GB1112996A - Printed circuit - Google Patents

Printed circuit

Info

Publication number
GB1112996A
GB1112996A GB2478666A GB2478666A GB1112996A GB 1112996 A GB1112996 A GB 1112996A GB 2478666 A GB2478666 A GB 2478666A GB 2478666 A GB2478666 A GB 2478666A GB 1112996 A GB1112996 A GB 1112996A
Authority
GB
United Kingdom
Prior art keywords
layer
printed circuit
june
deposited
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2478666A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Standard Electric Corp
Original Assignee
International Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Standard Electric Corp filed Critical International Standard Electric Corp
Publication of GB1112996A publication Critical patent/GB1112996A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

1,112,996. Printed circuits. INTERNATIONAL STANDARD ELECTRIC CORPORATION. 3 June, 1966 [8 June, 1965], No. 24786/66. Heading H1R. In a printed circuit having a wiring pattern 2a-2e formed, as by etching, in a Cu-clad laminate 1, a layer 4a-4e of Fe is deposited on the Cu pattern, followed by a layer 5a-5c of Ni. This facilitates the attachment of components to the wiring by resistance welding. The layers of Fe and Ni are deposited by electrolysis or chemical plating. The printed circuit may be double-sided, as shown, or multilayer, through-holes 3 being metallized by the chemical deposition of Fe layer 4d. Preferably, the Fe layer has a thickness of 50-60 Á, and the Ni layer has a thickness of 10-15 Á.
GB2478666A 1965-06-08 1966-06-03 Printed circuit Expired GB1112996A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR19887A FR1446381A (en) 1965-06-08 1965-06-08 Improvements to printed circuits

Publications (1)

Publication Number Publication Date
GB1112996A true GB1112996A (en) 1968-05-08

Family

ID=8581170

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2478666A Expired GB1112996A (en) 1965-06-08 1966-06-03 Printed circuit

Country Status (2)

Country Link
FR (1) FR1446381A (en)
GB (1) GB1112996A (en)

Also Published As

Publication number Publication date
FR1446381A (en) 1966-07-22

Similar Documents

Publication Publication Date Title
GB1106985A (en) Method of making multilayer circuit boards
GB1125526A (en) Multilayer circuit boards
GB1293801A (en) Printed circuit boards and methods of making same
GB1501500A (en) Multilayer printed circuit boards
GB911718A (en) Multiplanar printed circuits and methods for their manufacture
KR900004722B1 (en) Hybrid intergrated circuit
GB1255253A (en) Ceramic-metallic composite substrate
EP0265629A3 (en) Printed circuit card fabrication process with nickel overplate
GB1101299A (en) Method of manufacturing an electric circuit unit
GB1257770A (en)
GB1207631A (en) Plated through holes
GB1001634A (en) Electronic circuit boards
GB1112996A (en) Printed circuit
GB1259304A (en)
ES455373A1 (en) Multilayer printed wiring board
GB2017416A (en) Circuit board manufacturing method
GB1136752A (en) Improvements relating to electrical connecting arrangements
GB1210668A (en) Printed winding rotor
GB1497312A (en) Production of printed circuit arrangements
GB1261578A (en) Method of producing a circuit board having conductor patterns and metallised holes through the board
JPS6489591A (en) Manufacture of wiring board and that of multilayer wiring board
JPS6467995A (en) Manufacture of printed circuit board with side face electrode
JPS6489585A (en) Multilayer wiring board
GB1042234A (en) Multilayer printed circuits
GB1005943A (en) Multilayer electrical circuit assemblies and processes for producing such assemblies