JPS6481397A - Manufacture of metallic base printed board - Google Patents

Manufacture of metallic base printed board

Info

Publication number
JPS6481397A
JPS6481397A JP23955287A JP23955287A JPS6481397A JP S6481397 A JPS6481397 A JP S6481397A JP 23955287 A JP23955287 A JP 23955287A JP 23955287 A JP23955287 A JP 23955287A JP S6481397 A JPS6481397 A JP S6481397A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
resin
holes
opening
forming
opened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23955287A
Inventor
Munehiko Fukushima
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE:To form an accurate and miniature pattern and to improve insulating reliability of an opening by coating the surface and opening of a metal plate in which predetermined portions are opened with resin by fluidizing and dipping, then forming a circuit with conductive paste, and forming through holes as required. CONSTITUTION:An opened metal plate 5 is treated in a fluidizing and dipping tank of resin powder for forming an insulating layer of epoxy resin, polyamide, etc., the surface and, opening 6 are covered with resin to form a resin insulating layer 7. After a circuit 8 is formed with conductive paste on the layer 7, holes 6 to be filled with resin of the plate 5 are opened. Further, if necessary, through hole conductive layers 9 are formed in the holes 6 by means, such as through hole plating or conductive paste coating, etc.
JP23955287A 1987-09-24 1987-09-24 Manufacture of metallic base printed board Pending JPS6481397A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23955287A JPS6481397A (en) 1987-09-24 1987-09-24 Manufacture of metallic base printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23955287A JPS6481397A (en) 1987-09-24 1987-09-24 Manufacture of metallic base printed board

Publications (1)

Publication Number Publication Date
JPS6481397A true true JPS6481397A (en) 1989-03-27

Family

ID=17046504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23955287A Pending JPS6481397A (en) 1987-09-24 1987-09-24 Manufacture of metallic base printed board

Country Status (1)

Country Link
JP (1) JPS6481397A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5316787A (en) * 1990-06-04 1994-05-31 International Business Machines Corporation Method for manufacturing electrically isolated polyimide coated vias in a flexible substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5333366A (en) * 1976-09-09 1978-03-29 Citizen Watch Co Ltd Ic mounting structure
JPS5472462A (en) * 1977-11-22 1979-06-09 Hitachi Chemical Co Ltd Preparation of substrate for metallic core print plug board
JPS5789297A (en) * 1980-11-26 1982-06-03 Fujitsu Ltd Method of producing metallic core printed board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5333366A (en) * 1976-09-09 1978-03-29 Citizen Watch Co Ltd Ic mounting structure
JPS5472462A (en) * 1977-11-22 1979-06-09 Hitachi Chemical Co Ltd Preparation of substrate for metallic core print plug board
JPS5789297A (en) * 1980-11-26 1982-06-03 Fujitsu Ltd Method of producing metallic core printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5316787A (en) * 1990-06-04 1994-05-31 International Business Machines Corporation Method for manufacturing electrically isolated polyimide coated vias in a flexible substrate

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