DK130725B - Bath for electroless separation of copper, silver or gold coatings on wearer surfaces. - Google Patents

Bath for electroless separation of copper, silver or gold coatings on wearer surfaces.

Info

Publication number
DK130725B
DK130725B DK317265A DK317265A DK130725B DK 130725 B DK130725 B DK 130725B DK 317265 A DK317265 A DK 317265A DK 317265 A DK317265 A DK 317265A DK 130725 B DK130725 B DK 130725B
Authority
DK
Denmark
Prior art keywords
wearer
silver
bath
copper
gold coatings
Prior art date
Application number
DK317265A
Other languages
Danish (da)
Other versions
DK130725C (en
Inventor
J F Mccormack
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of DK130725B publication Critical patent/DK130725B/en
Application granted granted Critical
Publication of DK130725C publication Critical patent/DK130725C/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DK317265A 1964-06-24 1965-06-23 Bath for electroless separation of copper, silver or gold coatings on wearer surfaces. DK130725B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US37750964A 1964-06-24 1964-06-24

Publications (2)

Publication Number Publication Date
DK130725B true DK130725B (en) 1975-04-01
DK130725C DK130725C (en) 1975-09-01

Family

ID=23489393

Family Applications (1)

Application Number Title Priority Date Filing Date
DK317265A DK130725B (en) 1964-06-24 1965-06-23 Bath for electroless separation of copper, silver or gold coatings on wearer surfaces.

Country Status (4)

Country Link
JP (1) JPS5020012B1 (en)
DK (1) DK130725B (en)
GB (1) GB1058915A (en)
SE (1) SE316667B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA945305A (en) * 1970-04-20 1974-04-16 Frederick W. Schneble (Jr.) Electroless silver plating
DE3707817A1 (en) * 1987-03-09 1988-09-22 Schering Ag STABILIZED ALKALINE GOLD BATH FOR ELECTRIC DEPOSIT OF GOLD
JP5840454B2 (en) * 2011-10-27 2016-01-06 上村工業株式会社 Reduced electroless silver plating solution and reduced electroless silver plating method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3062666A (en) * 1958-11-26 1962-11-06 Du Pont Bath compositions for the chemical reductive plating of nickel-boron and cobalt-boron alloys

Also Published As

Publication number Publication date
SE316667B (en) 1969-10-27
JPS5020012B1 (en) 1975-07-11
GB1058915A (en) 1967-02-15
DK130725C (en) 1975-09-01

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