AT283841B - Process for the electrodeposition of gold-copper-cadmium alloy coatings - Google Patents

Process for the electrodeposition of gold-copper-cadmium alloy coatings

Info

Publication number
AT283841B
AT283841B AT617369A AT617369A AT283841B AT 283841 B AT283841 B AT 283841B AT 617369 A AT617369 A AT 617369A AT 617369 A AT617369 A AT 617369A AT 283841 B AT283841 B AT 283841B
Authority
AT
Austria
Prior art keywords
electrodeposition
gold
copper
cadmium alloy
alloy coatings
Prior art date
Application number
AT617369A
Other languages
German (de)
Original Assignee
Degussa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19681771712 external-priority patent/DE1771712C3/en
Application filed by Degussa filed Critical Degussa
Application granted granted Critical
Publication of AT283841B publication Critical patent/AT283841B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18Electroplating using modulated, pulsed or reversing current
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/605Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611Smooth layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AT617369A 1968-06-28 1969-06-27 Process for the electrodeposition of gold-copper-cadmium alloy coatings AT283841B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE283841X 1968-06-28
DE19681771712 DE1771712C3 (en) 1968-06-28 Process for the galvanic deposition of gold-copper-cadmium alloy coatings

Publications (1)

Publication Number Publication Date
AT283841B true AT283841B (en) 1970-08-25

Family

ID=25755604

Family Applications (1)

Application Number Title Priority Date Filing Date
AT617369A AT283841B (en) 1968-06-28 1969-06-27 Process for the electrodeposition of gold-copper-cadmium alloy coatings

Country Status (7)

Country Link
US (1) US3586611A (en)
AT (1) AT283841B (en)
CH (1) CH522740A (en)
FR (1) FR2011755A1 (en)
GB (1) GB1279141A (en)
NL (1) NL6906666A (en)
SE (1) SE345697B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH529843A (en) * 1971-07-09 1972-10-31 Oxy Metal Finishing Europ S A Bath for the electrolytic deposition of gold alloys and its use in electroplating
US4179344A (en) * 1973-07-02 1979-12-18 Lea-Ronal, Inc. Gold alloy plating compositions and method
US4547436A (en) * 1982-11-19 1985-10-15 E. I. Du Pont De Nemours And Company Conductive element metallized with a thick film gold composition
US4486275A (en) * 1983-02-07 1984-12-04 Heinz Emmenegger Solution for electroplating a gold-copper-cadmium alloy
CH662583A5 (en) * 1985-03-01 1987-10-15 Heinz Emmenegger GALVANIC BATH FOR THE ELECTROLYTIC DEPOSITION OF GOLD-COPPER-CADMIUM-ZINC ALLOYS.
DE3929569C1 (en) * 1989-09-06 1991-04-18 Degussa Ag, 6000 Frankfurt, De
CA2235408A1 (en) 1995-11-03 1997-05-15 Enthone-Omi, Inc. Electroplating processes compositions and deposits
GB2369239A (en) * 2000-11-17 2002-05-22 Univ Hong Kong Polytechnic Nickel oxyhydroxide and cadmium electrodes for storage cells

Also Published As

Publication number Publication date
CH522740A (en) 1972-06-30
NL6906666A (en) 1969-12-30
GB1279141A (en) 1972-06-28
SE345697B (en) 1972-06-05
US3586611A (en) 1971-06-22
FR2011755A1 (en) 1970-03-06

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Legal Events

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