JPS6355796B2 - - Google Patents
Info
- Publication number
- JPS6355796B2 JPS6355796B2 JP56107425A JP10742581A JPS6355796B2 JP S6355796 B2 JPS6355796 B2 JP S6355796B2 JP 56107425 A JP56107425 A JP 56107425A JP 10742581 A JP10742581 A JP 10742581A JP S6355796 B2 JPS6355796 B2 JP S6355796B2
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- resistor
- wiring
- adhesive layer
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001721 polyimide Polymers 0.000 claims description 25
- 239000004642 Polyimide Substances 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 238000007639 printing Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000012212 insulator Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000002952 polymeric resin Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
【発明の詳細な説明】
本発明は、ポリイミドフレキシブル基板を用い
て成る薄型の回路基板の製法に係わる。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a thin circuit board using a polyimide flexible board.
ポリイミドフイルムは表面が化学的に安定な為
に他の有機高分子材料（例えばエポキシ樹脂）と
相溶性が無く、密着力に欠ける。従つてポリイミ
ドフイルムに印刷法で配線パターン、抵抗体等を
形成することは困難であつた。 Since polyimide film has a chemically stable surface, it is not compatible with other organic polymer materials (eg, epoxy resin) and lacks adhesive strength. Therefore, it has been difficult to form wiring patterns, resistors, etc. on polyimide films by printing methods.
従来、ポリイミドフレキシブル基板を用いた回
路基板は、例えば第１図Ａ〜Ｄに示すようにポリ
イミドフレキシブル基板１の一面に接着剤２付き
の銅箔３を貼着し、この銅箔３を選択エツチング
して所定パターンの配線４を形成し、しかる後例
えばチツプ抵抗体５を半田６を介して所要の配線
４間に実装して製造していた。このように従来は
チツプマウント方式を採用しているためにコスト
高となると共に薄型の回路基板が得にくかつた。 Conventionally, a circuit board using a polyimide flexible board is manufactured by pasting a copper foil 3 with an adhesive 2 on one side of a polyimide flexible board 1, and selectively etching this copper foil 3, as shown in FIGS. 1A to 1D, for example. The wires 4 in a predetermined pattern are then formed, and then, for example, a chip resistor 5 is mounted between the required wires 4 via solder 6, thereby manufacturing. In this way, conventionally, the chip mounting method has been adopted, which has resulted in high costs and has made it difficult to obtain thin circuit boards.
本発明は、上述の点に鑑みポリイミドフイルム
に対して印刷法で配線、抵抗体、あるいは多層配
線の際の絶縁体等の形成を可能にし、回路基板の
薄型化を促進し得るようにした薄型回路基板の製
法を提供するものである。 In view of the above-mentioned points, the present invention makes it possible to form wiring, resistors, insulators for multilayer wiring, etc. on a polyimide film by a printing method, and to promote thinning of circuit boards. The present invention provides a method for manufacturing a circuit board.
以下、実施例を参照して本発明を説明する。 The present invention will be described below with reference to Examples.
第２図Ａ〜Ｃは本発明の一実施例を示す。本例
においては、先ずポリイミドフレキシブル基板１
上に前述の第１図Ａ〜Ｃと同様の工程を経て接着
剤２付き銅箔３による所定パターンの配線４を形
成する。 FIGS. 2A-2C show one embodiment of the present invention. In this example, first, the polyimide flexible substrate 1
A predetermined pattern of wiring 4 is formed on the copper foil 3 with adhesive 2 through the same steps as in FIGS. 1A to 1C described above.
次に、所要の配線４間の抵抗体を配すべき位置
にポリイミド変成接着剤層１１を印刷形成し、こ
の接着剤層１１を150℃、15〜30分の熱処理によ
つて半硬化せしめ、しかる後接着剤層１１及び両
配線４に跨るようにポリマーレジン抵抗ペースト
（基材は例えばエポキシ樹脂）を印刷し、焼成し
て抵抗体１２を形成する。焼成は150℃、８〜10
時間あるいは170℃〜180℃、２〜３時間とするを
可とする。ポリイミド変成接着剤とエポキシ樹脂
との密着性は良好であり、従つて接着剤層１１と
抵抗体１２とは良好に接着される。 Next, a polyimide modified adhesive layer 11 is printed at the position where the resistor between the required wirings 4 is to be placed, and this adhesive layer 11 is semi-cured by heat treatment at 150° C. for 15 to 30 minutes. Thereafter, a polymer resin resistor paste (base material is, for example, epoxy resin) is printed so as to span the adhesive layer 11 and both wirings 4, and is fired to form the resistor 12. Firing at 150℃, 8-10
or 170°C to 180°C for 2 to 3 hours. The adhesiveness between the polyimide modified adhesive and the epoxy resin is good, and therefore the adhesive layer 11 and the resistor 12 are well bonded.
