JPS54126468A - Production of resin-sealed semiconductor device - Google Patents

Production of resin-sealed semiconductor device

Info

Publication number
JPS54126468A
JPS54126468A JP3390178A JP3390178A JPS54126468A JP S54126468 A JPS54126468 A JP S54126468A JP 3390178 A JP3390178 A JP 3390178A JP 3390178 A JP3390178 A JP 3390178A JP S54126468 A JPS54126468 A JP S54126468A
Authority
JP
Japan
Prior art keywords
resin
element
hollow
caused
form
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3390178A
Inventor
Kenji Miyajima
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP3390178A priority Critical patent/JPS54126468A/en
Publication of JPS54126468A publication Critical patent/JPS54126468A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71

Abstract

PURPOSE: To form a hollow, where the bottom face consists of a metallic thin plate, in the aperture part of an insulating substrate and store here and connect and resin- seal conductors.
CONSTITUTION: Through-hole 32 is provided in insulating substrate 31, and copper plate 33 of 15 to 25μm is caused to adhere onto both faces. Hollow 34 as well as a wiring pattern are formed by photo etching, and a needless part on the lower face is removed. Next, after superposing gold or silver plating onto Ni plating, substrate 31 is divided into details to form an element storage vessel. Semiconductor element 41 is caused to adhere into the hollow in 42, and the wiring layer of copper plate 33 and the electrode of element 41 are connected in 35, and the element is resin-sealed in 36. This method is advantageous to formation of thin devices.
COPYRIGHT: (C)1979,JPO&Japio
JP3390178A 1978-03-24 1978-03-24 Production of resin-sealed semiconductor device Pending JPS54126468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3390178A JPS54126468A (en) 1978-03-24 1978-03-24 Production of resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3390178A JPS54126468A (en) 1978-03-24 1978-03-24 Production of resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS54126468A true JPS54126468A (en) 1979-10-01

Family

ID=12399415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3390178A Pending JPS54126468A (en) 1978-03-24 1978-03-24 Production of resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS54126468A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1119038A3 (en) * 1993-12-06 2001-11-14 Fujitsu Limited Method of producing a semiconductor device
US6379997B1 (en) 1993-12-06 2002-04-30 Fujitsu Limited Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1119038A3 (en) * 1993-12-06 2001-11-14 Fujitsu Limited Method of producing a semiconductor device
US6379997B1 (en) 1993-12-06 2002-04-30 Fujitsu Limited Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same

Similar Documents

Publication Publication Date Title
JPH01251778A (en) Ic card
JPH03136243A (en) Formation of integrated circuit structure
JPS5816552A (en) Package for semiconductor element
JPH0437149A (en) Semiconductor device and manufacture of the same
JPS62216259A (en) Manufacture and structure of hybrid integrated circuit
JPS62173740A (en) Semiconductor device and manufacture thereof
JPS5710992A (en) Semiconductor device and manufacture therefor
JPS6461934A (en) Semiconductor device and manufacture thereof
EP0265629A3 (en) Printed circuit card fabrication process with nickel overplate
EP0177105A3 (en) Method for providing a semiconductor device with planarized contacts
JPS61280638A (en) Manufacture of semiconductor device
JPH0621142A (en) Method for bonding semiconductor chip and semiconductor integrated circuit device
JPS624351A (en) Manufacture of semiconductor carrier
JPS61174744A (en) Integrated circuit device and manufacture thereof
JPS5513933A (en) Circuit element substrate and its manufacturing method
EP0039160A3 (en) Methods for bonding conductive bumps to electronic circuitry
JPH01179334A (en) Mounting of semiconductor device
JPH02126610A (en) High frequency coil and manufacture thereof
JPH04255251A (en) Semiconductor integrated circuit and manufacture thereof
JPS60217646A (en) Manufacture of bump electrode type semiconductor device
JPS5350686A (en) Production of semiconductor integrated circuit
JPS5773952A (en) Chip for face down bonding and production thereof
JPH0358484A (en) Semiconductor device and manufacture thereof
JPS5370688A (en) Production of semoconductor device
JPS5571052A (en) Substrate for semiconductor device