GB1112996A - Printed circuit - Google Patents
Printed circuitInfo
- Publication number
- GB1112996A GB1112996A GB2478666A GB2478666A GB1112996A GB 1112996 A GB1112996 A GB 1112996A GB 2478666 A GB2478666 A GB 2478666A GB 2478666 A GB2478666 A GB 2478666A GB 1112996 A GB1112996 A GB 1112996A
- Authority
- GB
- United Kingdom
- Prior art keywords
- layer
- printed circuit
- june
- deposited
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005234 chemical deposition Methods 0.000 abstract 1
- 238000005868 electrolysis reaction Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
1,112,996. Printed circuits. INTERNATIONAL STANDARD ELECTRIC CORPORATION. 3 June, 1966 [8 June, 1965], No. 24786/66. Heading H1R. In a printed circuit having a wiring pattern 2a-2e formed, as by etching, in a Cu-clad laminate 1, a layer 4a-4e of Fe is deposited on the Cu pattern, followed by a layer 5a-5c of Ni. This facilitates the attachment of components to the wiring by resistance welding. The layers of Fe and Ni are deposited by electrolysis or chemical plating. The printed circuit may be double-sided, as shown, or multilayer, through-holes 3 being metallized by the chemical deposition of Fe layer 4d. Preferably, the Fe layer has a thickness of 50-60 Á, and the Ni layer has a thickness of 10-15 Á.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR19887A FR1446381A (en) | 1965-06-08 | 1965-06-08 | Improvements to printed circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1112996A true GB1112996A (en) | 1968-05-08 |
Family
ID=8581170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2478666A Expired GB1112996A (en) | 1965-06-08 | 1966-06-03 | Printed circuit |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR1446381A (en) |
GB (1) | GB1112996A (en) |
-
1965
- 1965-06-08 FR FR19887A patent/FR1446381A/en not_active Expired
-
1966
- 1966-06-03 GB GB2478666A patent/GB1112996A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR1446381A (en) | 1966-07-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB1106985A (en) | Method of making multilayer circuit boards | |
US3102213A (en) | Multiplanar printed circuits and methods for their manufacture | |
GB1125526A (en) | Multilayer circuit boards | |
GB1501500A (en) | Multilayer printed circuit boards | |
KR900004722B1 (en) | Hybrid intergrated circuit | |
EP0170477A3 (en) | Multilayer systems and their method of production | |
GB1255253A (en) | Ceramic-metallic composite substrate | |
GB1101299A (en) | Method of manufacturing an electric circuit unit | |
GB1257770A (en) | ||
GB1207631A (en) | Plated through holes | |
GB1001634A (en) | Electronic circuit boards | |
GB1112996A (en) | Printed circuit | |
GB1259304A (en) | ||
ES455373A1 (en) | Multilayer printed wiring board | |
GB2017416A (en) | Circuit board manufacturing method | |
GB1136752A (en) | Improvements relating to electrical connecting arrangements | |
GB1210668A (en) | Printed winding rotor | |
GB1497312A (en) | Production of printed circuit arrangements | |
GB1261578A (en) | Method of producing a circuit board having conductor patterns and metallised holes through the board | |
JPS6489591A (en) | Manufacture of wiring board and that of multilayer wiring board | |
JPS6467995A (en) | Manufacture of printed circuit board with side face electrode | |
JPS6489585A (en) | Multilayer wiring board | |
GB1042234A (en) | Multilayer printed circuits | |
GB1005943A (en) | Multilayer electrical circuit assemblies and processes for producing such assemblies | |
GB1340441A (en) | Manufacture of printed circuit boards |