この製法によれば、従来のチツプマウント方式
による厚さt1≒1.0mm（第１図Ｄ参照）に比べて
膜厚t2が0.05〜0.1mmの薄型の抵抗回路基板１３が
得られる。 According to this manufacturing method, a thin resistor circuit board 13 having a film thickness t 2 of 0.05 to 0.1 mm can be obtained, compared to the thickness t 1 ≈1.0 mm (see FIG. 1D) of the conventional chip mounting method.
第３図Ａ〜Ｄの実施例は配線パターン及び抵抗
体を共に印刷法で形成した場合である。本例にお
いては、ポリイミドフレキシブル基板１上にポリ
イミド変成接着剤層１１を塗布形成して半硬化
（150℃、15〜30分の処理）させる。この場合、接
着剤層１１は基板１が単一基板であればスクリー
ン印刷で形成し、基板１がロールフイルム状であ
ればロールコーダーで形成し得る。次に接着剤層
１１上に例えばAg、Cu、NiあるいはAl等を混入
してなるポリマー系導体ペースト（基材は例えば
エポキシ樹脂）１４′を所定の配線パターンをも
つて印刷形成し半硬化（150℃、15〜30分の処理）
させる。次に所要の配線間の接着剤層１１上にポ
リマーレジン抵抗ペーストを印刷し、しかる後上
例と同様に焼成して抵抗体１２及び所定パターン
の配線１４を形成し目的の薄型の抵抗回路基板１
５を得る。この回路基板１５の製法によれば、配
線１４が選択エツチングで形成されず抵抗体１２
と共に印刷法で形成されるので、省資源、無公害
な製造プロセスであり、一方配線１４及び抵抗体
１２とポリイミドフレキシブル基板１とはポリイ
ミド変成接着剤層１１を介して密着され実用に耐
え得るものであり、従つて一層容易に且つ安価に
薄型化された抵抗回路基板の製造が可能になる。 The embodiments shown in FIGS. 3A to 3D are cases in which both the wiring pattern and the resistor are formed by a printing method. In this example, a polyimide modified adhesive layer 11 is coated on a polyimide flexible substrate 1 and semi-cured (processed at 150° C. for 15 to 30 minutes). In this case, the adhesive layer 11 may be formed by screen printing if the substrate 1 is a single substrate, or may be formed by a roll coder if the substrate 1 is in the form of a roll film. Next, on the adhesive layer 11, a polymer-based conductive paste 14' (base material is, for example, epoxy resin) mixed with, for example, Ag, Cu, Ni, or Al is printed and formed with a predetermined wiring pattern, and semi-cured ( 150℃, 15-30 minutes processing)
let Next, a polymer resin resistor paste is printed on the adhesive layer 11 between the required wirings, and then baked in the same manner as in the above example to form the resistor 12 and the wiring 14 in a predetermined pattern to form the desired thin resistor circuit board. 1
Get 5. According to this manufacturing method of the circuit board 15, the wiring 14 is not formed by selective etching, and the resistor 12 is not formed by selective etching.
It is a resource-saving and pollution-free manufacturing process because it is formed by a printing method, and on the other hand, the wiring 14, the resistor 12, and the polyimide flexible substrate 1 are closely bonded via the polyimide modified adhesive layer 11, so that it can withstand practical use. Therefore, it becomes possible to manufacture a thinner resistor circuit board more easily and at a lower cost.
第４図及び第５図の実施例は夫々薄型の多層回
路基板の製造に適用した場合である。 The embodiments shown in FIGS. 4 and 5 are respectively applied to the manufacture of thin multilayer circuit boards.
即ち第４図Ａ〜Ｅは抵抗体及び配線を多層構造
とした場合である。本例は、ポリイミドフレキシ
ブル基板１の一面にポリイミド変成接着剤層１１
を塗布し半硬化（150℃、15〜30分の処理）させ、
次に所定パターンにポリマー系導体ペースト１
４′を印刷し、之を半硬化（150℃、15〜30分の処
理）させる。次に所要の配線間の接着剤層１１上
に両配線に跨る如くポリマーレジン抵抗ペースト
を印刷し焼成して抵抗体１２及び配線１４を形成
する。 That is, FIGS. 4A to 4E show cases in which the resistor and wiring have a multilayer structure. In this example, a polyimide modified adhesive layer 11 is formed on one surface of a polyimide flexible substrate 1.
