DE1771712C3 - Process for the galvanic deposition of gold-copper-cadmium alloy coatings - Google Patents
Process for the galvanic deposition of gold-copper-cadmium alloy coatingsInfo
- Publication number
- DE1771712C3 DE1771712C3 DE19681771712 DE1771712A DE1771712C3 DE 1771712 C3 DE1771712 C3 DE 1771712C3 DE 19681771712 DE19681771712 DE 19681771712 DE 1771712 A DE1771712 A DE 1771712A DE 1771712 C3 DE1771712 C3 DE 1771712C3
- Authority
- DE
- Germany
- Prior art keywords
- gold
- copper
- cyanide
- cadmium alloy
- alloy coatings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000925 Cd alloy Inorganic materials 0.000 title claims description 3
- -1 gold-copper-cadmium Chemical group 0.000 title claims description 3
- 238000000034 method Methods 0.000 title claims 2
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 4
- 230000000576 supplementary Effects 0.000 claims description 4
- 229910002065 alloy metal Inorganic materials 0.000 claims description 3
- 238000004070 electrodeposition Methods 0.000 claims 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 6
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 3
- 229910052793 cadmium Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- NNFCIKHAZHQZJG-UHFFFAOYSA-N Potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 2
- ARHBWGMHXPPGCZ-UHFFFAOYSA-N [K].[Au](C#N)(C#N)C#N Chemical compound [K].[Au](C#N)(C#N)C#N ARHBWGMHXPPGCZ-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive Effects 0.000 description 2
- HKSGQTYSSZOJOA-UHFFFAOYSA-N Potassium argentocyanide Chemical compound [K+].[Ag+].N#[C-].N#[C-] HKSGQTYSSZOJOA-UHFFFAOYSA-N 0.000 description 1
- PHZPQOKZOLZATN-UHFFFAOYSA-N [C-]#N.[Cd+2].[Na+].[C-]#N.[C-]#N Chemical compound [C-]#N.[Cd+2].[Na+].[C-]#N.[C-]#N PHZPQOKZOLZATN-UHFFFAOYSA-N 0.000 description 1
- GOBZQAFUBBVPEO-UHFFFAOYSA-N [Cu](C#N)C#N.[K] Chemical compound [Cu](C#N)C#N.[K] GOBZQAFUBBVPEO-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000875 corresponding Effects 0.000 description 1
- JXWXJWOMXJKLOG-UHFFFAOYSA-N disodium;copper(1+);tricyanide Chemical compound [Na+].[Na+].[Cu+].N#[C-].N#[C-].N#[C-] JXWXJWOMXJKLOG-UHFFFAOYSA-N 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- JTFWYZCRONEZFE-UHFFFAOYSA-N potassium;cadmium(2+);tricyanide Chemical compound [K+].[Cd+2].N#[C-].N#[C-].N#[C-] JTFWYZCRONEZFE-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
Description
In dem Patent 11 41 849.8 wird ein mit unlöslichen Anoden arbeitendes Verfahren zur galvanischen Abscheidung von Gold-Kupfer-Cadmium-Legierungsüberzügen aus cyanidischen Bädern mittels periodisch umgepolten Gleichstroms beschrieben. Dieses Verfahren ist dadurch gekennzeichnet, daß ein aus 1 bis 3 g/l Gold als Kaliumgoldcyanid, 5 bis 15, vorzugsweise 8 bis 13 g/l Kupfer als Kaliumkupfercyanid oder Natriumkupfercyanid, 0,1 bis 0,8 g/l Cadmium als Kaliumcadmiumcyanid oder Natriumcadmiumcyanid und 3 bis 8 g/l freiem Cyanid, berechnet als Kaliumcyanid, mit einem pH-Wert von 9 bis 11 bestehendes Bad verwendet und mit einer Stromdichte von 0,5 bis 1,5 A/dm2 für die Dauer der kathodischen Phase von 4 bis 20 see sowie mit einer Stromdichte von 0,75 bis 3,75 A/dm2, vorzugsweise 1,0 bis 3,0 A/dm2, für die Dauer der anodischen Phase von 0,5 bis 2 see betrieben wird. Unier diesen Bedingungen lassen sich hochglänzende, anlaufbeständige und harte Überzüge abscheiden.Patent 11 41 849.8 describes a method, which works with insoluble anodes, for the galvanic deposition of gold-copper-cadmium alloy coatings from cyanide baths by means of periodically reversed direct current. This method is characterized in that one of 1 to 3 g / l gold as potassium gold cyanide, 5 to 15, preferably 8 to 13 g / l copper as potassium copper cyanide or sodium copper cyanide, 0.1 to 0.8 g / l cadmium as potassium cadmium cyanide or Sodium cadmium cyanide and 3 to 8 g / l free cyanide, calculated as potassium cyanide, with a pH value of 9 to 11 existing bath used and with a current density of 0.5 to 1.5 A / dm 2 for the duration of the cathodic phase of 4 to 20 seconds and with a current density of 0.75 to 3.75 A / dm 2 , preferably 1.0 to 3.0 A / dm 2 , for the duration of the anodic phase of 0.5 to 2 seconds. Under these conditions, high-gloss, tarnish-resistant and hard coatings can be deposited.
