ES395741A1 - Acid galvanic copper bath - Google Patents

Acid galvanic copper bath

Info

Publication number
ES395741A1
ES395741A1 ES71395741A ES395741A ES395741A1 ES 395741 A1 ES395741 A1 ES 395741A1 ES 71395741 A ES71395741 A ES 71395741A ES 395741 A ES395741 A ES 395741A ES 395741 A1 ES395741 A1 ES 395741A1
Authority
ES
Spain
Prior art keywords
copper bath
galvanic copper
acid galvanic
acid
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES71395741A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of ES395741A1 publication Critical patent/ES395741A1/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Conductive Materials (AREA)

Abstract

Acid aqueous electrolytes for the deposition of bright, low-tension, ductile copper coatings containing organo selenium compounds are used.
ES71395741A 1970-10-29 1971-10-05 Acid galvanic copper bath Expired ES395741A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2053860A DE2053860C3 (en) 1970-10-29 1970-10-29 Acid aqueous bath for the galvanic deposition of shiny copper coatings

Publications (1)

Publication Number Publication Date
ES395741A1 true ES395741A1 (en) 1974-09-16

Family

ID=5786940

Family Applications (1)

Application Number Title Priority Date Filing Date
ES71395741A Expired ES395741A1 (en) 1970-10-29 1971-10-05 Acid galvanic copper bath

Country Status (18)

Country Link
US (1) US3767539A (en)
JP (1) JPS5126893B1 (en)
AT (1) AT307844B (en)
AU (1) AU450638B2 (en)
BE (1) BE774697A (en)
BR (1) BR7107116D0 (en)
CA (1) CA967110A (en)
CH (1) CH563466A5 (en)
DE (1) DE2053860C3 (en)
ES (1) ES395741A1 (en)
FR (1) FR2111926B1 (en)
GB (1) GB1372850A (en)
IE (1) IE35774B1 (en)
NL (1) NL169353C (en)
SE (1) SE364737B (en)
SU (1) SU452107A3 (en)
YU (1) YU34721B (en)
ZA (1) ZA716879B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4417956A (en) * 1980-07-17 1983-11-29 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4540473A (en) * 1983-11-22 1985-09-10 International Business Machines Corporation Copper plating bath having increased plating rate, and method
US6024857A (en) * 1997-10-08 2000-02-15 Novellus Systems, Inc. Electroplating additive for filling sub-micron features
KR100659544B1 (en) * 1999-11-12 2006-12-19 에바라 유지라이토 코포레이션 리미티드 Via-filling process
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE322956B (en) * 1966-08-20 1970-04-20 Schering Ag
US3492135A (en) * 1967-02-01 1970-01-27 Schering Ag Stabilized bath for deposition of copper by chemical reduction
BE759316A (en) * 1969-12-30 1971-04-30 Parker Ste Continentale COMPOSITION AND METHOD FOR FORMING A COPPER DEPOSIT ON FERROUS METAL SURFACES

Also Published As

Publication number Publication date
CH563466A5 (en) 1975-06-30
YU250971A (en) 1979-04-30
CA967110A (en) 1975-05-06
NL169353C (en) 1982-07-01
IE35774L (en) 1972-04-29
IE35774B1 (en) 1976-05-12
DE2053860B2 (en) 1980-03-13
SE364737B (en) 1974-03-04
DE2053860A1 (en) 1972-06-08
AU450638B2 (en) 1974-07-18
NL169353B (en) 1982-02-01
GB1372850A (en) 1974-11-06
AT307844B (en) 1973-06-12
BR7107116D0 (en) 1973-03-29
YU34721B (en) 1979-12-31
AU3473471A (en) 1973-05-03
FR2111926A1 (en) 1972-06-09
JPS5126893B1 (en) 1976-08-09
ZA716879B (en) 1972-06-28
US3767539A (en) 1973-10-23
BE774697A (en) 1972-05-02
NL7114979A (en) 1972-05-03
DE2053860C3 (en) 1980-11-06
FR2111926B1 (en) 1974-10-11
SU452107A3 (en) 1974-11-30

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