Apply and semi-cure (150℃, 15-30 minutes),
Next, apply polymer conductor paste 1 to the specified pattern.
4' is printed and semi-cured (processed at 150°C for 15 to 30 minutes). Next, a polymer resin resistance paste is printed on the adhesive layer 11 between the required wirings so as to span both wirings, and is fired to form the resistor 12 and the wiring 14.
次に、ポリマー系の絶縁体層１６を印刷形成
し、半硬化させ、以後は多層の数に応じて第４図
Ｃ〜Ｅの工程を繰り返し、このとき２層目からの
配線１４は接着剤層１１を介さずに直接絶縁体層
１６上に印刷し、そして最後に焼成する。斯くし
て目的の多層回路基板を得る。 Next, a polymer-based insulator layer 16 is printed and semi-cured, and the steps shown in FIG. 4 C to E are repeated depending on the number of layers. It is printed directly on the insulator layer 16 without intervening the layer 11 and finally fired. In this way, the desired multilayer circuit board is obtained.
第５図Ａ〜Ｄは配線のみ多層構造とした場合で
ある。本例は、上例と同様にポリイミドフレキシ
ブル基板１の一面にポリイミド変成接着剤層１１
を塗布して半硬化させ、次にポリマー系導体ペー
スト１４′を所定の配線パターンをもつて印刷し
て半硬化させ、さらにポリマー系の絶縁体層１６
を例えばスルホール１８を有するようなパターン
で印刷形成して半硬化させ、以後多層の数に応じ
て第５図Ｃ〜Ｄの工程を繰り返し図示せざるも最
上層の所要の配線１４間に抵抗体１２を印刷形成
し、最後に絶縁体層１６及び配線１４を焼成して
目的の多層回路基板を得る。 FIGS. 5A to 5D show the case where only the wiring has a multilayer structure. In this example, as in the above example, a polyimide modified adhesive layer 11 is formed on one surface of a polyimide flexible substrate 1.
Next, a polymer-based conductor paste 14' is printed with a predetermined wiring pattern and semi-cured, and then a polymer-based insulating layer 16 is applied.
For example, a pattern having through holes 18 is printed and semi-cured, and thereafter, the steps shown in FIG. 12 is formed by printing, and finally the insulating layer 16 and the wiring 14 are fired to obtain the desired multilayer circuit board.
上記第４図及び第５図の製法によれば、ポリイ
ミドフレキシブル基板１に接着剤層１２を形成す
ることにより、ポリマ系の導体（配線）、抵抗体、
絶縁体が印刷形成でき、フレキシブル基板を用い
た多層回路基板の製造が可能となる。特に抵抗
体、配線が印刷で作れるので、多層回路基板が安
価に得られる。 According to the manufacturing method shown in FIGS. 4 and 5 above, by forming the adhesive layer 12 on the polyimide flexible substrate 1, polymer conductors (wiring), resistors,
Insulators can be printed and formed, making it possible to manufacture multilayer circuit boards using flexible substrates. In particular, since resistors and wiring can be made by printing, multilayer circuit boards can be obtained at low cost.
この様に上述の本発明によれば、ポリイミドフ
イルムに対して従来困難であつた印刷法による配
線、抵抗体、絶縁体等の形成が可能となるもので
あり、フレキシブル基板を用いた単層又は多層回
路基板のより薄型化及び小型化が促進される実益
を有する。 As described above, according to the present invention described above, it is possible to form wiring, resistors, insulators, etc. on polyimide films by the printing method, which has been difficult in the past, and it is possible to form wiring, resistors, insulators, etc. on polyimide films using a single layer or a flexible substrate. This has the practical benefit of promoting thinner and smaller multilayer circuit boards.
第１図Ａ〜Ｄは従来の回路基板の製法例を示す
工程図、第２図Ａ〜Ｃ、第３図Ａ〜Ｄ、第４図Ａ
〜Ｅ及び第５図Ａ〜Ｄは夫々本発明による薄型回
路基板の製法の実施例を示す工程図である。
１はポリイミドフレキシブル基板、１１はポリ
イミド変成接着剤層、１２は抵抗体、１４は配
線、１６は絶縁体である。
Figures 1A to D are process diagrams showing examples of conventional circuit board manufacturing methods, Figures 2A to C, Figures 3A to D, and Figure 4A.
