GB1316846A - Method for the electrolytical deposition of highly ductile copper - Google Patents
Method for the electrolytical deposition of highly ductile copperInfo
- Publication number
- GB1316846A GB1316846A GB3335270A GB3335270A GB1316846A GB 1316846 A GB1316846 A GB 1316846A GB 3335270 A GB3335270 A GB 3335270A GB 3335270 A GB3335270 A GB 3335270A GB 1316846 A GB1316846 A GB 1316846A
- Authority
- GB
- United Kingdom
- Prior art keywords
- bath
- copper
- july
- passing
- electrolysis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
1316846 Electrolytic deposition of copper WERNER FLUHMANN GALVANISCHE ANSTALT 9 July 1970 [10 July 1969] 33352/70 Heading C7B Copper is electrolytically deposited from a bath comprising copper pyrophosphate and/or the combination of copper sulphate and potassium pyrophosphate. The method includes (a) before starting electrolysis, passing the bath through at least one micropore filter, and (b) during electrolysis passing the bath through at least one micropore filter, the steps (a) and (b) serving to hold the bath constantly free during electrolysis from particles having a grain size exceeding 3 microns. Thereby the deposited copper is pore-free, has a ductility of more than 6% measured as ultimate linear elongation at room temperature and has a total impurity content of less than 100 ppm. Before step (a), the bath may be purified with an adsorption agent such as active carbon, silica gel, alumina or a molecular sieve. During step (b), the bath temperature may be 30-75‹C and the pH be 7-9. The electrolysing current may be periodically interrupted or its polarity be periodically changed. Alternatively, alternating current may be superimposed on direct current. The method may be used in making printed circuits, the substrate first being rendered conductive.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH1056369A CH494824A (en) | 1969-07-10 | 1969-07-10 | Process for the electrodeposition of copper with high ductility |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1316846A true GB1316846A (en) | 1973-05-16 |
Family
ID=4364536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3335270A Expired GB1316846A (en) | 1969-07-10 | 1970-07-09 | Method for the electrolytical deposition of highly ductile copper |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3660251A (en) |
| AT (1) | AT302763B (en) |
| CH (1) | CH494824A (en) |
| DE (1) | DE2034144A1 (en) |
| FR (1) | FR2051660B3 (en) |
| GB (1) | GB1316846A (en) |
| NL (1) | NL7010237A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2558423B2 (en) * | 1975-12-23 | 1978-09-07 | Messerschmitt-Boelkow-Blohm Gmbh, 8000 Muenchen | Process for the electrodeposition of nickel from a nickel sulfamate bath |
| FR2531458A1 (en) * | 1982-08-04 | 1984-02-10 | Stephanois Rech Mec | PROCESS FOR SURFACE TREATMENT OF FERROUS SURFACES TO IMPROVE THEIR FRICTION QUALITY AND RESISTANCE TO WEAR AND INJURY |
| US4568431A (en) * | 1984-11-13 | 1986-02-04 | Olin Corporation | Process for producing electroplated and/or treated metal foil |
| US4532014A (en) * | 1984-11-13 | 1985-07-30 | Olin Corporation | Laser alignment system |
| US4549950A (en) * | 1984-11-13 | 1985-10-29 | Olin Corporation | Systems for producing electroplated and/or treated metal foil |
| DE3687089T3 (en) * | 1985-07-05 | 1999-10-07 | Mitsui Mining & Smelting Co., Ltd. | Process for producing copper foil by electrodeposition. |
| DE3870685D1 (en) * | 1987-02-23 | 1992-06-11 | Siemens Ag | GALVANIZING DEVICE FOR GENERATING BUMPER ON CHIP COMPONENTS. |
| US4956053A (en) * | 1988-05-26 | 1990-09-11 | Olin Corporation | Apparatus and process for the production of micro-pore free high ductility metal foil |
| DE69712999T2 (en) * | 1996-07-26 | 2003-01-23 | Nec Corp., Tokio/Tokyo | Solid electrolytic capacitor with pre-plated conductor connections and its manufacturing process |
| GB2564149A (en) * | 2017-07-05 | 2019-01-09 | Skf Ab | Electroplated cage for rolling element bearing |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA715549A (en) * | 1965-08-10 | Martin Rudolf | Electro-deposition assemblies | |
| US1798994A (en) * | 1929-01-04 | 1931-03-31 | Gen Electric | Electroplating apparatus |
| US3222268A (en) * | 1961-07-13 | 1965-12-07 | Udylite Corp | Particle separator device for plating baths |
| BE621297A (en) * | 1961-08-10 | |||
| US3208921A (en) * | 1962-01-02 | 1965-09-28 | Sperry Rand Corp | Method for making printed circuit boards |
| US3186932A (en) * | 1962-12-10 | 1965-06-01 | Audio Matrix Inc | Apparatus for forming phonograph record masters, mothers, and stampers |
| US3532801A (en) * | 1965-02-23 | 1970-10-06 | Burroughs Corp | Method and apparatus for fabricating laminated circuit boards |
-
1969
- 1969-07-10 CH CH1056369A patent/CH494824A/en not_active IP Right Cessation
-
1970
- 1970-07-06 US US52730A patent/US3660251A/en not_active Expired - Lifetime
- 1970-07-09 GB GB3335270A patent/GB1316846A/en not_active Expired
- 1970-07-09 FR FR707025502A patent/FR2051660B3/fr not_active Expired
- 1970-07-09 AT AT626370A patent/AT302763B/en not_active IP Right Cessation
- 1970-07-09 DE DE19702034144 patent/DE2034144A1/en active Pending
- 1970-07-10 NL NL7010237A patent/NL7010237A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CH494824A (en) | 1970-08-15 |
| FR2051660A7 (en) | 1971-04-09 |
| NL7010237A (en) | 1971-01-12 |
| FR2051660B3 (en) | 1973-04-27 |
| AT302763B (en) | 1972-10-25 |
| DE2034144A1 (en) | 1971-02-11 |
| US3660251A (en) | 1972-05-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |