JPS6417450A - Formation of bump - Google Patents
Formation of bumpInfo
- Publication number
- JPS6417450A JPS6417450A JP62172786A JP17278687A JPS6417450A JP S6417450 A JPS6417450 A JP S6417450A JP 62172786 A JP62172786 A JP 62172786A JP 17278687 A JP17278687 A JP 17278687A JP S6417450 A JPS6417450 A JP S6417450A
- Authority
- JP
- Japan
- Prior art keywords
- bump
- metallic
- wiring
- plating method
- formation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE:To obtain a bump which shows the same characteristics as in a conventional method, by performing a very small number of processes and using an electroless plating method to form a metallic bump. CONSTITUTION:A metallic wiring 1 is mounted on a surface, and a prescribed region of the wiring 1 on a substrate 3 is coated with an insulation layer 2, and a metallic bump 6 of a projecting shape is formed on the wiring 1. Then a metallic bump 6 is formed by an electroless plating method. The metallic bump 6 is made of one metal selected from gold, silver, copper, nickel, or cobalt. Thereupon, very small number of processes are used in comparison with the formation of the bump by a conventional electrical plating method, so that the bump showing the same characteristics as in the conventional method can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62172786A JPS6417450A (en) | 1987-07-13 | 1987-07-13 | Formation of bump |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62172786A JPS6417450A (en) | 1987-07-13 | 1987-07-13 | Formation of bump |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6417450A true JPS6417450A (en) | 1989-01-20 |
Family
ID=15948327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62172786A Pending JPS6417450A (en) | 1987-07-13 | 1987-07-13 | Formation of bump |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6417450A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03209725A (en) * | 1990-01-11 | 1991-09-12 | Matsushita Electric Ind Co Ltd | Method for forming bump of semiconductor device |
DE19616373A1 (en) * | 1996-04-24 | 1997-08-14 | Fraunhofer Ges Forschung | Forming galvanically deposited contact bumps for integrated circuits |
-
1987
- 1987-07-13 JP JP62172786A patent/JPS6417450A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03209725A (en) * | 1990-01-11 | 1991-09-12 | Matsushita Electric Ind Co Ltd | Method for forming bump of semiconductor device |
DE19616373A1 (en) * | 1996-04-24 | 1997-08-14 | Fraunhofer Ges Forschung | Forming galvanically deposited contact bumps for integrated circuits |
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