CH494824A - Process for the electrodeposition of copper with high ductility - Google Patents

Process for the electrodeposition of copper with high ductility

Info

Publication number
CH494824A
CH494824A CH1056369A CH1056369A CH494824A CH 494824 A CH494824 A CH 494824A CH 1056369 A CH1056369 A CH 1056369A CH 1056369 A CH1056369 A CH 1056369A CH 494824 A CH494824 A CH 494824A
Authority
CH
Switzerland
Prior art keywords
electrodeposition
copper
high ductility
ductility
Prior art date
Application number
CH1056369A
Other languages
German (de)
Inventor
Fluehmann Werner
Original Assignee
Fluehmann Werner
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fluehmann Werner filed Critical Fluehmann Werner
Priority to CH1056369A priority Critical patent/CH494824A/en
Priority to US52730A priority patent/US3660251A/en
Priority to DE19702034144 priority patent/DE2034144A1/en
Priority to GB3335270A priority patent/GB1316846A/en
Priority to AT626370A priority patent/AT302763B/en
Priority to FR707025502A priority patent/FR2051660B3/fr
Priority to NL7010237A priority patent/NL7010237A/xx
Publication of CH494824A publication Critical patent/CH494824A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/06—Filtering particles other than ions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
CH1056369A 1969-07-10 1969-07-10 Process for the electrodeposition of copper with high ductility CH494824A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CH1056369A CH494824A (en) 1969-07-10 1969-07-10 Process for the electrodeposition of copper with high ductility
US52730A US3660251A (en) 1969-07-10 1970-07-06 Method for the electrolytical deposition of highly ductile copper
DE19702034144 DE2034144A1 (en) 1969-07-10 1970-07-09 Process for the electrolytic deposition of pore-free copper of high ductility and purity
GB3335270A GB1316846A (en) 1969-07-10 1970-07-09 Method for the electrolytical deposition of highly ductile copper
AT626370A AT302763B (en) 1969-07-10 1970-07-09 Process for the production of pore-free metallic copper coatings of high ductility
FR707025502A FR2051660B3 (en) 1969-07-10 1970-07-09
NL7010237A NL7010237A (en) 1969-07-10 1970-07-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1056369A CH494824A (en) 1969-07-10 1969-07-10 Process for the electrodeposition of copper with high ductility

Publications (1)

Publication Number Publication Date
CH494824A true CH494824A (en) 1970-08-15

Family

ID=4364536

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1056369A CH494824A (en) 1969-07-10 1969-07-10 Process for the electrodeposition of copper with high ductility

Country Status (7)

Country Link
US (1) US3660251A (en)
AT (1) AT302763B (en)
CH (1) CH494824A (en)
DE (1) DE2034144A1 (en)
FR (1) FR2051660B3 (en)
GB (1) GB1316846A (en)
NL (1) NL7010237A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2336495A1 (en) * 1975-12-23 1977-07-22 Messerschmitt Boelkow Blohm Nickel electrodeposit with low sulphur content - is ductile and weldable, and obtained from purified nickel sulphamate-nickel chloride solution
FR2531458A1 (en) * 1982-08-04 1984-02-10 Stephanois Rech Mec PROCESS FOR SURFACE TREATMENT OF FERROUS SURFACES TO IMPROVE THEIR FRICTION QUALITY AND RESISTANCE TO WEAR AND INJURY
US4532014A (en) * 1984-11-13 1985-07-30 Olin Corporation Laser alignment system
US4549950A (en) * 1984-11-13 1985-10-29 Olin Corporation Systems for producing electroplated and/or treated metal foil
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
EP0207244A2 (en) * 1985-07-05 1987-01-07 Mitsui Mining & Smelting Co., Ltd. Electrodeposited copper foil
EP0283681A1 (en) * 1987-02-23 1988-09-28 Siemens Aktiengesellschaft Apparatus for bump-plating chips

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956053A (en) * 1988-05-26 1990-09-11 Olin Corporation Apparatus and process for the production of micro-pore free high ductility metal foil
EP0823719B1 (en) * 1996-07-26 2002-06-05 Nec Corporation Solid electrolytic capacitor having pre-plated lead terminals and manufacturing process thereof
GB2564149A (en) * 2017-07-05 2019-01-09 Skf Ab Electroplated cage for rolling element bearing

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA715549A (en) * 1965-08-10 Martin Rudolf Electro-deposition assemblies
US1798994A (en) * 1929-01-04 1931-03-31 Gen Electric Electroplating apparatus
US3222268A (en) * 1961-07-13 1965-12-07 Udylite Corp Particle separator device for plating baths
NL281922A (en) * 1961-08-10
US3208921A (en) * 1962-01-02 1965-09-28 Sperry Rand Corp Method for making printed circuit boards
US3186932A (en) * 1962-12-10 1965-06-01 Audio Matrix Inc Apparatus for forming phonograph record masters, mothers, and stampers
US3532801A (en) * 1965-02-23 1970-10-06 Burroughs Corp Method and apparatus for fabricating laminated circuit boards

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2336495A1 (en) * 1975-12-23 1977-07-22 Messerschmitt Boelkow Blohm Nickel electrodeposit with low sulphur content - is ductile and weldable, and obtained from purified nickel sulphamate-nickel chloride solution
FR2531458A1 (en) * 1982-08-04 1984-02-10 Stephanois Rech Mec PROCESS FOR SURFACE TREATMENT OF FERROUS SURFACES TO IMPROVE THEIR FRICTION QUALITY AND RESISTANCE TO WEAR AND INJURY
US4532014A (en) * 1984-11-13 1985-07-30 Olin Corporation Laser alignment system
US4549950A (en) * 1984-11-13 1985-10-29 Olin Corporation Systems for producing electroplated and/or treated metal foil
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
EP0207244A2 (en) * 1985-07-05 1987-01-07 Mitsui Mining & Smelting Co., Ltd. Electrodeposited copper foil
EP0207244A3 (en) * 1985-07-05 1988-05-25 Mitsui Mining & Smelting Co., Ltd. Electrodeposited copper foil
EP0283681A1 (en) * 1987-02-23 1988-09-28 Siemens Aktiengesellschaft Apparatus for bump-plating chips

Also Published As

Publication number Publication date
NL7010237A (en) 1971-01-12
US3660251A (en) 1972-05-02
DE2034144A1 (en) 1971-02-11
AT302763B (en) 1972-10-25
GB1316846A (en) 1973-05-16
FR2051660A7 (en) 1971-04-09
FR2051660B3 (en) 1973-04-27

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Legal Events

Date Code Title Description
PL Patent ceased