

Family

ID=16558090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20855387A Pending JPS6451691A (en) 1987-08-22 1987-08-22 Manufacture of printed wiring board

Country Status (1)

Country Link
JP (1) JPS6451691A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0383395A (en) * 1989-08-14 1991-04-09 Internatl Business Mach Corp <Ibm> Printed circuit board and its manufacture
JPH06188532A (en) * 1992-12-21 1994-07-08 Yazaki Corp Conductive member for electric circuit, electric circuit body, and production thereof
JPH0758439A (en) * 1993-08-19 1995-03-03 Aica Kogyo Co Ltd Electric circuit substrate and manufacture
JP2007282247A (en) * 2001-03-26 2007-10-25 Daniel Luch Conductive pattern, antenna, and manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0383395A (en) * 1989-08-14 1991-04-09 Internatl Business Mach Corp <Ibm> Printed circuit board and its manufacture
JPH06188532A (en) * 1992-12-21 1994-07-08 Yazaki Corp Conductive member for electric circuit, electric circuit body, and production thereof
JPH0758439A (en) * 1993-08-19 1995-03-03 Aica Kogyo Co Ltd Electric circuit substrate and manufacture
JP2007282247A (en) * 2001-03-26 2007-10-25 Daniel Luch Conductive pattern, antenna, and manufacturing method

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