Nachteile des geschilderten Verfahrens bestehen darin, daß der zur Verfügung stehende Glanzstromdichtebereich relativ schmal ist, so daß es sich nur zur Galvanisiemng kleiner und möglichst einfach geformter Teile eignet. Außerdem sind der Abscheidung rötlicher Überzüge hinsichtlich ihrer Schichtdicke enge Grenzen gesetzt und schließlich nimmt die Rauhigkeit des Überzugs bei größerer Schichtdicke zu. Disadvantages of the described method are that the available gloss current density range is relatively narrow, so that it is only suitable for electroplating small and as simply shaped parts as possible. In addition, there are narrow limits to the deposition of reddish coatings with regard to their layer thickness, and finally the roughness of the coating increases with greater layer thickness .
Überraschenderweise hat sich gezeigt, daß diese Nachteile vermieden werden können, wenn man dem Bad in kleiner Menge Silber zusetzt. Dieser Zusatz kann in Form von Kaliumsilbercyanid oder einer anderen, mit der übrigen Badzusammensetzung verträglichen Verbindung erfolgen. Die Konzentration des Bads an Silber soll zwischen 0,01 und 0,1 g/l liegen. Dieser Silbergehalt muß über die gesamte Gebrauchsdauer des Bads dadurch aufrechterhalten ίο werden, daß Ergänzungszusätze verwendet werden, die Silber in einer Menge enthalten, die 0,2 bis 2% ihres Gehalts an Gold und Legierungsmetallen entspricht. Surprisingly, it has been shown that these disadvantages can be avoided if the Adds a small amount of silver to the bath. This addition can be in the form of potassium silver cyanide or a other compound compatible with the rest of the bath composition. The concentration of the silver bath should be between 0.01 and 0.1 g / l. This silver content must cover the entire The service life of the bath can be maintained by using supplementary additives, which contain silver in an amount corresponding to 0.2 to 2% of their gold and alloy metal content.
Das Bad enthält (in g/l):The bath contains (in g / l):
1,5 Gold als Kaliumgoldcyanid
10,5 Kupfer als Cyanidkomplex
0,3 Cadmium als Cyanidkomplex1.5 gold as potassium gold cyanide
10.5 copper as a cyanide complex
0.3 Cadmium as a cyanide complex
0,05 Silber als Cyanidkomplex
5,0 freies Kaliumcyanid0.05 silver as a cyanide complex
5.0 free potassium cyanide
Die Abscheidung wird z. B. mit einer Stromdichte von 0,7 A/dm2 während 7 see kathodischer Schaltdauer und mit einer Stromdichte von 1,5 A/dm2 während 1 see anodischer Schaltdauer bei 70° C und Warenbewegung vorgenommen. Der Ergänzungszusatz enthält die Legierungspartner beispielsweise in folgenden Mengenverhältnissen:The deposition is z. B. made with a current density of 0.7 A / dm 2 during 7 seconds cathodic switching time and with a current density of 1.5 A / dm 2 during 1 second anodic switching time at 70 ° C and goods movement. The supplementary additive contains the alloying partners in the following proportions, for example:
740/0 Gold
150/0 Kupfer
10% Cadmium740/0 gold
150/0 copper
10% cadmium
lo/o Silber
35 lo / o silver
35
Ein Teil der Legierungsmetalle liegt im Ergänzungszusatz in Form eines einfachen, nicht-cyanidischen, in wäßriger Lösung sauer reagierenden Salzes vor, um den Gehalt des Bads an freiem Cyanid und den pH-Wert innerhalb der erforderlichen Grenzen zu halten. Der Silbergehalt des Bads kann zusammen mit den übrigen Metallen oder separat ergänzt werden. Part of the alloy metals is in the supplementary additive in the form of a simple, non-cyanidic, acidic reacting salt in an aqueous solution to the content of the bath of free cyanide and keep the pH within the required limits. The silver content of the bath can be combined can be supplemented with the other metals or separately.
Man erhält auch bei Schichtdicken von 20 /(m oder mehr in einem relativ breiten Glanzstromdichtebereich hochglänzende, glatte, gelbe bis rote, etwa 18-karätige Goldüberzüge besonders hoher Härte.Even with layer thicknesses of 20 / ( m or more in a relatively broad gloss current density range, high-gloss, smooth, yellow to red, approximately 18-carat gold coatings of particularly high hardness are obtained.
Claims (2)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19681771712 DE1771712C3 (en) | 1968-06-28 | Process for the galvanic deposition of gold-copper-cadmium alloy coatings | |
CH588369A CH522740A (en) | 1968-06-28 | 1969-04-18 | Process for the electrodeposition of gold-copper-cadmium alloy coatings |
NL6906666A NL6906666A (en) | 1968-06-28 | 1969-05-01 | |
US826280A US3586611A (en) | 1968-06-28 | 1969-05-20 | Process for the electrolytic deposition of gold-copper-cadmium alloys |
FR6919987A FR2011755A1 (en) | 1968-06-28 | 1969-06-16 | |
GB31750/69A GB1279141A (en) | 1968-06-28 | 1969-06-24 | A process for the electrodeposition of gold-copper-cadmium alloy coatings |
SE9091/69A SE345697B (en) | 1968-06-28 | 1969-06-26 | |
AT617369A AT283841B (en) | 1968-06-28 | 1969-06-27 | Process for the electrodeposition of gold-copper-cadmium alloy coatings |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19681771712 DE1771712C3 (en) | 1968-06-28 | Process for the galvanic deposition of gold-copper-cadmium alloy coatings |
Publications (3)
Publication Number | Publication Date |
---|---|
DE1771712A1 DE1771712A1 (en) | 1972-01-13 |
DE1771712B2 DE1771712B2 (en) | 1975-07-31 |
DE1771712C3 true DE1771712C3 (en) | 1976-03-11 |
Family
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