JPS6469093A - Pattern forming method - Google Patents

Pattern forming method

Info

Publication number
JPS6469093A
JPS6469093A JP22726787A JP22726787A JPS6469093A JP S6469093 A JPS6469093 A JP S6469093A JP 22726787 A JP22726787 A JP 22726787A JP 22726787 A JP22726787 A JP 22726787A JP S6469093 A JPS6469093 A JP S6469093A
Authority
JP
Japan
Prior art keywords
layer
zinc layer
film
thin copper
zinc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22726787A
Other languages
Japanese (ja)
Inventor
Koji Kato
Ryoji Koshio
Toshio Yamadera
Yoshiharu Numata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Priority to JP22726787A priority Critical patent/JPS6469093A/en
Publication of JPS6469093A publication Critical patent/JPS6469093A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Abstract

PURPOSE:To surely prevent the side etching by using a zinc layer, by forming the zinc layer on the surface of a thin copper plate or a thin copper film formed on a base, and covering the zinc layer with a corrosion-resistant film. CONSTITUTION:On the surface of a thin copper plate or a thin copper film 12, a zinc layer 18 is formed, on which the pattern of a resist layer 20 composed of dry film or resist ink is formed. After the zinc layer 18 except the part coated with the resist layer 20 is eliminated, the conductor pattern of a copper layer 24 is formed by plating on the surface where the zinc layer is eliminated. By eliminating the resist layer 20, the zinc layer 18 under the resist layer is exposed, and a corrosion-resistant film 22 is formed on the exposed zinc layer surface. A protective film 20, which is made of organic material having affinity for copper and resistance to side-etching, is formed on the copper layer surface. The zinc layer 18 on which the protective film 20 is not formed, and the thin copper plate or the thin copper film 12 under the zinc layer are subjected to etching process by etching liquid, and a conductor pattern is formed on the base.
JP22726787A 1987-09-10 1987-09-10 Pattern forming method Pending JPS6469093A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22726787A JPS6469093A (en) 1987-09-10 1987-09-10 Pattern forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22726787A JPS6469093A (en) 1987-09-10 1987-09-10 Pattern forming method

Publications (1)

Publication Number Publication Date
JPS6469093A true JPS6469093A (en) 1989-03-15

Family

ID=16858143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22726787A Pending JPS6469093A (en) 1987-09-10 1987-09-10 Pattern forming method

Country Status (1)

Country Link
JP (1) JPS6469093A (en)

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