ZA715792B - Method for preventing high-temperature blisterning of copper coatings electro-deposited on copper substrates - Google Patents

Method for preventing high-temperature blisterning of copper coatings electro-deposited on copper substrates

Info

Publication number
ZA715792B
ZA715792B ZA715792A ZA715792A ZA715792B ZA 715792 B ZA715792 B ZA 715792B ZA 715792 A ZA715792 A ZA 715792A ZA 715792 A ZA715792 A ZA 715792A ZA 715792 B ZA715792 B ZA 715792B
Authority
ZA
South Africa
Prior art keywords
copper
blisterning
electro
deposited
temperature
Prior art date
Application number
ZA715792A
Inventor
C Hamilton
E Oles
Original Assignee
Uss Eng & Consult
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uss Eng & Consult filed Critical Uss Eng & Consult
Publication of ZA715792B publication Critical patent/ZA715792B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22C—FOUNDRY MOULDING
    • B22C23/00—Tools; Devices not mentioned before for moulding
    • B22C23/02—Devices for coating moulds or cores
ZA715792A 1970-09-11 1971-08-30 Method for preventing high-temperature blisterning of copper coatings electro-deposited on copper substrates ZA715792B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7155970A 1970-09-11 1970-09-11

Publications (1)

Publication Number Publication Date
ZA715792B true ZA715792B (en) 1972-04-26

Family

ID=22102108

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA715792A ZA715792B (en) 1970-09-11 1971-08-30 Method for preventing high-temperature blisterning of copper coatings electro-deposited on copper substrates

Country Status (12)

Country Link
US (1) US3671407A (en)
JP (1) JPS5625519B1 (en)
BE (1) BE772249A (en)
BR (1) BR7105954D0 (en)
CA (1) CA999554A (en)
DE (1) DE2144280C3 (en)
ES (1) ES394896A1 (en)
FR (1) FR2106446B1 (en)
GB (1) GB1369507A (en)
IT (1) IT939804B (en)
NL (1) NL7112504A (en)
ZA (1) ZA715792B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4552627A (en) * 1984-11-13 1985-11-12 Olin Corporation Preparation for improving the adhesion properties of metal foils
EP0342669B1 (en) * 1988-05-20 1995-08-23 Mitsubishi Gas Chemical Company, Inc. Method for preparing thin copper foil-clad substrate for circuit boards
DE202009013126U1 (en) 2009-09-29 2009-12-10 Egon Evertz Kg (Gmbh & Co.) Mold for continuous casting

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2461228A (en) * 1949-02-08 Donald lee miles
US1918159A (en) * 1932-01-19 1933-07-11 Weisberg & Greenwald Inc Electrodeposition
US1995200A (en) * 1932-08-30 1935-03-19 Union Switch & Signal Co Manufacture of photo-electric cells
DE715515C (en) * 1940-04-27 1942-01-03 Richard Beck Process for anodic pretreatment previously degreased metal surfaces in the usual way
US3202589A (en) * 1963-09-12 1965-08-24 Diamond Alkali Co Electroplating

Also Published As

Publication number Publication date
DE2144280B2 (en) 1980-04-10
ES394896A1 (en) 1974-12-01
IT939804B (en) 1973-02-10
NL7112504A (en) 1972-03-14
DE2144280C3 (en) 1982-05-27
FR2106446B1 (en) 1975-07-11
AU3301871A (en) 1973-03-08
DE2144280A1 (en) 1972-03-16
JPS5625519B1 (en) 1981-06-12
CA999554A (en) 1976-11-09
BR7105954D0 (en) 1973-04-05
US3671407A (en) 1972-06-20
GB1369507A (en) 1974-10-09
BE772249A (en) 1972-03-06
FR2106446A1 (en) 1972-05-05

Similar Documents

Publication Publication Date Title
CA923068A (en) Method and apparatus for electroplating
CA922270A (en) Apparatus for electroplating workpieces
CA898183A (en) Method of plating copper on aluminum
ZA708430B (en) Electrodeposition of copper from acidic baths
ZA715792B (en) Method for preventing high-temperature blisterning of copper coatings electro-deposited on copper substrates
CA966044A (en) Bath and method for etching aluminum
CA970324A (en) Process for metal plating of substrates
CA933882A (en) Apparatus for electroplating
CA982080A (en) Plating metal onto small flexibly based conductors
YU250971A (en) Process for low-lustre ductile copper coatings
AU454881B2 (en) Method for preventing high-temperature blistering of copper coatings electro-deposited on copper substrates
CA1001110A (en) Method and apparatus for electroplating metal articles
ZA711017B (en) Process for preparing insulating substrates
AU2431471A (en) Apparatus for electroplating metals
AU451896B2 (en) Electrodeposition of copper from acidic baths
AU2434971A (en) Electrodeposition of copper from acidic baths
AU446847B2 (en) Method of plating copper of aluminum
HU171455B (en) Apparat for local electrolytic coating
EG10672A (en) Pickling bath for aluminium
CA941171A (en) Method of recovering copper from slag
CS184314B2 (en) Bath for electroplating
CA847872A (en) Electrodeposition of copper
AU2795671A (en) Method of plating copper of aluminum
AU442051B2 (en) Plating method utilizing silver-coated anode leads
CA852717A (en) Electrolytic removal of electroplating from ferrous base