JPS61136285A - Printed wire circuit for high frequency - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed wiring circuit for a high frequency circuit that can be used in mass-produced radio receivers and television receivers.

(Composition of conventional example and its problems) Generally, when mass producing radio receivers and the like, especially high frequency FM receivers, etc., a high frequency amplification circuit is formed on a printed circuit board as shown in FIG.

Adjusted and mass produced. This production method is considered desirable from the viewpoint of parts management and productivity. The specific mounting method is as shown in FIGS. 2, 3, and 4, on a printed circuit board 1, resistive element 2, capacitive element 3. This method involves arranging and assembling components such as an inductance element (coil) 4 and a semiconductor element 5, and has the advantage that individual characteristics can also be determined by standards.

In addition, as shown in FIG. 5, some attempts have been made to improve productivity by forming the inductance element 4 directly on the printed circuit board 1 by etching or printing a conductor. Some of them are.

However, in these conventional examples, FIG.

In the method shown in FIG. 3, since the inductance element 4 is manufactured and assembled as a coil, a bobbin is required to determine the shape, and in the conventional example shown in FIG. When installing an inductance element (coil) 4 that does not have a I have a problem with the above.

In addition, in the conventional example shown in FIG. 5, when trying to obtain a desired inductance in a limited area, a phenomenon in which the Q of the inductance decreases occurs, and it is only possible to use an amplifier with a limited frequency range or characteristics. It has problems such as being unusable.

(Object of the Invention) The present invention eliminates such conventional drawbacks in printed wiring circuits for high frequency circuits, and provides an inductance with little variation in characteristics, high Q characteristics, simple configuration, and easy manufacture. The purpose is to form an element.

(Structure of the Invention) The present invention provides high-frequency printed wiring formed by forming electric circuit wiring on a flexible insulating substrate, and arranging and connecting circuit elements such as resistance elements, capacitance elements, semiconductor elements, and inductance elements. In the circuit, a part of the insulating substrate is used as an inductance forming part, a flexible conductor for forming the inductance is etched or printed from one end of the inductance forming part to the other end, and the flexible conductor is bent together with the insulating substrate, and each The present invention is characterized in that an inductance element using the insulating substrate as a bobbin is formed by connecting one end and the other end of the wired flexible conductor.

In other words, a high-frequency circuit system is placed on a flexible insulating substrate, a high-frequency inductance element (coil) is fixed in shape on the insulating substrate using a flexible conductor, and the entire insulating substrate is bent and separated between the conductors. This is an integrated printed wiring circuit for high-frequency circuits, which forms an inductance element by connecting the . Therefore, it is easy to achieve high performance.

(Description of Embodiments) A printed wiring circuit applied to a high frequency amplifier according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 6 shows a substrate of a high frequency amplifier on which the high frequency amplification circuit shown in FIG. 1 is formed. Each element uses a flexible insulating substrate 6 to attach the required electrical wiring pattern and the element.Here, the electrical circuit wiring pattern 7, the resistive element 8. A capacitive element 9, a semiconductor element 10, etc. are mounted. Some of the insulating substrates include
It has an inductance forming part 11.12, and four flexible bodies 7a for inductance elements are formed on the inductance forming part 11.12 from one end to the other end by etching or printing. The inductance forming portions 11.12 of the insulating substrate are provided with bent portions 13°, 14.15.16, and these bent portions are
As shown in FIG. 9 and FIG. 8, it is bent and one end is butted against the other end. Next, the abutted portions are joined by soldering 21, 22, etc. as shown in FIG. 9, and a part of the insulating substrate is An inductance element serving as a bobbin is formed.

FIG. 7 shows the state of the substrate when it is bent, and FIG. 8 shows a cross section.

In this way, the wiring of the necessary electric circuit elements,
The formation of inductance elements can also be created directly,
The entire high frequency circuit can be integrated. Also, errors in the inductance element can be avoided by using high-precision etching or printing means during the formation of the conductor.

Since the shape itself is fixed by the substrate shape, the number can be reduced, and inductance adjustment during production can be omitted.

(Effects of the Invention) The high-frequency printed wiring circuit of the present invention integrates each element forming a high-frequency amplification circuit and the like and electrical wiring, which are necessary for circuit operation. The inductance element is also formed directly on the substrate.

In addition, since variations in inductance values can be suppressed and copper foil or the like can be used as the conductor for the coil, there is an advantage that Q characteristics, which are particularly necessary for high frequency amplifiers, etc., can be obtained. In addition, during mass production, the entire circuit is a flexible printed wiring circuit for U production, making it suitable for mass production.
In addition, the adjustment process can be omitted, improving the quality of high-frequency printed circuits such as high-frequency amplifiers 1 Improving yield 1
It is very useful for improving work efficiency. In particular, according to the present invention, it is effective for the purpose of integrating the whole into a block in a place where a high frequency amplifier is used, such as a front end section for FM broadcast reception, etc. Even during production, it can be deployed as a shared block.

This is extremely advantageous in practice.

[Brief explanation of drawings]

Figure 1 shows an example of a high frequency amplifier circuit, Figures 2, 3, and 4.
The figure is a perspective view of a printed circuit board on which each element of the conventional example is mounted, FIG. 5 is a plan view showing a conventional interface element formed directly with the conductor of the printed circuit board, and FIG. FIG. 7 is a plan view showing the shape of a flexible insulating board and the state in which each element is mounted according to the embodiment. FIG. 7 is a plan view showing the state when the board according to the embodiment of the present invention is bent. FIG. 8 is a cross-sectional view thereof. , FIG. 9 is an enlarged plan view of a portion of an inductance element for a high frequency amplifier according to an embodiment of the present invention. 6...Flexible insulating substrate, 7...Electrical wiring pattern, 7a...Flexible conductor for inductance element, 8...Resistance wire, 9...Capacitive element, 10...Semi-quadram element . Patent applicant: Matsushita Electric Industrial Co., Ltd.

Claims (1)

[Claims] Electric circuit wiring is formed on a flexible insulating substrate,
In a high-frequency printed wiring circuit in which circuit elements such as resistive elements, capacitive elements, semiconductor elements, inductance elements, etc. are arranged and connected, a part of the insulating substrate is used as an inductance forming part, and one end of the inductance forming part is connected to the other. The flexible insulation is formed by etching or wiring-printing a flexible conductor for forming an inductance up to the end, bending the flexible conductor together with an insulating substrate, and connecting one end and the other end of each wired flexible conductor. A high frequency printed wiring circuit characterized in that an inductance element is formed on a substrate as a bobbin.