CH564093A5 - - Google Patents

Info

Publication number
CH564093A5
CH564093A5 CH1705170A CH1705170A CH564093A5 CH 564093 A5 CH564093 A5 CH 564093A5 CH 1705170 A CH1705170 A CH 1705170A CH 1705170 A CH1705170 A CH 1705170A CH 564093 A5 CH564093 A5 CH 564093A5
Authority
CH
Switzerland
Application number
CH1705170A
Inventor
M Paunovic
Original Assignee
Kollmorgen Photocircuits
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Photocircuits filed Critical Kollmorgen Photocircuits
Publication of CH564093A5 publication Critical patent/CH564093A5/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
CH1705170A 1969-11-20 1970-11-17 CH564093A5 (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US87856569A 1969-11-20 1969-11-20

Publications (1)

Publication Number Publication Date
CH564093A5 true CH564093A5 (xx) 1975-07-15

Family

ID=25372291

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1705170A CH564093A5 (xx) 1969-11-20 1970-11-17

Country Status (10)

Country Link
JP (1) JPS503742B1 (xx)
AT (1) AT304219B (xx)
CA (1) CA925252A (xx)
CH (1) CH564093A5 (xx)
DE (1) DE2057757C3 (xx)
DK (1) DK138185B (xx)
FR (1) FR2069551A5 (xx)
GB (1) GB1305468A (xx)
NL (1) NL164905C (xx)
SE (1) SE375334B (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0081129A1 (de) * 1981-12-05 1983-06-15 Bayer Ag Verfahren zur Aktivierung von Substratoberflächen für die stromlose Metallisierung

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427848A (en) * 1977-07-29 1979-03-02 Kenji Sawayama Hanger for overcoat and undercoat
GB8703664D0 (en) * 1987-02-17 1987-03-25 Green A Electroless silver plating composition
DE4021681A1 (de) * 1989-07-12 1991-03-14 Kojima Chemicals Co Ltd Nichtelektrolytische goldplattierloesung
WO1994008276A1 (en) * 1992-09-28 1994-04-14 Ducoa L.P. Photoresist stripping process using n,n-dimethyl-bis(2-hydroxyethyl) quaternary ammonium hydroxide
EP2978873B1 (en) * 2013-03-27 2016-12-28 ATOTECH Deutschland GmbH Electroless copper plating solution
CN115787003A (zh) * 2022-12-10 2023-03-14 漳州市东龙电子科技有限公司 一种三价铬电镀液

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0081129A1 (de) * 1981-12-05 1983-06-15 Bayer Ag Verfahren zur Aktivierung von Substratoberflächen für die stromlose Metallisierung
US4764401A (en) * 1981-12-05 1988-08-16 Bayer Aktiengesellschaft Process for activating substrate surfaces for electroless metallization

Also Published As

Publication number Publication date
DE2057757C3 (de) 1974-05-16
SE375334B (xx) 1975-04-14
CA925252A (en) 1973-05-01
GB1305468A (xx) 1973-01-31
NL164905C (nl) 1981-02-16
DE2057757B2 (de) 1973-10-11
FR2069551A5 (xx) 1971-09-03
NL7016919A (xx) 1971-05-24
AT304219B (de) 1972-12-27
DK138185C (xx) 1979-01-02
DK138185B (da) 1978-07-24
NL164905B (nl) 1980-09-15
JPS503742B1 (xx) 1975-02-08
DE2057757A1 (de) 1971-06-24

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Legal Events

Date Code Title Description
PL Patent ceased