DE1771712B2 - Process for the galvanic deposition of GoW copper-cadmium alloy coatings - Google Patents
Process for the galvanic deposition of GoW copper-cadmium alloy coatingsInfo
- Publication number
- DE1771712B2 DE1771712B2 DE1771712A DE1771712A DE1771712B2 DE 1771712 B2 DE1771712 B2 DE 1771712B2 DE 1771712 A DE1771712 A DE 1771712A DE 1771712 A DE1771712 A DE 1771712A DE 1771712 B2 DE1771712 B2 DE 1771712B2
- Authority
- DE
- Germany
- Prior art keywords
- copper
- cyanide
- gow
- gold
- cadmium alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
In dem Patent 11 41 849.8 wird ein mit unlöslichen Anoden arbeitendes Verfahren zur galvanischen Abscheidung von Gold-Kupfer-Cadmium-Legierungsüberzügen aus cyanidischen Bädern mittels periodisch umgepolten Gleichstroms beschrieben. Dieses Verfahren ist dadurch gekennzeichnet, daß ein aus 1 bis 3 g/l Gold als Kaliumgoldcyanid, 5 bis 15, vorzugsweise 8 bis 13 g/l Kupfer als Kaliumkupfercyanid oder Natriumkupfercyanid, 0,1 bis 0,8 g/l Cadmium als Kaliumcadmiumcyanid oder Natriumcadmiumcyanid und 3 bis 8 g/l freiem Cyanid, berechnet als Kaliumcyanid, mit einem pH-Wert von 9 bis 11 bestehendes Bad verwendet und mit einer Stromdichte von 0,5 bis 1,5 A/dm2 für die Dauer der kathodischen Phase von 4 bis 20 see sowie mit einer Stromdichte von 0,75 bis 3,75 A/dm2, vorzugsweise 1,0 bis 3,0 A/dm2, für die Dauer der anodischen Phase von 0,5 bis 2 see betrieben wird. Unter diesen bedingungen lassen sich hochglänzende, anlaufbeständige und harte Überzüge abscheiden.Patent 11 41 849.8 describes a method, which works with insoluble anodes, for the galvanic deposition of gold-copper-cadmium alloy coatings from cyanide baths by means of periodically reversed direct current. This method is characterized in that one of 1 to 3 g / l gold as potassium gold cyanide, 5 to 15, preferably 8 to 13 g / l copper as potassium copper cyanide or sodium copper cyanide, 0.1 to 0.8 g / l cadmium as potassium cadmium cyanide or Sodium cadmium cyanide and 3 to 8 g / l free cyanide, calculated as potassium cyanide, with a pH value of 9 to 11 existing bath used and with a current density of 0.5 to 1.5 A / dm 2 for the duration of the cathodic phase of 4 to 20 seconds and with a current density of 0.75 to 3.75 A / dm 2 , preferably 1.0 to 3.0 A / dm 2 , for the duration of the anodic phase of 0.5 to 2 seconds. High-gloss, tarnish-resistant and hard coatings can be deposited under these conditions.
Nachteile des geschilderten Verfahrens bestehen darin, daß der zur Verfügung stehende Glanzstromdichtebereich relativ schmal ist, so daß es sich nur zur Galvanisierung kleiner und möglichst einfach geformter Teile eignet. Außerdem sind der Abscheidung rötlicher Überzüge hinsichtlich ihrer Schichtdicke enge Grenzen gesetzt und schließlich nimmt die Rauhigkeit des Überzugs bei größerer Schichtdicke zu.Disadvantages of the method described are that the available gloss current density range is relatively narrow, so that it is only smaller and more simply shaped for electroplating Parts suitable. In addition, reddish coatings are deposited in terms of their layer thickness set narrow limits and finally the roughness of the coating decreases with greater layer thickness to.
