GB1369507A - Method for preventing high temperature blistering of copper coatings electro-deposited on copper substrates - Google Patents

Method for preventing high temperature blistering of copper coatings electro-deposited on copper substrates

Info

Publication number
GB1369507A
GB1369507A GB4173271A GB4173271A GB1369507A GB 1369507 A GB1369507 A GB 1369507A GB 4173271 A GB4173271 A GB 4173271A GB 4173271 A GB4173271 A GB 4173271A GB 1369507 A GB1369507 A GB 1369507A
Authority
GB
United Kingdom
Prior art keywords
copper
electro
deposited
high temperature
preventing high
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4173271A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
USS Engineers and Consultants Inc
Original Assignee
USS Engineers and Consultants Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USS Engineers and Consultants Inc filed Critical USS Engineers and Consultants Inc
Publication of GB1369507A publication Critical patent/GB1369507A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22C—FOUNDRY MOULDING
    • B22C23/00—Tools; Devices not mentioned before for moulding
    • B22C23/02—Devices for coating moulds or cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)

Abstract

1369507 Treating moulds USS ENG & CONSULTANTS Inc 7 Sept 1971 [11 Sept 1970] 41732/71 Heading B3F [Also in Division C7] -Copper moulds are reconditioned by dissolving the surface thereof, e.g. by anodie dissolution, to a depth sufficient to decrease the surface oxygen content to a level approaching that of the copper base metal, and thereafter electroplating with copper.
GB4173271A 1970-09-11 1971-09-07 Method for preventing high temperature blistering of copper coatings electro-deposited on copper substrates Expired GB1369507A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7155970A 1970-09-11 1970-09-11

Publications (1)

Publication Number Publication Date
GB1369507A true GB1369507A (en) 1974-10-09

Family

ID=22102108

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4173271A Expired GB1369507A (en) 1970-09-11 1971-09-07 Method for preventing high temperature blistering of copper coatings electro-deposited on copper substrates

Country Status (12)

Country Link
US (1) US3671407A (en)
JP (1) JPS5625519B1 (en)
BE (1) BE772249A (en)
BR (1) BR7105954D0 (en)
CA (1) CA999554A (en)
DE (1) DE2144280C3 (en)
ES (1) ES394896A1 (en)
FR (1) FR2106446B1 (en)
GB (1) GB1369507A (en)
IT (1) IT939804B (en)
NL (1) NL7112504A (en)
ZA (1) ZA715792B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4552627A (en) * 1984-11-13 1985-11-12 Olin Corporation Preparation for improving the adhesion properties of metal foils
EP0342669B1 (en) * 1988-05-20 1995-08-23 Mitsubishi Gas Chemical Company, Inc. Method for preparing thin copper foil-clad substrate for circuit boards
DE202009013126U1 (en) * 2009-09-29 2009-12-10 Egon Evertz Kg (Gmbh & Co.) Mold for continuous casting

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2461228A (en) * 1949-02-08 Donald lee miles
US1918159A (en) * 1932-01-19 1933-07-11 Weisberg & Greenwald Inc Electrodeposition
US1995200A (en) * 1932-08-30 1935-03-19 Union Switch & Signal Co Manufacture of photo-electric cells
DE715515C (en) * 1940-04-27 1942-01-03 Richard Beck Process for anodic pretreatment previously degreased metal surfaces in the usual way
US3202589A (en) * 1963-09-12 1965-08-24 Diamond Alkali Co Electroplating

Also Published As

Publication number Publication date
CA999554A (en) 1976-11-09
JPS5625519B1 (en) 1981-06-12
IT939804B (en) 1973-02-10
BE772249A (en) 1972-03-06
US3671407A (en) 1972-06-20
FR2106446A1 (en) 1972-05-05
BR7105954D0 (en) 1973-04-05
ZA715792B (en) 1972-04-26
DE2144280A1 (en) 1972-03-16
DE2144280B2 (en) 1980-04-10
NL7112504A (en) 1972-03-14
AU3301871A (en) 1973-03-08
DE2144280C3 (en) 1982-05-27
FR2106446B1 (en) 1975-07-11
ES394896A1 (en) 1974-12-01

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee