GB1176051A - Electroless Metal Plating. - Google Patents
Electroless Metal Plating.Info
- Publication number
- GB1176051A GB1176051A GB437867A GB437867A GB1176051A GB 1176051 A GB1176051 A GB 1176051A GB 437867 A GB437867 A GB 437867A GB 437867 A GB437867 A GB 437867A GB 1176051 A GB1176051 A GB 1176051A
- Authority
- GB
- United Kingdom
- Prior art keywords
- metal
- substrate
- deposition
- sensitized
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
1,176,051. Printed circuits. PHOTOCIRCUITS CORP. 30 Jan., 1967 [1 Feb., 1966], No. 4378/67. Heading H1R. [Also in Division C7] Portions of one or more surface of an insulating substrate are sensitized in a printed circuit pattern and metal is electrolessly deposited in the pattern, deposition of metal outside the sensitized portions being prevented by excluding metal ions which bring about such deposition from the electroless plating solutions used, or by removing them when they appear. The concentration of such ions in the solutions is not allowed to exceed 25 p.p.m. by weight. Preferably the metal deposited is Cu. The printed circuit pattern may be on both sides of a substrate, and may include connections between made by depositing metal on the walls of holes through the substrate.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US52389766A | 1966-02-01 | 1966-02-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1176051A true GB1176051A (en) | 1970-01-01 |
Family
ID=24086884
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB437867A Expired GB1176051A (en) | 1966-02-01 | 1967-01-30 | Electroless Metal Plating. |
Country Status (8)
Country | Link |
---|---|
CH (1) | CH491206A (en) |
DE (1) | DE1621307B2 (en) |
DK (1) | DK129661B (en) |
ES (1) | ES336273A1 (en) |
FR (1) | FR1509788A (en) |
GB (1) | GB1176051A (en) |
NL (1) | NL153604C (en) |
SE (1) | SE332327B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011116376A1 (en) * | 2010-03-19 | 2011-09-22 | Enthone Inc. | Method for direct metallization of non-conductive substrates |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1135903A (en) * | 1978-09-13 | 1982-11-23 | John F. Mccormack | Electroless copper deposition process having faster plating rates |
-
1967
- 1967-01-25 DE DE19671621307 patent/DE1621307B2/en active Pending
- 1967-01-25 CH CH108467A patent/CH491206A/en not_active IP Right Cessation
- 1967-01-30 SE SE132567A patent/SE332327B/xx unknown
- 1967-01-30 GB GB437867A patent/GB1176051A/en not_active Expired
- 1967-01-31 DK DK53867A patent/DK129661B/en unknown
- 1967-01-31 ES ES0336273A patent/ES336273A1/en not_active Expired
- 1967-02-01 NL NL6701525A patent/NL153604C/en not_active IP Right Cessation
- 1967-02-01 FR FR93312A patent/FR1509788A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011116376A1 (en) * | 2010-03-19 | 2011-09-22 | Enthone Inc. | Method for direct metallization of non-conductive substrates |
US9617644B2 (en) | 2010-03-19 | 2017-04-11 | Andreas Königshofen | Method for direct metallization of non-conductive substrates |
Also Published As
Publication number | Publication date |
---|---|
FR1509788A (en) | 1968-01-12 |
SE332327B (en) | 1971-02-01 |
DE1621307A1 (en) | 1971-06-03 |
NL6701525A (en) | 1967-08-02 |
NL153604B (en) | 1977-06-15 |
DK129661C (en) | 1975-04-01 |
DK129661B (en) | 1974-11-04 |
NL153604C (en) | 1980-05-16 |
DE1621307B2 (en) | 1972-01-05 |
CH491206A (en) | 1970-05-31 |
ES336273A1 (en) | 1967-12-16 |
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