AU3301871A - Method for preventing high-temperature blistering of copper coatings electro-deposited on copper substrates - Google Patents

Method for preventing high-temperature blistering of copper coatings electro-deposited on copper substrates

Info

Publication number
AU3301871A
AU3301871A AU33018/71A AU3301871A AU3301871A AU 3301871 A AU3301871 A AU 3301871A AU 33018/71 A AU33018/71 A AU 33018/71A AU 3301871 A AU3301871 A AU 3301871A AU 3301871 A AU3301871 A AU 3301871A
Authority
AU
Australia
Prior art keywords
copper
electro
deposited
preventing high
coatings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU33018/71A
Other versions
AU454881B2 (en
Inventor
and EDWARD JOHN COLES Jnr COLIN BARR HAMILTON
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
USS Engineers and Consultants Inc
Original Assignee
USS Engineers and Consultants Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USS Engineers and Consultants Inc filed Critical USS Engineers and Consultants Inc
Application granted granted Critical
Publication of AU454881B2 publication Critical patent/AU454881B2/en
Publication of AU3301871A publication Critical patent/AU3301871A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22C—FOUNDRY MOULDING
    • B22C23/00—Tools; Devices not mentioned before for moulding
    • B22C23/02—Devices for coating moulds or cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
AU33018/71A 1970-09-11 1971-09-02 Method for preventing high-temperature blistering of copper coatings electro-deposited on copper substrates Expired AU454881B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US7155970A 1970-09-11 1970-09-11
USUS71559 1970-09-11

Publications (2)

Publication Number Publication Date
AU454881B2 AU454881B2 (en) 1973-03-08
AU3301871A true AU3301871A (en) 1973-03-08

Family

ID=

Also Published As

Publication number Publication date
CA999554A (en) 1976-11-09
JPS5625519B1 (en) 1981-06-12
IT939804B (en) 1973-02-10
BE772249A (en) 1972-03-06
US3671407A (en) 1972-06-20
FR2106446A1 (en) 1972-05-05
BR7105954D0 (en) 1973-04-05
ZA715792B (en) 1972-04-26
DE2144280A1 (en) 1972-03-16
DE2144280B2 (en) 1980-04-10
NL7112504A (en) 1972-03-14
DE2144280C3 (en) 1982-05-27
FR2106446B1 (en) 1975-07-11
ES394896A1 (en) 1974-12-01
GB1369507A (en) 1974-10-09

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