GB1394062A - Semi-conductor devices - Google Patents

Semi-conductor devices

Info

Publication number
GB1394062A
GB1394062A GB4685071A GB4685071A GB1394062A GB 1394062 A GB1394062 A GB 1394062A GB 4685071 A GB4685071 A GB 4685071A GB 4685071 A GB4685071 A GB 4685071A GB 1394062 A GB1394062 A GB 1394062A
Authority
GB
United Kingdom
Prior art keywords
layer
nickel
chip
aperture
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4685071A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lucas Electrical Co Ltd
Original Assignee
Lucas Electrical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Electrical Co Ltd filed Critical Lucas Electrical Co Ltd
Priority to GB4685071A priority Critical patent/GB1394062A/en
Publication of GB1394062A publication Critical patent/GB1394062A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuses (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

1394062 Semi-conductor devices LUCAS ELECTRICAL CO Ltd 3 Oct 1972 [8 Oct 1971] 46850/71 Heading H1K A semi-conductor chip is provided with an upstanding metal land through which it may be soldered to a conductive substrate or a conductive land on an insulating substrate by the following method. The chip 11 (Fig. 2) e.g. of silicon is first provided with an aluminium layer 12, part of which is exposed through an aperture 14 in silica glass layer 13. A 500 Š thick layer 16 of chromium, titanium or tungsten and a 1000 Š layer 17 of nickel or copper are deposited to extend into the aperture and are covered with photoresist 18 which is exposed and developed to expose the part of layer 17 within aperture 14. The chip is then immersed in a nickel chloride plating bath and connected first as anode to clean the surface of layer 17 and then as cathode to deposit nickel 21, which is further built up by electroplating in a nickel sulphamate bath and then gold plated to prevent it tarnishing. After removal of the photoresist the layers 16, 17 where not protected by the nickel 21 are etched away in a mixture of ceric sulphate and sulphuric acid. The chip may then be mounted to an insulating substrate by inverting it to bring the land 21 and any other similar lands into contact with solder coated lands on the substrate and heating to fuse the solder.
GB4685071A 1971-10-08 1971-10-08 Semi-conductor devices Expired GB1394062A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4685071A GB1394062A (en) 1971-10-08 1971-10-08 Semi-conductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4685071A GB1394062A (en) 1971-10-08 1971-10-08 Semi-conductor devices

Publications (1)

Publication Number Publication Date
GB1394062A true GB1394062A (en) 1975-05-14

Family

ID=10442821

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4685071A Expired GB1394062A (en) 1971-10-08 1971-10-08 Semi-conductor devices

Country Status (1)

Country Link
GB (1) GB1394062A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0178181A2 (en) * 1984-10-12 1986-04-16 Tektronix, Inc. Methods for producing an aperture in a surface
GB2194386A (en) * 1986-08-20 1988-03-02 Plessey Co Plc Solder bonded integrated circuit devices

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0178181A2 (en) * 1984-10-12 1986-04-16 Tektronix, Inc. Methods for producing an aperture in a surface
EP0178181A3 (en) * 1984-10-12 1987-08-19 Tektronix, Inc. Methods for producing an aperture in a surface
GB2194386A (en) * 1986-08-20 1988-03-02 Plessey Co Plc Solder bonded integrated circuit devices
GB2194386B (en) * 1986-08-20 1990-07-18 Plessey Co Plc Solder bonded integrated circuit devices

Similar Documents

Publication Publication Date Title
US4024631A (en) Printed circuit board plating process
US3357099A (en) Providing plated through-hole connections with the plating resist extending to the hole edges
US3528090A (en) Method of providing an electric connection on a surface of an electronic device and device obtained by using said method
US4144118A (en) Method of providing printed circuits
US3984290A (en) Method of forming intralayer junctions in a multilayer structure
KR830002066A (en) How to remove copper ions from baths containing copper ions
GB724379A (en) A method for making a predetermined metallic pattern on an insulating base
GB1394062A (en) Semi-conductor devices
JPS58500765A (en) A method for chemically stripping a plating layer containing palladium and at least one of copper and nickel, and a bath used in the method
CN110854066A (en) Semiconductor electroplating method
JPH06152105A (en) Manufacture of printed wiring board
US3699010A (en) Beam lead plating process
US6203690B1 (en) Process of reworking pin grid array chip carriers
US3514379A (en) Electrodeposition of metals on selected areas of a base
US3634202A (en) Process for the production of thick film conductors and circuits incorporating such conductors
GB1517235A (en) Printed circuit boards
GB1409737A (en) Through-hole plated printed circuits
US3554876A (en) Process for etching and electro plating a printed circuit
JPS5475585A (en) Aluminium terminal
GB1497312A (en) Production of printed circuit arrangements
US2197632A (en) Electrical rectifier
US3934985A (en) Multilayer structure
JPS56142886A (en) Tin plating method for aluminum alloy
JPS5942998B2 (en) Printed circuit board manufacturing method
JPS5730353A (en) Semiconductor device

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee