DK138185B - Bath for electroless deposition of metals. - Google Patents

Bath for electroless deposition of metals.

Info

Publication number
DK138185B
DK138185B DK587270A DK587270A DK138185B DK 138185 B DK138185 B DK 138185B DK 587270 A DK587270 A DK 587270A DK 587270 A DK587270 A DK 587270A DK 138185 B DK138185 B DK 138185B
Authority
DK
Denmark
Prior art keywords
bath
metals
electroless deposition
electroless
deposition
Prior art date
Application number
DK587270A
Other languages
Danish (da)
Other versions
DK138185C (en
Inventor
Milan Paunovic
Original Assignee
Kollmorgen Photocircuits
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Photocircuits filed Critical Kollmorgen Photocircuits
Publication of DK138185B publication Critical patent/DK138185B/en
Application granted granted Critical
Publication of DK138185C publication Critical patent/DK138185C/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
DK587270A 1969-11-20 1970-11-19 Bath for electroless deposition of metals. DK138185B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US87856569A 1969-11-20 1969-11-20

Publications (2)

Publication Number Publication Date
DK138185B true DK138185B (en) 1978-07-24
DK138185C DK138185C (en) 1979-01-02

Family

ID=25372291

Family Applications (1)

Application Number Title Priority Date Filing Date
DK587270A DK138185B (en) 1969-11-20 1970-11-19 Bath for electroless deposition of metals.

Country Status (10)

Country Link
JP (1) JPS503742B1 (en)
AT (1) AT304219B (en)
CA (1) CA925252A (en)
CH (1) CH564093A5 (en)
DE (1) DE2057757C3 (en)
DK (1) DK138185B (en)
FR (1) FR2069551A5 (en)
GB (1) GB1305468A (en)
NL (1) NL164905C (en)
SE (1) SE375334B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427848A (en) * 1977-07-29 1979-03-02 Kenji Sawayama Hanger for overcoat and undercoat
DE3148280A1 (en) * 1981-12-05 1983-06-09 Bayer Ag, 5090 Leverkusen METHOD FOR ACTIVATING SUBSTRATE SURFACES FOR ELECTRIC METALLIZATION
GB8703664D0 (en) * 1987-02-17 1987-03-25 Green A Electroless silver plating composition
DE4021681A1 (en) * 1989-07-12 1991-03-14 Kojima Chemicals Co Ltd NON-ELECTROLYTIC GOLD PLATTLER SOLUTION
EP0662223A1 (en) * 1992-09-28 1995-07-12 Ducoa L.P. Photoresist stripping process using n,n-dimethyl-bis(2-hydroxyethyl) quaternary ammonium hydroxide
US20160273112A1 (en) * 2013-03-27 2016-09-22 Atotech Deutschland Gmbh Electroless copper plating solution

Also Published As

Publication number Publication date
DE2057757C3 (en) 1974-05-16
NL7016919A (en) 1971-05-24
AT304219B (en) 1972-12-27
NL164905C (en) 1981-02-16
SE375334B (en) 1975-04-14
DK138185C (en) 1979-01-02
FR2069551A5 (en) 1971-09-03
NL164905B (en) 1980-09-15
DE2057757B2 (en) 1973-10-11
CA925252A (en) 1973-05-01
JPS503742B1 (en) 1975-02-08
DE2057757A1 (en) 1971-06-24
GB1305468A (en) 1973-01-31
CH564093A5 (en) 1975-07-15

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