DK130725B - Bad til strømløs udskillelse af overtræk af kobber, sølv eller guld på overflader af bærere. - Google Patents
Bad til strømløs udskillelse af overtræk af kobber, sølv eller guld på overflader af bærere.Info
- Publication number
- DK130725B DK130725B DK317265A DK317265A DK130725B DK 130725 B DK130725 B DK 130725B DK 317265 A DK317265 A DK 317265A DK 317265 A DK317265 A DK 317265A DK 130725 B DK130725 B DK 130725B
- Authority
- DK
- Denmark
- Prior art keywords
- wearer
- silver
- bath
- copper
- gold coatings
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37750964A | 1964-06-24 | 1964-06-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
DK130725B true DK130725B (da) | 1975-04-01 |
DK130725C DK130725C (da) | 1975-09-01 |
Family
ID=23489393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK317265A DK130725B (da) | 1964-06-24 | 1965-06-23 | Bad til strømløs udskillelse af overtræk af kobber, sølv eller guld på overflader af bærere. |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5020012B1 (da) |
DK (1) | DK130725B (da) |
GB (1) | GB1058915A (da) |
SE (1) | SE316667B (da) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA945305A (en) * | 1970-04-20 | 1974-04-16 | Frederick W. Schneble (Jr.) | Electroless silver plating |
DE3707817A1 (de) * | 1987-03-09 | 1988-09-22 | Schering Ag | Stabilisiertes alkalisches goldbad zur stromlosen abscheidung von gold |
JP5840454B2 (ja) * | 2011-10-27 | 2016-01-06 | 上村工業株式会社 | 還元型無電解銀めっき液及び還元型無電解銀めっき方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3062666A (en) * | 1958-11-26 | 1962-11-06 | Du Pont | Bath compositions for the chemical reductive plating of nickel-boron and cobalt-boron alloys |
-
1965
- 1965-04-17 JP JP2289865A patent/JPS5020012B1/ja active Pending
- 1965-06-22 GB GB2627365A patent/GB1058915A/en not_active Expired
- 1965-06-23 SE SE836365A patent/SE316667B/xx unknown
- 1965-06-23 DK DK317265A patent/DK130725B/da unknown
Also Published As
Publication number | Publication date |
---|---|
JPS5020012B1 (da) | 1975-07-11 |
DK130725C (da) | 1975-09-01 |
GB1058915A (en) | 1967-02-15 |
SE316667B (da) | 1969-10-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DK105901C (da) | Bad til strømløs udskillelse af kobberovertræk på overflader af bærere. | |
DK129949B (da) | Fremgangsmåde til stabilisering af et vandigt bad til strømløs afsætning af kobber, nikkel, cobalt, cadmium eller tin på overflader af bærere. | |
DK112949B (da) | Fremgangsmåde til fremstilling af O-mycaminosyl-tylonolid eller dihydro-O-mycaminosyl-tylonolid. | |
DK139590B (da) | Strømløs kobberafsætningsopløsning. | |
DK107852C (da) | Bad til strømløs udskillelse af kobberovertræk på overflader af bærere. | |
AT293132B (de) | Stabilisiertes reduktives Nickelbad | |
DK130725B (da) | Bad til strømløs udskillelse af overtræk af kobber, sølv eller guld på overflader af bærere. | |
DK136607B (da) | Analogifremgangsmåde til fremstilling af menadion-bisulfitderivater. | |
DK138185B (da) | Bad til strømløs afsætning af metaller. | |
DK115932B (da) | Mekanisme til fastgørelse eller forbindelse af elektrisk ledninger, tråde, kabler eller lignende elementer. | |
DK119881B (da) | Fremgangsmåde til fremstilling af L-α-methyl-3,4-dihydroxyphenylalanin. | |
CH464643A (de) | Stabilisiertes Bad zur chemischen Verkupferung | |
DK115320B (da) | Fremgangsmåde og anlæg til fremstilling af alkalimetalboranater eller blandinger, der indeholder sådanne. | |
DK134608B (da) | Kobberlegering. | |
DK131478B (da) | Bad til strømløs udskillelse af kobberovertræk på overflader af bærere. | |
DK116736B (da) | Fremgangsmåde til fremstilling af 5-chlor-2,3-pyridindiol. | |
DK125717B (da) | Flydende overtræksmiddel til elektroforetisk overtrækning af metaller eller andre elektrisk ledende genstande. | |
DK106946C (da) | Fremgangsmåde til fremstilling af olieopløselige podecopolymere på acrylatbasis med dispergerende virkning. | |
DK118474B (da) | Fremgangsmåde til fremstilling af elektriske kredsløbskomplekser. | |
DK105462C (da) | Fremgangsmåde til fremstilling af O-acetyl-3,5-dimethylbenzheparid eller alkalimetalsalte heraf. | |
DK113285B (da) | Fremgangsmåde til fremstilling af α-acetyleniske, ω-halogenerede ketoner. | |
DK116665B (da) | Fremgangsmåde til fremstilling af picrater af β-amino-arylethylketoner. | |
DK107370C (da) | Fremgangsmåde til fremstilling af hexadecahalogenokobberphthalocyaniner. | |
DK111045B (da) | Fremgangsmåde til metalplettering af formstoffer. | |
DK86082C (da) | Bad til elektrolytisk glansudskillelse af solv eller guld eller deres legeringer af cyanidopløsninger. |