GB1257770A - - Google Patents

Info

Publication number
GB1257770A
GB1257770A GB1257770DA GB1257770A GB 1257770 A GB1257770 A GB 1257770A GB 1257770D A GB1257770D A GB 1257770DA GB 1257770 A GB1257770 A GB 1257770A
Authority
GB
United Kingdom
Prior art keywords
layer
holes
dielectric
etched
dec
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1257770A publication Critical patent/GB1257770A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

1,257,770. Printed circuits. INTERNATIONAL BUSINESS MACHINES CORP. 16 Dec., 1970 [18 Dec., 1969], No. 59626/70. Heading H1R. A multilayer circuit board comprises a stack of two types 21, 24 of dielectric layer, each layer having at least one conductive layer 14, 15 laminated to it, having holes 30 through the stack, said holes being metalized 32 by electrolessly plating in the regions of only one type of dielectric layer. The platable dielectric 21, comprises an agent catalytic to the reception of electroless metal dispersed throughout the resin on the dielectric material whilst the non- platable dielectric 24 requires "sensitizing" before "electroless" plating can be performed. Before assembly holes 37 may be through plated by conventional methods. The conductive layers 14 &c. may be etched to form circuit patterns and selected conductive layers around holes may be etched to prevent electrical contact by the metalized layer in that hole.
GB1257770D 1969-12-18 1970-12-16 Expired GB1257770A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US88627569A 1969-12-18 1969-12-18

Publications (1)

Publication Number Publication Date
GB1257770A true GB1257770A (en) 1971-12-22

Family

ID=25388757

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1257770D Expired GB1257770A (en) 1969-12-18 1970-12-16

Country Status (3)

Country Link
DE (1) DE2047204A1 (en)
FR (1) FR2071794A5 (en)
GB (1) GB1257770A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5538433A (en) * 1993-08-20 1996-07-23 Kel Corporation Electrical connector comprising multilayer base board assembly
US6466113B1 (en) * 1999-01-22 2002-10-15 Spectrian Corporation Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices
WO2003049511A1 (en) * 2001-12-04 2003-06-12 Teradyne, Inc. High speed multi-layer printed circuit board via
WO2004060035A1 (en) * 2002-12-20 2004-07-15 Viasystems Group, Inc. Circuit board having a multi-functional hole
US9781844B2 (en) 2013-03-15 2017-10-03 Sanmina Corporation Simultaneous and selective wide gap partitioning of via structures using plating resist
US10820427B2 (en) 2013-03-15 2020-10-27 Sanmina Corporation Simultaneous and selective wide gap partitioning of via structures using plating resist
WO2023193502A1 (en) * 2022-04-08 2023-10-12 华为技术有限公司 Circuit board, integrated circuit module, and electronic device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3760091A (en) * 1971-11-16 1973-09-18 Ibm Multilayer circuit board
JPS61159793A (en) * 1984-12-31 1986-07-19 株式会社　アサヒ化学研究所 Formation of conductive circuit on substrate

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5538433A (en) * 1993-08-20 1996-07-23 Kel Corporation Electrical connector comprising multilayer base board assembly
US6466113B1 (en) * 1999-01-22 2002-10-15 Spectrian Corporation Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices
US6681483B2 (en) 1999-01-22 2004-01-27 Remec, Inc. Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices
WO2003049511A1 (en) * 2001-12-04 2003-06-12 Teradyne, Inc. High speed multi-layer printed circuit board via
WO2004060035A1 (en) * 2002-12-20 2004-07-15 Viasystems Group, Inc. Circuit board having a multi-functional hole
US9781844B2 (en) 2013-03-15 2017-10-03 Sanmina Corporation Simultaneous and selective wide gap partitioning of via structures using plating resist
US10820427B2 (en) 2013-03-15 2020-10-27 Sanmina Corporation Simultaneous and selective wide gap partitioning of via structures using plating resist
US11304311B2 (en) 2013-03-15 2022-04-12 Sanmina Corporation Simultaneous and selective wide gap partitioning of via structures using plating resist
WO2023193502A1 (en) * 2022-04-08 2023-10-12 华为技术有限公司 Circuit board, integrated circuit module, and electronic device

Also Published As

Publication number Publication date
DE2047204A1 (en) 1971-06-16
FR2071794A5 (en) 1971-09-17

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Legal Events

Date Code Title Description
CSNS Application of which complete specification have been accepted and published, but patent is not sealed