AT304219B - Bath for the electroless deposition of metals - Google Patents

Bath for the electroless deposition of metals

Info

Publication number
AT304219B
AT304219B AT1035370A AT1035370A AT304219B AT 304219 B AT304219 B AT 304219B AT 1035370 A AT1035370 A AT 1035370A AT 1035370 A AT1035370 A AT 1035370A AT 304219 B AT304219 B AT 304219B
Authority
AT
Austria
Prior art keywords
bath
metals
electroless deposition
electroless
deposition
Prior art date
Application number
AT1035370A
Other languages
German (de)
Original Assignee
Kollmorgen Photocircuits
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Photocircuits filed Critical Kollmorgen Photocircuits
Application granted granted Critical
Publication of AT304219B publication Critical patent/AT304219B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • C23C18/44Coating with noble metals using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
AT1035370A 1969-11-20 1970-11-17 Bath for the electroless deposition of metals AT304219B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US87856569A 1969-11-20 1969-11-20

Publications (1)

Publication Number Publication Date
AT304219B true AT304219B (en) 1972-12-27

Family

ID=25372291

Family Applications (1)

Application Number Title Priority Date Filing Date
AT1035370A AT304219B (en) 1969-11-20 1970-11-17 Bath for the electroless deposition of metals

Country Status (10)

Country Link
JP (1) JPS503742B1 (en)
AT (1) AT304219B (en)
CA (1) CA925252A (en)
CH (1) CH564093A5 (en)
DE (1) DE2057757C3 (en)
DK (1) DK138185B (en)
FR (1) FR2069551A5 (en)
GB (1) GB1305468A (en)
NL (1) NL164905C (en)
SE (1) SE375334B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427848A (en) * 1977-07-29 1979-03-02 Kenji Sawayama Hanger for overcoat and undercoat
DE3148280A1 (en) * 1981-12-05 1983-06-09 Bayer Ag, 5090 Leverkusen METHOD FOR ACTIVATING SUBSTRATE SURFACES FOR ELECTRIC METALLIZATION
GB8703664D0 (en) * 1987-02-17 1987-03-25 Green A Electroless silver plating composition
DE4021681A1 (en) * 1989-07-12 1991-03-14 Kojima Chemicals Co Ltd NON-ELECTROLYTIC GOLD PLATTLER SOLUTION
WO1994008276A1 (en) * 1992-09-28 1994-04-14 Ducoa L.P. Photoresist stripping process using n,n-dimethyl-bis(2-hydroxyethyl) quaternary ammonium hydroxide
EP2978873B1 (en) * 2013-03-27 2016-12-28 ATOTECH Deutschland GmbH Electroless copper plating solution
CN115787003A (en) * 2022-12-10 2023-03-14 漳州市东龙电子科技有限公司 Trivalent chromium electroplating solution

Also Published As

Publication number Publication date
SE375334B (en) 1975-04-14
CA925252A (en) 1973-05-01
NL164905B (en) 1980-09-15
DK138185C (en) 1979-01-02
DE2057757A1 (en) 1971-06-24
FR2069551A5 (en) 1971-09-03
GB1305468A (en) 1973-01-31
NL164905C (en) 1981-02-16
CH564093A5 (en) 1975-07-15
DE2057757B2 (en) 1973-10-11
NL7016919A (en) 1971-05-24
DK138185B (en) 1978-07-24
DE2057757C3 (en) 1974-05-16
JPS503742B1 (en) 1975-02-08

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee