JPS6469094A - Pattern forming method - Google Patents

Pattern forming method

Info

Publication number
JPS6469094A
JPS6469094A JP22726887A JP22726887A JPS6469094A JP S6469094 A JPS6469094 A JP S6469094A JP 22726887 A JP22726887 A JP 22726887A JP 22726887 A JP22726887 A JP 22726887A JP S6469094 A JPS6469094 A JP S6469094A
Authority
JP
Japan
Prior art keywords
copper
layer
film
metal film
thin copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22726887A
Other languages
Japanese (ja)
Inventor
Koji Kato
Ryoji Koshio
Toshio Yamadera
Yoshiharu Numata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Priority to JP22726887A priority Critical patent/JPS6469094A/en
Publication of JPS6469094A publication Critical patent/JPS6469094A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To realize a simple and sure process for preventing side etching by using a metal film except copper, by forming a catalyst layer on the surface of a thin copper plate or a thin copper film formed on a base, forming a conductor pattern of copper layer, and forming a metal film except copper on the catalyst layer by chemical plating. CONSTITUTION:Catalyst for chemical plating is attached to a thin copper plate or a thin copper film 12 formed on the base 10, and a catalyst layer 16 is formed. Thereon, the pattern of a resist layer 20 composed of dry film or resist ink is formed. By plating, the conductor pattern of a copper layer 24 is formed on a part except the part coated with the resist layer 20. After the resist layer 20 is eliminated, and a chemically plated metal film 22 except copper is formed on the catalyst layer surface under the resist layer 20, a protective film 26 of organic material having affinity for copper and resistance to etching is formed on the copper layer surface. The metal film 22 on which the protective film 26 is not formed, and the thin copper plate or the thin copper film 12 under the metal film are subjected to etching process by etching liquid, and a conductor pattern is formed on the base 10.
JP22726887A 1987-09-10 1987-09-10 Pattern forming method Pending JPS6469094A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22726887A JPS6469094A (en) 1987-09-10 1987-09-10 Pattern forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22726887A JPS6469094A (en) 1987-09-10 1987-09-10 Pattern forming method

Publications (1)

Publication Number Publication Date
JPS6469094A true JPS6469094A (en) 1989-03-15

Family

ID=16858159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22726887A Pending JPS6469094A (en) 1987-09-10 1987-09-10 Pattern forming method

Country Status (1)

Country Link
JP (1) JPS6469094A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8316518B2 (en) * 2008-09-18 2012-11-27 Visualsonics Inc. Methods for manufacturing ultrasound transducers and other components
US10596597B2 (en) 2008-09-18 2020-03-24 Fujifilm Sonosite, Inc. Methods for manufacturing ultrasound transducers and other components
US11094875B2 (en) 2008-09-18 2021-08-17 Fujifilm Sonosite, Inc. Methods for manufacturing ultrasound transducers and other components

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8316518B2 (en) * 2008-09-18 2012-11-27 Visualsonics Inc. Methods for manufacturing ultrasound transducers and other components
US10596597B2 (en) 2008-09-18 2020-03-24 Fujifilm Sonosite, Inc. Methods for manufacturing ultrasound transducers and other components
US11094875B2 (en) 2008-09-18 2021-08-17 Fujifilm Sonosite, Inc. Methods for manufacturing ultrasound transducers and other components

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