NL7114979A - - Google Patents
Info
- Publication number
- NL7114979A NL7114979A NL7114979A NL7114979A NL7114979A NL 7114979 A NL7114979 A NL 7114979A NL 7114979 A NL7114979 A NL 7114979A NL 7114979 A NL7114979 A NL 7114979A NL 7114979 A NL7114979 A NL 7114979A
- Authority
- NL
- Netherlands
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2053860A DE2053860C3 (en) | 1970-10-29 | 1970-10-29 | Acid aqueous bath for the galvanic deposition of shiny copper coatings |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NL7114979A true NL7114979A (en) | 1972-05-03 |
| NL169353B NL169353B (en) | 1982-02-01 |
| NL169353C NL169353C (en) | 1982-07-01 |
Family
ID=5786940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NLAANVRAGE7114979,A NL169353C (en) | 1970-10-29 | 1971-10-29 | METHOD FOR ELECTROLYTIC COPPERING |
Country Status (18)
| Country | Link |
|---|---|
| US (1) | US3767539A (en) |
| JP (1) | JPS5126893B1 (en) |
| AT (1) | AT307844B (en) |
| AU (1) | AU450638B2 (en) |
| BE (1) | BE774697A (en) |
| BR (1) | BR7107116D0 (en) |
| CA (1) | CA967110A (en) |
| CH (1) | CH563466A5 (en) |
| DE (1) | DE2053860C3 (en) |
| ES (1) | ES395741A1 (en) |
| FR (1) | FR2111926B1 (en) |
| GB (1) | GB1372850A (en) |
| IE (1) | IE35774B1 (en) |
| NL (1) | NL169353C (en) |
| SE (1) | SE364737B (en) |
| SU (1) | SU452107A3 (en) |
| YU (1) | YU34721B (en) |
| ZA (1) | ZA716879B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4540473A (en) * | 1983-11-22 | 1985-09-10 | International Business Machines Corporation | Copper plating bath having increased plating rate, and method |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4417956A (en) * | 1980-07-17 | 1983-11-29 | Electrochemical Products, Inc. | Alkaline plating baths and electroplating process |
| US6024857A (en) | 1997-10-08 | 2000-02-15 | Novellus Systems, Inc. | Electroplating additive for filling sub-micron features |
| KR100659544B1 (en) * | 1999-11-12 | 2006-12-19 | 에바라 유지라이토 코포레이션 리미티드 | Via-filling process |
| US6676823B1 (en) * | 2002-03-18 | 2004-01-13 | Taskem, Inc. | High speed acid copper plating |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE322956B (en) * | 1966-08-20 | 1970-04-20 | Schering Ag | |
| US3492135A (en) * | 1967-02-01 | 1970-01-27 | Schering Ag | Stabilized bath for deposition of copper by chemical reduction |
| BE759316A (en) * | 1969-12-30 | 1971-04-30 | Parker Ste Continentale | COMPOSITION AND METHOD FOR FORMING A COPPER DEPOSIT ON FERROUS METAL SURFACES |
-
1970
- 1970-10-29 DE DE2053860A patent/DE2053860C3/en not_active Expired
-
1971
- 1971-10-04 YU YU2509/71A patent/YU34721B/en unknown
- 1971-10-04 US US00186548A patent/US3767539A/en not_active Expired - Lifetime
- 1971-10-05 ES ES71395741A patent/ES395741A1/en not_active Expired
- 1971-10-11 SU SU1704167A patent/SU452107A3/en active
- 1971-10-14 ZA ZA716879A patent/ZA716879B/en unknown
- 1971-10-18 CH CH1519671A patent/CH563466A5/xx not_active IP Right Cessation
- 1971-10-19 AU AU34734/71A patent/AU450638B2/en not_active Expired
- 1971-10-21 AT AT912871A patent/AT307844B/en not_active IP Right Cessation
- 1971-10-21 SE SE13374/71A patent/SE364737B/xx unknown
- 1971-10-25 GB GB4938671A patent/GB1372850A/en not_active Expired
- 1971-10-25 BR BR7116/71A patent/BR7107116D0/en unknown
- 1971-10-26 IE IE1352/71A patent/IE35774B1/en unknown
- 1971-10-29 BE BE774697A patent/BE774697A/en unknown
- 1971-10-29 FR FR7138993A patent/FR2111926B1/fr not_active Expired
- 1971-10-29 CA CA126,465A patent/CA967110A/en not_active Expired
- 1971-10-29 NL NLAANVRAGE7114979,A patent/NL169353C/en not_active IP Right Cessation
- 1971-10-29 JP JP46086144A patent/JPS5126893B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4540473A (en) * | 1983-11-22 | 1985-09-10 | International Business Machines Corporation | Copper plating bath having increased plating rate, and method |
Also Published As
| Publication number | Publication date |
|---|---|
| AU3473471A (en) | 1973-05-03 |
| AU450638B2 (en) | 1974-07-18 |
| SU452107A3 (en) | 1974-11-30 |
| DE2053860A1 (en) | 1972-06-08 |
| CH563466A5 (en) | 1975-06-30 |
| US3767539A (en) | 1973-10-23 |
| AT307844B (en) | 1973-06-12 |
| YU250971A (en) | 1979-04-30 |
| DE2053860B2 (en) | 1980-03-13 |
| ZA716879B (en) | 1972-06-28 |
| SE364737B (en) | 1974-03-04 |
| FR2111926A1 (en) | 1972-06-09 |
| YU34721B (en) | 1979-12-31 |
| NL169353B (en) | 1982-02-01 |
| GB1372850A (en) | 1974-11-06 |
| DE2053860C3 (en) | 1980-11-06 |
| NL169353C (en) | 1982-07-01 |
| BR7107116D0 (en) | 1973-03-29 |
| IE35774B1 (en) | 1976-05-12 |
| CA967110A (en) | 1975-05-06 |
| IE35774L (en) | 1972-04-29 |
| JPS5126893B1 (en) | 1976-08-09 |
| BE774697A (en) | 1972-05-02 |
| FR2111926B1 (en) | 1974-10-11 |
| ES395741A1 (en) | 1974-09-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| V1 | Lapsed because of non-payment of the annual fee |