AT302764B - Acid electrolyte for the deposition of shiny copper coatings - Google Patents

Acid electrolyte for the deposition of shiny copper coatings

Info

Publication number
AT302764B
AT302764B AT482371A AT482371A AT302764B AT 302764 B AT302764 B AT 302764B AT 482371 A AT482371 A AT 482371A AT 482371 A AT482371 A AT 482371A AT 302764 B AT302764 B AT 302764B
Authority
AT
Austria
Prior art keywords
deposition
acid electrolyte
copper coatings
shiny copper
shiny
Prior art date
Application number
AT482371A
Other languages
German (de)
Original Assignee
Schering Aktiengeselllschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Aktiengeselllschaft filed Critical Schering Aktiengeselllschaft
Application granted granted Critical
Publication of AT302764B publication Critical patent/AT302764B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D241/00Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings
    • C07D241/36Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings condensed with carbocyclic rings or ring systems
    • C07D241/38Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings condensed with carbocyclic rings or ring systems with only hydrogen or carbon atoms directly attached to the ring nitrogen atoms
    • C07D241/46Phenazines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0683Polycondensates containing six-membered rings, condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0694Polycondensates containing six-membered rings, condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring, e.g. polyquinoxalines

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Paints Or Removers (AREA)
  • Detergent Compositions (AREA)
AT482371A 1970-06-06 1971-06-03 Acid electrolyte for the deposition of shiny copper coatings AT302764B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2028803A DE2028803C3 (en) 1970-06-06 1970-06-06 Polymeric phenazonium compounds
DE2039831A DE2039831C3 (en) 1970-06-06 1970-06-06 Acid bath for the galvanic deposition of shiny copper coatings

Publications (1)

Publication Number Publication Date
AT302764B true AT302764B (en) 1972-10-25

Family

ID=25759264

Family Applications (1)

Application Number Title Priority Date Filing Date
AT482371A AT302764B (en) 1970-06-06 1971-06-03 Acid electrolyte for the deposition of shiny copper coatings

Country Status (8)

Country Link
US (1) US3743584A (en)
AT (1) AT302764B (en)
CA (1) CA961494A (en)
CH (1) CH556347A (en)
DE (2) DE2039831C3 (en)
FR (1) FR2095876A5 (en)
GB (1) GB1357442A (en)
NL (1) NL173277C (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50104143A (en) * 1974-01-23 1975-08-16
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
AU559896B2 (en) * 1983-06-10 1987-03-26 Omi International Corp. Electrolytic copper depositing processes
US4786746A (en) * 1987-09-18 1988-11-22 Pennsylvania Research Corporation Copper electroplating solutions and methods of making and using them
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
US5849171A (en) * 1990-10-13 1998-12-15 Atotech Deutschland Gmbh Acid bath for copper plating and process with the use of this combination
DE4032864A1 (en) * 1990-10-13 1992-04-16 Schering Ag ACIDIC BATH FOR THE GALVANIC DEPOSITION OF COPPER COVERS AND METHODS USING THIS COMBINATION
DE4126502C1 (en) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
DE19758121C2 (en) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Aqueous bath and method for electrolytic deposition of copper layers
US6444110B2 (en) * 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
DE10261852B3 (en) * 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
JP2004346381A (en) * 2003-05-23 2004-12-09 Hitachi Ltd Printed-circuit board, manufacturing method therefor, electrolytic copper-plating method and electrolytic copper-plating solution
DE10337669B4 (en) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Aqueous, acid solution and process for the electrodeposition of copper coatings and use of the solution
DE10354860B4 (en) 2003-11-19 2008-06-26 Atotech Deutschland Gmbh Halogenated or pseudohalogenated monomeric phenazinium compounds, process for their preparation and acid bath containing these compounds and process for the electrolytic deposition of a copper precipitate
DE102005011708B3 (en) 2005-03-11 2007-03-01 Atotech Deutschland Gmbh A polyvinylammonium compound and process for the production thereof, and an acidic solution containing the compound and a process for electrolytically depositing a copper precipitate
CN101899687A (en) * 2010-08-03 2010-12-01 济南德锡科技有限公司 Single dye type bright acidic copper plating additive and preparation method and application thereof
US8691987B2 (en) 2010-09-24 2014-04-08 Andrew M. Krol Method of producing polymeric phenazonium compounds
US8735580B2 (en) 2010-09-24 2014-05-27 Andrew M. Krol Method of producing polymeric phenazonium compounds
TWI533496B (en) * 2013-07-23 2016-05-11 Chang Chun Petrochemical Co Electrolytic copper foil
PT3483307T (en) 2017-11-09 2020-07-03 Atotech Deutschland Gmbh Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL174178B (en) * 1952-05-26 Chevron Res PROCEDURE FOR THE RECOVERY OF HYDROCARBONS FROM A PERMEABLE HYDROCARBON FORMATION BY INJECTION WITH STEAM.
NL83873C (en) * 1952-05-26
NL291575A (en) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
SE322956B (en) * 1966-08-20 1970-04-20 Schering Ag

Also Published As

Publication number Publication date
DE2039831C3 (en) 1979-09-06
DE2039831A1 (en) 1972-01-05
NL173277C (en) 1984-01-02
NL7107804A (en) 1971-12-08
US3743584A (en) 1973-07-03
DE2028803C3 (en) 1980-08-14
DE2028803B2 (en) 1979-11-29
FR2095876A5 (en) 1972-02-11
CH556347A (en) 1974-11-29
DE2039831B2 (en) 1979-01-04
GB1357442A (en) 1974-06-19
NL173277B (en) 1983-08-01
CA961494A (en) 1975-01-21
DE2028803A1 (en) 1971-12-16

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Legal Events

Date Code Title Description
ELA Expired due to lapse of time