DK129661B - Method for electroless deposition of metal on a sensitized surface and bath for use in this method. - Google Patents

Method for electroless deposition of metal on a sensitized surface and bath for use in this method.

Info

Publication number
DK129661B
DK129661B DK53867A DK53867A DK129661B DK 129661 B DK129661 B DK 129661B DK 53867 A DK53867 A DK 53867A DK 53867 A DK53867 A DK 53867A DK 129661 B DK129661 B DK 129661B
Authority
DK
Denmark
Prior art keywords
bath
metal
electroless deposition
sensitized surface
sensitized
Prior art date
Application number
DK53867A
Other languages
Danish (da)
Other versions
DK129661C (en
Inventor
F Schneble
J Mccormack
R Zeblisky
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of DK129661B publication Critical patent/DK129661B/en
Application granted granted Critical
Publication of DK129661C publication Critical patent/DK129661C/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DK53867A 1966-02-01 1967-01-31 Method for electroless deposition of metal on a sensitized surface and bath for use in this method. DK129661B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52389766A 1966-02-01 1966-02-01

Publications (2)

Publication Number Publication Date
DK129661B true DK129661B (en) 1974-11-04
DK129661C DK129661C (en) 1975-04-01

Family

ID=24086884

Family Applications (1)

Application Number Title Priority Date Filing Date
DK53867A DK129661B (en) 1966-02-01 1967-01-31 Method for electroless deposition of metal on a sensitized surface and bath for use in this method.

Country Status (8)

Country Link
CH (1) CH491206A (en)
DE (1) DE1621307B2 (en)
DK (1) DK129661B (en)
ES (1) ES336273A1 (en)
FR (1) FR1509788A (en)
GB (1) GB1176051A (en)
NL (1) NL153604C (en)
SE (1) SE332327B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1135903A (en) * 1978-09-13 1982-11-23 John F. Mccormack Electroless copper deposition process having faster plating rates
DE102010012204B4 (en) * 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Improved process for direct metallization of non-conductive substrates

Also Published As

Publication number Publication date
GB1176051A (en) 1970-01-01
NL153604C (en) 1980-05-16
DK129661C (en) 1975-04-01
DE1621307A1 (en) 1971-06-03
ES336273A1 (en) 1967-12-16
DE1621307B2 (en) 1972-01-05
CH491206A (en) 1970-05-31
NL6701525A (en) 1967-08-02
NL153604B (en) 1977-06-15
SE332327B (en) 1971-02-01
FR1509788A (en) 1968-01-12

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