ES394896A1 - Method for preventing high-temperature blistering of copper coatings electro-deposited on copper substrates - Google Patents

Method for preventing high-temperature blistering of copper coatings electro-deposited on copper substrates

Info

Publication number
ES394896A1
ES394896A1 ES394896A ES394896A ES394896A1 ES 394896 A1 ES394896 A1 ES 394896A1 ES 394896 A ES394896 A ES 394896A ES 394896 A ES394896 A ES 394896A ES 394896 A1 ES394896 A1 ES 394896A1
Authority
ES
Spain
Prior art keywords
copper
electro
deposited
coatings
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES394896A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
USS Engineers and Consultants Inc
Original Assignee
USS Engineers and Consultants Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USS Engineers and Consultants Inc filed Critical USS Engineers and Consultants Inc
Publication of ES394896A1 publication Critical patent/ES394896A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22C—FOUNDRY MOULDING
    • B22C23/00—Tools; Devices not mentioned before for moulding
    • B22C23/02—Devices for coating moulds or cores

Abstract

A method for preparing the surface of copper substrates by anodically dissolving the surface, for a time and depth sufficient to substantially decrease higher local oxygen content of the surface and thereby improve the adhesion of electrodeposited copper coatings. More specifically, the surface pretreatment provides a base for an electrodeposited copper coating with enhanced resistance to blistering and peeling at temperatures in excess of 700 DEG F.
ES394896A 1970-09-11 1971-09-08 Method for preventing high-temperature blistering of copper coatings electro-deposited on copper substrates Expired ES394896A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7155970A 1970-09-11 1970-09-11

Publications (1)

Publication Number Publication Date
ES394896A1 true ES394896A1 (en) 1974-12-01

Family

ID=22102108

Family Applications (1)

Application Number Title Priority Date Filing Date
ES394896A Expired ES394896A1 (en) 1970-09-11 1971-09-08 Method for preventing high-temperature blistering of copper coatings electro-deposited on copper substrates

Country Status (12)

Country Link
US (1) US3671407A (en)
JP (1) JPS5625519B1 (en)
BE (1) BE772249A (en)
BR (1) BR7105954D0 (en)
CA (1) CA999554A (en)
DE (1) DE2144280C3 (en)
ES (1) ES394896A1 (en)
FR (1) FR2106446B1 (en)
GB (1) GB1369507A (en)
IT (1) IT939804B (en)
NL (1) NL7112504A (en)
ZA (1) ZA715792B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4552627A (en) * 1984-11-13 1985-11-12 Olin Corporation Preparation for improving the adhesion properties of metal foils
EP0342669B1 (en) * 1988-05-20 1995-08-23 Mitsubishi Gas Chemical Company, Inc. Method for preparing thin copper foil-clad substrate for circuit boards
DE202009013126U1 (en) * 2009-09-29 2009-12-10 Egon Evertz Kg (Gmbh & Co.) Mold for continuous casting

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2461228A (en) * 1949-02-08 Donald lee miles
US1918159A (en) * 1932-01-19 1933-07-11 Weisberg & Greenwald Inc Electrodeposition
US1995200A (en) * 1932-08-30 1935-03-19 Union Switch & Signal Co Manufacture of photo-electric cells
DE715515C (en) * 1940-04-27 1942-01-03 Richard Beck Process for anodic pretreatment previously degreased metal surfaces in the usual way
US3202589A (en) * 1963-09-12 1965-08-24 Diamond Alkali Co Electroplating

Also Published As

Publication number Publication date
DE2144280A1 (en) 1972-03-16
US3671407A (en) 1972-06-20
AU3301871A (en) 1973-03-08
ZA715792B (en) 1972-04-26
JPS5625519B1 (en) 1981-06-12
DE2144280B2 (en) 1980-04-10
FR2106446A1 (en) 1972-05-05
FR2106446B1 (en) 1975-07-11
BR7105954D0 (en) 1973-04-05
DE2144280C3 (en) 1982-05-27
BE772249A (en) 1972-03-06
NL7112504A (en) 1972-03-14
CA999554A (en) 1976-11-09
IT939804B (en) 1973-02-10
GB1369507A (en) 1974-10-09

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