NL153604C - METHOD OF STORING COPPER FLOODLESS AND OBJECTS OBTAINED USING THAT METHOD. - Google Patents

METHOD OF STORING COPPER FLOODLESS AND OBJECTS OBTAINED USING THAT METHOD.

Info

Publication number
NL153604C
NL153604C NL6701525A NL6701525A NL153604C NL 153604 C NL153604 C NL 153604C NL 6701525 A NL6701525 A NL 6701525A NL 6701525 A NL6701525 A NL 6701525A NL 153604 C NL153604 C NL 153604C
Authority
NL
Netherlands
Prior art keywords
floodless
objects obtained
storing copper
copper
storing
Prior art date
Application number
NL6701525A
Other languages
Dutch (nl)
Other versions
NL6701525A (en
NL153604B (en
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of NL6701525A publication Critical patent/NL6701525A/xx
Publication of NL153604B publication Critical patent/NL153604B/en
Application granted granted Critical
Publication of NL153604C publication Critical patent/NL153604C/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
NL6701525A 1966-02-01 1967-02-01 METHOD OF STORING COPPER FLOODLESS AND OBJECTS OBTAINED USING THAT METHOD. NL153604C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52389766A 1966-02-01 1966-02-01

Publications (3)

Publication Number Publication Date
NL6701525A NL6701525A (en) 1967-08-02
NL153604B NL153604B (en) 1977-06-15
NL153604C true NL153604C (en) 1980-05-16

Family

ID=24086884

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6701525A NL153604C (en) 1966-02-01 1967-02-01 METHOD OF STORING COPPER FLOODLESS AND OBJECTS OBTAINED USING THAT METHOD.

Country Status (8)

Country Link
CH (1) CH491206A (en)
DE (1) DE1621307B2 (en)
DK (1) DK129661B (en)
ES (1) ES336273A1 (en)
FR (1) FR1509788A (en)
GB (1) GB1176051A (en)
NL (1) NL153604C (en)
SE (1) SE332327B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1135903A (en) * 1978-09-13 1982-11-23 John F. Mccormack Electroless copper deposition process having faster plating rates
DE102010012204B4 (en) * 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Improved process for direct metallization of non-conductive substrates

Also Published As

Publication number Publication date
GB1176051A (en) 1970-01-01
DE1621307B2 (en) 1972-01-05
DE1621307A1 (en) 1971-06-03
FR1509788A (en) 1968-01-12
DK129661B (en) 1974-11-04
NL6701525A (en) 1967-08-02
CH491206A (en) 1970-05-31
NL153604B (en) 1977-06-15
SE332327B (en) 1971-02-01
DK129661C (en) 1975-04-01
ES336273A1 (en) 1967-12-16

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Legal Events

Date Code Title Description
P2G Not automatically granted patents, but text of patent specification is modified with respect to the text of examined patent ap
V1 Lapsed because of non-payment of the annual fee