CH490509A - Bath for the electroless deposition of metal layers - Google Patents

Bath for the electroless deposition of metal layers

Info

Publication number
CH490509A
CH490509A CH135567A CH135567A CH490509A CH 490509 A CH490509 A CH 490509A CH 135567 A CH135567 A CH 135567A CH 135567 A CH135567 A CH 135567A CH 490509 A CH490509 A CH 490509A
Authority
CH
Switzerland
Prior art keywords
bath
metal layers
electroless deposition
electroless
deposition
Prior art date
Application number
CH135567A
Other languages
German (de)
Inventor
J Zeblisky Rudolph
W Schneble Frederick
F Kccormack John
Original Assignee
Photocircuits Corporations
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corporations filed Critical Photocircuits Corporations
Publication of CH490509A publication Critical patent/CH490509A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
CH135567A 1966-02-01 1967-01-30 Bath for the electroless deposition of metal layers CH490509A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52386366A 1966-02-01 1966-02-01
US52390266A 1966-02-01 1966-02-01

Publications (1)

Publication Number Publication Date
CH490509A true CH490509A (en) 1970-05-15

Family

ID=27061291

Family Applications (1)

Application Number Title Priority Date Filing Date
CH135567A CH490509A (en) 1966-02-01 1967-01-30 Bath for the electroless deposition of metal layers

Country Status (8)

Country Link
AT (1) AT289498B (en)
CH (1) CH490509A (en)
DE (1) DE1621309C2 (en)
DK (1) DK141411B (en)
ES (1) ES336275A1 (en)
FR (1) FR1509789A (en)
NL (1) NL166727C (en)
SE (1) SE384880B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE441530B (en) * 1980-12-09 1985-10-14 Ericsson Telefon Ab L M SET AND BATH TO CARRY OUT POWERLESS PREPARATION
IT1157006B (en) * 1982-03-09 1987-02-11 Alfachimici Spa STABILIZING MIXTURE FOR A CHEMICAL COPPER BATH

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3119709A (en) * 1956-09-28 1964-01-28 Atkinson Lab Inc Material and method for electroless deposition of metal
US2884344A (en) * 1957-10-07 1959-04-28 Reynolds Metals Co Nickel plating

Also Published As

Publication number Publication date
DE1621309B2 (en) 1972-10-12
NL166727B (en) 1981-04-15
SE384880B (en) 1976-05-24
AT289498B (en) 1971-04-26
DE1621309A1 (en) 1971-06-03
NL166727C (en) 1981-09-15
DK141411C (en) 1980-09-08
ES336275A1 (en) 1967-12-16
DK141411B (en) 1980-03-10
DE1621309C2 (en) 1981-04-16
FR1509789A (en) 1968-01-12
NL6701526A (en) 1967-08-02

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Legal Events

Date Code Title Description
PL Patent ceased