5A to 5E and FIGS. 5A to 5D are process diagrams showing an embodiment of the method for manufacturing a thin circuit board according to the present invention, respectively. 1 is a polyimide flexible substrate, 11 is a polyimide modified adhesive layer, 12 is a resistor, 14 is a wiring, and 16 is an insulator.
Claims (1)
形成するに際し、前記ポリイミドフレキシブル基
板上の少くとも前記印刷抵抗体を設けるべき部分
にはポリイミド変成接着剤を印刷にて塗布形成
し、半硬化状態とした後、該接着剤層上に前記抵
抗体を印刷形成して成ることを特徴とする薄型回
路基板の製法。1. When forming a printed resistor on a polyimide flexible substrate, at least a portion of the polyimide flexible substrate where the printed resistor is to be provided is coated with a polyimide modified adhesive by printing, and after being semi-cured, A method for manufacturing a thin circuit board, comprising printing and forming the resistor on the adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56107425A JPS589394A (en) | 1981-07-09 | 1981-07-09 | Method of producing thin circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56107425A JPS589394A (en) | 1981-07-09 | 1981-07-09 | Method of producing thin circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS589394A JPS589394A (en) | 1983-01-19 |
| JPS6355796B2 true JPS6355796B2 (en) | 1988-11-04 |
Family
ID=14458814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56107425A Granted JPS589394A (en) | 1981-07-09 | 1981-07-09 | Method of producing thin circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS589394A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61136285A (en) * | 1984-12-07 | 1986-06-24 | 松下電器産業株式会社 | Printed wire circuit for high frequency |
| JPH04171902A (en) * | 1990-11-06 | 1992-06-19 | Matsushita Electric Ind Co Ltd | Manufacture of rectangular type chip resistor |
| JP6022963B2 (en) * | 2013-02-13 | 2016-11-09 | 株式会社フジクラ | Stretchable wiring board and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51107458A (en) * | 1975-03-17 | 1976-09-24 | Matsushita Electric Ind Co Ltd | INSATSUTEIKOTAI |
| JPS5439873A (en) * | 1977-09-06 | 1979-03-27 | Nippon Denso Co | Incombustible ypet flexible printed wiring board |
-
1981
- 1981-07-09 JP JP56107425A patent/JPS589394A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51107458A (en) * | 1975-03-17 | 1976-09-24 | Matsushita Electric Ind Co Ltd | INSATSUTEIKOTAI |
| JPS5439873A (en) * | 1977-09-06 | 1979-03-27 | Nippon Denso Co | Incombustible ypet flexible printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS589394A (en) | 1983-01-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3094481B2 (en) | Electronic circuit device and manufacturing method thereof | |
| JPS6355796B2 (en) | ||
| JPH0265194A (en) | Manufacture of printed wiring board with thick film element | |
| JP4671511B2 (en) | Wiring board manufacturing method | |
| JP2000133943A (en) | Manufacture of multilayered board | |
| JPS5998597A (en) | Multilayer printed circuit board | |
| JP2002299826A (en) | Multilayered printed wiring board, semiconductor device, and their manufacturing methods | |
| JPS6347157B2 (en) | ||
| JPH0224395B2 (en) | ||
| JPS5857920B2 (en) | printed circuit board | |
| JP2000294905A (en) | Manufacture of package wiring board | |
| JPH09181453A (en) | Multilayer wiring board and its manufacturing method | |
| JPH0410753B2 (en) | ||
| JPS5814760B2 (en) | Insatsu Chiroban | |
| JPS6235692A (en) | Printed wiring board | |
| JPH0137877B2 (en) | ||
| JPS63257258A (en) | Circuit board with low resistor and manufacture thereof | |
| JPS60187047A (en) | Manufacture of thick film circuit board | |
| JPS62242390A (en) | Manufacture of printed wiring board | |
| JPH0348483A (en) | Flexible printed wiring board | |
| JPS63272097A (en) | Manufacture of multilayer circuit substrate | |
| JPS6346592B2 (en) | ||
| JPH03255691A (en) | Printed wiring board | |
| JPH03196693A (en) | Manufacture of resistor and conductor of printed wiring board by replication | |
| JPS6392090A (en) | Manufacture of multilayer circuit board |