AT283841B - Process for the electrodeposition of gold-copper-cadmium alloy coatings - Google Patents
Process for the electrodeposition of gold-copper-cadmium alloy coatingsInfo
- Publication number
- AT283841B AT283841B AT617369A AT617369A AT283841B AT 283841 B AT283841 B AT 283841B AT 617369 A AT617369 A AT 617369A AT 617369 A AT617369 A AT 617369A AT 283841 B AT283841 B AT 283841B
- Authority
- AT
- Austria
- Prior art keywords
- electrodeposition
- gold
- copper
- cadmium alloy
- alloy coatings
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE283841X | 1968-06-28 | ||
DE19681771712 DE1771712C3 (en) | 1968-06-28 | Process for the galvanic deposition of gold-copper-cadmium alloy coatings |
Publications (1)
Publication Number | Publication Date |
---|---|
AT283841B true AT283841B (en) | 1970-08-25 |
Family
ID=25755604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT617369A AT283841B (en) | 1968-06-28 | 1969-06-27 | Process for the electrodeposition of gold-copper-cadmium alloy coatings |
Country Status (7)
Country | Link |
---|---|
US (1) | US3586611A (en) |
AT (1) | AT283841B (en) |
CH (1) | CH522740A (en) |
FR (1) | FR2011755A1 (en) |
GB (1) | GB1279141A (en) |
NL (1) | NL6906666A (en) |
SE (1) | SE345697B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH529843A (en) * | 1971-07-09 | 1972-10-31 | Oxy Metal Finishing Europ S A | Bath for the electrolytic deposition of gold alloys and its use in electroplating |
US4179344A (en) * | 1973-07-02 | 1979-12-18 | Lea-Ronal, Inc. | Gold alloy plating compositions and method |
US4547436A (en) * | 1982-11-19 | 1985-10-15 | E. I. Du Pont De Nemours And Company | Conductive element metallized with a thick film gold composition |
US4486275A (en) * | 1983-02-07 | 1984-12-04 | Heinz Emmenegger | Solution for electroplating a gold-copper-cadmium alloy |
CH662583A5 (en) * | 1985-03-01 | 1987-10-15 | Heinz Emmenegger | GALVANIC BATH FOR THE ELECTROLYTIC DEPOSITION OF GOLD-COPPER-CADMIUM-ZINC ALLOYS. |
DE3929569C1 (en) * | 1989-09-06 | 1991-04-18 | Degussa Ag, 6000 Frankfurt, De | |
CA2235408A1 (en) | 1995-11-03 | 1997-05-15 | Enthone-Omi, Inc. | Electroplating processes compositions and deposits |
GB2369239A (en) * | 2000-11-17 | 2002-05-22 | Univ Hong Kong Polytechnic | Nickel oxyhydroxide and cadmium electrodes for storage cells |
-
1969
- 1969-04-18 CH CH588369A patent/CH522740A/en not_active IP Right Cessation
- 1969-05-01 NL NL6906666A patent/NL6906666A/xx unknown
- 1969-05-20 US US826280A patent/US3586611A/en not_active Expired - Lifetime
- 1969-06-16 FR FR6919987A patent/FR2011755A1/fr not_active Withdrawn
- 1969-06-24 GB GB31750/69A patent/GB1279141A/en not_active Expired
- 1969-06-26 SE SE9091/69A patent/SE345697B/xx unknown
- 1969-06-27 AT AT617369A patent/AT283841B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CH522740A (en) | 1972-06-30 |
NL6906666A (en) | 1969-12-30 |
GB1279141A (en) | 1972-06-28 |
SE345697B (en) | 1972-06-05 |
US3586611A (en) | 1971-06-22 |
FR2011755A1 (en) | 1970-03-06 |
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Date | Code | Title | Description |
---|---|---|---|
ELJ | Ceased due to non-payment of the annual fee |