CH491206A - Bath solution for electroless deposition of metal layers - Google Patents

Bath solution for electroless deposition of metal layers

Info

Publication number
CH491206A
CH491206A CH108467A CH108467A CH491206A CH 491206 A CH491206 A CH 491206A CH 108467 A CH108467 A CH 108467A CH 108467 A CH108467 A CH 108467A CH 491206 A CH491206 A CH 491206A
Authority
CH
Switzerland
Prior art keywords
metal layers
electroless deposition
bath solution
bath
electroless
Prior art date
Application number
CH108467A
Other languages
German (de)
Inventor
William Schneble Frederick
Mccormack John
Zeblisky Rudolph
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of CH491206A publication Critical patent/CH491206A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CH108467A 1966-02-01 1967-01-25 Bath solution for electroless deposition of metal layers CH491206A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52389766A 1966-02-01 1966-02-01

Publications (1)

Publication Number Publication Date
CH491206A true CH491206A (en) 1970-05-31

Family

ID=24086884

Family Applications (1)

Application Number Title Priority Date Filing Date
CH108467A CH491206A (en) 1966-02-01 1967-01-25 Bath solution for electroless deposition of metal layers

Country Status (8)

Country Link
CH (1) CH491206A (en)
DE (1) DE1621307B2 (en)
DK (1) DK129661B (en)
ES (1) ES336273A1 (en)
FR (1) FR1509788A (en)
GB (1) GB1176051A (en)
NL (1) NL153604C (en)
SE (1) SE332327B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1135903A (en) * 1978-09-13 1982-11-23 John F. Mccormack Electroless copper deposition process having faster plating rates
DE102010012204B4 (en) * 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Improved process for direct metallization of non-conductive substrates

Also Published As

Publication number Publication date
NL153604C (en) 1980-05-16
ES336273A1 (en) 1967-12-16
DK129661C (en) 1975-04-01
DK129661B (en) 1974-11-04
FR1509788A (en) 1968-01-12
NL6701525A (en) 1967-08-02
SE332327B (en) 1971-02-01
NL153604B (en) 1977-06-15
DE1621307A1 (en) 1971-06-03
GB1176051A (en) 1970-01-01
DE1621307B2 (en) 1972-01-05

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Legal Events

Date Code Title Description
PL Patent ceased