GB1040410A - Improvements in electrolytes for electroplating - Google Patents

Improvements in electrolytes for electroplating

Info

Publication number
GB1040410A
GB1040410A GB25661/65A GB2566165A GB1040410A GB 1040410 A GB1040410 A GB 1040410A GB 25661/65 A GB25661/65 A GB 25661/65A GB 2566165 A GB2566165 A GB 2566165A GB 1040410 A GB1040410 A GB 1040410A
Authority
GB
United Kingdom
Prior art keywords
palladium
salt
complexing agent
mols per
buffer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB25661/65A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1040410A publication Critical patent/GB1040410A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

A palladium plating bath includes a palladium salt, a complexing agent, and a buffer salt to bring the pH into the range 4 to 5.5 e.g. ammonium chloride or an acid phosphate. The complexing agent is preferably disodium E.D.T.A. Specified concentrations are of palladium salt .01 to .121 mols per litre, complexing agent 2 mols per mol. of palladium salt, of buffer agent .04 mols per litre up to saturation. Base metals include Cu, Ni or Ag and alloys thereof e.g. beryllium copper. Palladium salts specified are chloride, sulphate, acetate, and nitrate. The palladium plated base is adapted for subsequent plating with Ni/Fe alloy as magnetic layer.
GB25661/65A 1964-06-30 1965-06-17 Improvements in electrolytes for electroplating Expired GB1040410A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CA791112T
US379395A US3376206A (en) 1964-06-30 1964-06-30 Electrolyte for the electrodeposition of palladium

Publications (1)

Publication Number Publication Date
GB1040410A true GB1040410A (en) 1966-08-24

Family

ID=73264269

Family Applications (1)

Application Number Title Priority Date Filing Date
GB25661/65A Expired GB1040410A (en) 1964-06-30 1965-06-17 Improvements in electrolytes for electroplating

Country Status (4)

Country Link
US (1) US3376206A (en)
CA (1) CA791112A (en)
DE (1) DE1496842A1 (en)
GB (1) GB1040410A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1035850A (en) * 1964-06-12 1966-07-13 Johnson Matthey Co Ltd Improvements in and relating to the electrodeposition of palladium
DE2657925A1 (en) * 1976-12-21 1978-06-22 Siemens Ag AMMONIA-FREE, AQUATIC BATH FOR GALVANIC DEPOSITION OF PALLADIUM OR. PALLADIUM ALLOYS
SE523309E (en) * 2001-06-15 2010-03-02 Replisaurus Technologies Ab Method, electrode and apparatus for creating micro- and nanostructures in conductive materials by patterning with master electrode and electrolyte
US7507320B2 (en) * 2004-10-09 2009-03-24 Academia Sinica Single-atom tip and preparation method thereof
CN102168291B (en) * 2011-03-16 2013-05-01 上海中子星化工科技有限公司 Palladium plating solution

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB958685A (en) * 1960-10-11 1964-05-21 Automatic Telephone & Elect Improvements in or relating to palladium plating
US3290234A (en) * 1963-10-29 1966-12-06 Technic Electrodeposition of palladium

Also Published As

Publication number Publication date
DE1496842A1 (en) 1969-08-14
US3376206A (en) 1968-04-02
CA791112A (en) 1968-07-30

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