CH563466A5 - - Google Patents

Info

Publication number
CH563466A5
CH563466A5 CH1519671A CH1519671A CH563466A5 CH 563466 A5 CH563466 A5 CH 563466A5 CH 1519671 A CH1519671 A CH 1519671A CH 1519671 A CH1519671 A CH 1519671A CH 563466 A5 CH563466 A5 CH 563466A5
Authority
CH
Switzerland
Application number
CH1519671A
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of CH563466A5 publication Critical patent/CH563466A5/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
CH1519671A 1970-10-29 1971-10-18 CH563466A5 (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2053860A DE2053860C3 (de) 1970-10-29 1970-10-29 Saures wäßriges Bad zur galvanischen Abscheidung glänzender Kupferüberzüge

Publications (1)

Publication Number Publication Date
CH563466A5 true CH563466A5 (xx) 1975-06-30

Family

ID=5786940

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1519671A CH563466A5 (xx) 1970-10-29 1971-10-18

Country Status (18)

Country Link
US (1) US3767539A (xx)
JP (1) JPS5126893B1 (xx)
AT (1) AT307844B (xx)
AU (1) AU450638B2 (xx)
BE (1) BE774697A (xx)
BR (1) BR7107116D0 (xx)
CA (1) CA967110A (xx)
CH (1) CH563466A5 (xx)
DE (1) DE2053860C3 (xx)
ES (1) ES395741A1 (xx)
FR (1) FR2111926B1 (xx)
GB (1) GB1372850A (xx)
IE (1) IE35774B1 (xx)
NL (1) NL169353C (xx)
SE (1) SE364737B (xx)
SU (1) SU452107A3 (xx)
YU (1) YU34721B (xx)
ZA (1) ZA716879B (xx)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4417956A (en) * 1980-07-17 1983-11-29 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4540473A (en) * 1983-11-22 1985-09-10 International Business Machines Corporation Copper plating bath having increased plating rate, and method
US6024857A (en) 1997-10-08 2000-02-15 Novellus Systems, Inc. Electroplating additive for filling sub-micron features
KR100659544B1 (ko) * 1999-11-12 2006-12-19 에바라 유지라이토 코포레이션 리미티드 비아 필링 방법
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE322956B (xx) * 1966-08-20 1970-04-20 Schering Ag
US3492135A (en) * 1967-02-01 1970-01-27 Schering Ag Stabilized bath for deposition of copper by chemical reduction
BE759316A (fr) * 1969-12-30 1971-04-30 Parker Ste Continentale Composition et procede pour former un depot de cuivre sur des surfaces de metaux ferreux

Also Published As

Publication number Publication date
BR7107116D0 (pt) 1973-03-29
DE2053860A1 (de) 1972-06-08
FR2111926B1 (xx) 1974-10-11
NL169353B (nl) 1982-02-01
GB1372850A (en) 1974-11-06
JPS5126893B1 (xx) 1976-08-09
DE2053860B2 (de) 1980-03-13
CA967110A (en) 1975-05-06
SU452107A3 (ru) 1974-11-30
YU250971A (en) 1979-04-30
BE774697A (fr) 1972-05-02
AU3473471A (en) 1973-05-03
AT307844B (de) 1973-06-12
YU34721B (en) 1979-12-31
NL7114979A (xx) 1972-05-03
DE2053860C3 (de) 1980-11-06
NL169353C (nl) 1982-07-01
IE35774B1 (en) 1976-05-12
ES395741A1 (es) 1974-09-16
SE364737B (xx) 1974-03-04
AU450638B2 (en) 1974-07-18
US3767539A (en) 1973-10-23
FR2111926A1 (xx) 1972-06-09
ZA716879B (en) 1972-06-28
IE35774L (en) 1972-04-29

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Legal Events

Date Code Title Description
PL Patent ceased