GB1176051A - Electroless Metal Plating. - Google Patents

Electroless Metal Plating.

Info

Publication number
GB1176051A
GB1176051A GB437867A GB437867A GB1176051A GB 1176051 A GB1176051 A GB 1176051A GB 437867 A GB437867 A GB 437867A GB 437867 A GB437867 A GB 437867A GB 1176051 A GB1176051 A GB 1176051A
Authority
GB
United Kingdom
Prior art keywords
metal
substrate
deposition
sensitized
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB437867A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of GB1176051A publication Critical patent/GB1176051A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

1,176,051. Printed circuits. PHOTOCIRCUITS CORP. 30 Jan., 1967 [1 Feb., 1966], No. 4378/67. Heading H1R. [Also in Division C7] Portions of one or more surface of an insulating substrate are sensitized in a printed circuit pattern and metal is electrolessly deposited in the pattern, deposition of metal outside the sensitized portions being prevented by excluding metal ions which bring about such deposition from the electroless plating solutions used, or by removing them when they appear. The concentration of such ions in the solutions is not allowed to exceed 25 p.p.m. by weight. Preferably the metal deposited is Cu. The printed circuit pattern may be on both sides of a substrate, and may include connections between made by depositing metal on the walls of holes through the substrate.
GB437867A 1966-02-01 1967-01-30 Electroless Metal Plating. Expired GB1176051A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52389766A 1966-02-01 1966-02-01

Publications (1)

Publication Number Publication Date
GB1176051A true GB1176051A (en) 1970-01-01

Family

ID=24086884

Family Applications (1)

Application Number Title Priority Date Filing Date
GB437867A Expired GB1176051A (en) 1966-02-01 1967-01-30 Electroless Metal Plating.

Country Status (8)

Country Link
CH (1) CH491206A (en)
DE (1) DE1621307B2 (en)
DK (1) DK129661B (en)
ES (1) ES336273A1 (en)
FR (1) FR1509788A (en)
GB (1) GB1176051A (en)
NL (1) NL153604C (en)
SE (1) SE332327B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011116376A1 (en) * 2010-03-19 2011-09-22 Enthone Inc. Method for direct metallization of non-conductive substrates

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1135903A (en) * 1978-09-13 1982-11-23 John F. Mccormack Electroless copper deposition process having faster plating rates

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011116376A1 (en) * 2010-03-19 2011-09-22 Enthone Inc. Method for direct metallization of non-conductive substrates
US9617644B2 (en) 2010-03-19 2017-04-11 Andreas Königshofen Method for direct metallization of non-conductive substrates

Also Published As

Publication number Publication date
DE1621307B2 (en) 1972-01-05
DK129661B (en) 1974-11-04
SE332327B (en) 1971-02-01
ES336273A1 (en) 1967-12-16
NL153604C (en) 1980-05-16
DE1621307A1 (en) 1971-06-03
DK129661C (en) 1975-04-01
NL6701525A (en) 1967-08-02
NL153604B (en) 1977-06-15
CH491206A (en) 1970-05-31
FR1509788A (en) 1968-01-12

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