Überraschenderweise hat sich gezeigt, daß diese Nachteile vermieden werden können, wenn man dem Bad in kleiner Menge Silber zusetzt. Dieser Zusatz kann in Form von Kaliumsilbercyanid oder einer anderen, mit der übrigen Badzusammensetzung verträglichen Verbindung erfolgen. Die Konzentration des Bads an Silber soll zwischen 0,01 und 0,1 g/l liegen. Dieser Silbergehalt muß über die gesamte Gebrauchsdauer des Bads dadurch aufrechterhalten ίο werden, daß Ergänzungszusätze verwendet werden, die Silber in einer Menge enthalten, die 0,2 b:s 2% ihres Gehalts an Gold und Legierungsmetallen entspricht It has surprisingly been found that these disadvantages can be avoided if a small amount of silver is added to the bath. This addition can take the form of potassium silver cyanide or another compound that is compatible with the rest of the bath composition. The concentration of silver in the bath should be between 0.01 and 0.1 g / l. This silver content must ίο be maintained over the entire service life of the bath characterized in that supplementary additives are used which comprise silver in an amount of 0.2 b: s 2% corresponds to their content of gold and alloying metals
1S Beispiel 1 S example
1,5 Gold als Kaliumgoldcyanid
10,5 Kupfer als Cyanidkomplex
ao 0,3 Cadmium als Cyanidkomplex1.5 gold as potassium gold cyanide
10.5 copper as a cyanide complex
ao 0.3 cadmium as cyanide complex
0,05 Silber als Cyanidkomplex
5,0 freies Kaliumcyanid0.05 silver as a cyanide complex
5.0 free potassium cyanide
Die Abscheidung wird z. B. mit einer Stromdichte as von 0,7 A/dm2 während 7 see kathodischer Schaltdauer und mit einer Stromdichte von 1,5 A/dm2 während 1 see anodischer Schaltdauer bei 70° C und Warenbewegung vorgenommen. Der Ergänzungszusatz enthält die Legierungspartner beispielsweise in folgenden Mengenverhältnissen:The deposition is z. B. made with a current density as of 0.7 A / dm 2 during 7 seconds cathodic switching time and with a current density of 1.5 A / dm 2 during 1 second anodic switching time at 70 ° C and goods movement. The supplementary additive contains the alloying partners in the following proportions, for example:
740/0 Gold
15°/o Kupfer
10% Cadmium
l«/o Silber740/0 gold
15 per cent copper
10% cadmium
l «/ o silver
Ein Teil der Legierungsmetalle liegt im Ergänzungszusatz in Form eines einfachen, nicht-eyanidischen,
in wäßriger Lösung sauer reagierenden Salzes vor, um den Gehalt des Bads an freiem Cyanid und
den pH-Wert innerhalb der erforderlichen Grenzen zu halten. Der Silbergehalt des Bads kann zusammen
mit den übrigen Metallen oder separat ergänzt werden.
Man erhält auch bei Schichtdicken von 20 μΐη oder
mehr in einem relativ breiten Glanzstromdichtebereich hochglänzende, glatte, gelbe bis rote, etwa 18-karätige
Goldüberzüge besonders hoher Härte.Some of the alloy metals are present in the supplementary additive in the form of a simple, non-eyanidic salt which reacts acidic in aqueous solution in order to keep the content of free cyanide in the bath and the pH value within the required limits. The silver content of the bath can be added together with the other metals or separately.
Even with layer thicknesses of 20 μm or more, high-gloss, smooth, yellow to red, approximately 18-carat gold coatings of particularly high hardness are obtained in a relatively broad gloss current density range.
Claims (2)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19681771712 DE1771712C3 (en) | 1968-06-28 | Process for the galvanic deposition of gold-copper-cadmium alloy coatings | |
CH588369A CH522740A (en) | 1968-06-28 | 1969-04-18 | Process for the electrodeposition of gold-copper-cadmium alloy coatings |
NL6906666A NL6906666A (en) | 1968-06-28 | 1969-05-01 | |
US826280A US3586611A (en) | 1968-06-28 | 1969-05-20 | Process for the electrolytic deposition of gold-copper-cadmium alloys |
FR6919987A FR2011755A1 (en) | 1968-06-28 | 1969-06-16 | |
GB31750/69A GB1279141A (en) | 1968-06-28 | 1969-06-24 | A process for the electrodeposition of gold-copper-cadmium alloy coatings |
SE9091/69A SE345697B (en) | 1968-06-28 | 1969-06-26 | |
AT617369A AT283841B (en) | 1968-06-28 | 1969-06-27 | Process for the electrodeposition of gold-copper-cadmium alloy coatings |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19681771712 DE1771712C3 (en) | 1968-06-28 | Process for the galvanic deposition of gold-copper-cadmium alloy coatings |
Publications (3)
Publication Number | Publication Date |
---|---|
DE1771712A1 DE1771712A1 (en) | 1972-01-13 |
DE1771712B2 true DE1771712B2 (en) | 1975-07-31 |
DE1771712C3 DE1771712C3 (en) | 1976-03-11 |
Family
ID=
Also Published As
Publication number | Publication date |
---|---|
DE1771712A1 (en) | 1972-01-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C3 | Grant after two publication steps (3rd publication) | ||
E77 | Valid patent as to the heymanns-index 1977 |