ES336273A1 - Procedure for the deposition without current of metal layers. (Machine-translation by Google Translate, not legally binding) - Google Patents

Procedure for the deposition without current of metal layers. (Machine-translation by Google Translate, not legally binding)

Info

Publication number
ES336273A1
ES336273A1 ES0336273A ES336273A ES336273A1 ES 336273 A1 ES336273 A1 ES 336273A1 ES 0336273 A ES0336273 A ES 0336273A ES 336273 A ES336273 A ES 336273A ES 336273 A1 ES336273 A1 ES 336273A1
Authority
ES
Spain
Prior art keywords
translation
deposition
ions
machine
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0336273A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of ES336273A1 publication Critical patent/ES336273A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Process for the deposition without current of metallic layers, characterized in that for its realization a bath solution is used that contains the ions of the metal to be deposited, a reducing agent, a complex formed for the respective metal ions and a constituent to graduate the desired pH value, and because this solution is practically free of ions whose oxidation potential is greater than that of the ions of the metal to be deposited, in particular free of iron ions. (Machine-translation by Google Translate, not legally binding)
ES0336273A 1966-02-01 1967-01-31 Procedure for the deposition without current of metal layers. (Machine-translation by Google Translate, not legally binding) Expired ES336273A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52389766A 1966-02-01 1966-02-01

Publications (1)

Publication Number Publication Date
ES336273A1 true ES336273A1 (en) 1967-12-16

Family

ID=24086884

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0336273A Expired ES336273A1 (en) 1966-02-01 1967-01-31 Procedure for the deposition without current of metal layers. (Machine-translation by Google Translate, not legally binding)

Country Status (8)

Country Link
CH (1) CH491206A (en)
DE (1) DE1621307B2 (en)
DK (1) DK129661B (en)
ES (1) ES336273A1 (en)
FR (1) FR1509788A (en)
GB (1) GB1176051A (en)
NL (1) NL153604C (en)
SE (1) SE332327B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1135903A (en) * 1978-09-13 1982-11-23 John F. Mccormack Electroless copper deposition process having faster plating rates
DE102010012204B4 (en) * 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Improved process for direct metallization of non-conductive substrates

Also Published As

Publication number Publication date
GB1176051A (en) 1970-01-01
NL153604C (en) 1980-05-16
FR1509788A (en) 1968-01-12
DK129661C (en) 1975-04-01
NL6701525A (en) 1967-08-02
NL153604B (en) 1977-06-15
CH491206A (en) 1970-05-31
DE1621307A1 (en) 1971-06-03
DK129661B (en) 1974-11-04
SE332327B (en) 1971-02-01
DE1621307B2 (en) 1972-01-05

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