JPS6451693A - Manufacture of electronic circuit substrate - Google Patents
Manufacture of electronic circuit substrateInfo
- Publication number
- JPS6451693A JPS6451693A JP20961187A JP20961187A JPS6451693A JP S6451693 A JPS6451693 A JP S6451693A JP 20961187 A JP20961187 A JP 20961187A JP 20961187 A JP20961187 A JP 20961187A JP S6451693 A JPS6451693 A JP S6451693A
- Authority
- JP
- Japan
- Prior art keywords
- conductive resin
- circuit
- circuit elements
- layer
- electroless plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To reduce the connection resistance inbetween circuit elements and a circuit conductor layer, and to improve the reliability of connection, by a method wherein small-sized circuit elements of plane connection type are mounted before conductive resin on which a circuit conductor layer is formed by screen printing method is not cured, and then an electronic circuit is constituted by depositing simultaneously a conducting metal layer on both a conductive resin layer fixed by an electroless plating and an external connection terminal layer for circuit elements. CONSTITUTION:On the main surface of an insulating substrate 5, paste composed of conductive resin 6 obtained by electroless plating is spread in a desired form of wiring circuit pattern, by screen printing art. Then, small-sized circuit elements 7 are mounted. External connection terminals 8, 8' of the circuit elements 7 are brought into contact with a part of conductive resin 6 in the uncured state, and then the conductive resin 6 is cured. One in which the small-sized circuit elements 7 are fixed at specified positions of an insulating substrate 5 with the conductive resin 6, is dipped in the electroless plating solution, and a conducting metal layer 9 is deposited on the surface of the conductive resin 6 fixed in the form of a wiring circuit, and on the external connection terminals 8, 8' of the circuit element 7.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62209611A JP2537893B2 (en) | 1987-08-24 | 1987-08-24 | Electronic circuit board manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62209611A JP2537893B2 (en) | 1987-08-24 | 1987-08-24 | Electronic circuit board manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6451693A true JPS6451693A (en) | 1989-02-27 |
JP2537893B2 JP2537893B2 (en) | 1996-09-25 |
Family
ID=16575670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62209611A Expired - Lifetime JP2537893B2 (en) | 1987-08-24 | 1987-08-24 | Electronic circuit board manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2537893B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0592938A1 (en) * | 1992-10-16 | 1994-04-20 | AMEG Additive Metallisierung- Eentwicklungs und Anwendungsgesellschaft mbH | Process for mounting and contacting electronic components on an insulating support |
-
1987
- 1987-08-24 JP JP62209611A patent/JP2537893B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0592938A1 (en) * | 1992-10-16 | 1994-04-20 | AMEG Additive Metallisierung- Eentwicklungs und Anwendungsgesellschaft mbH | Process for mounting and contacting electronic components on an insulating support |
Also Published As
Publication number | Publication date |
---|---|
JP2537893B2 (en) | 1996-09-25 |
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