DK107852C - Bad til strømløs udskillelse af kobberovertræk på overflader af bærere. - Google Patents

Bad til strømløs udskillelse af kobberovertræk på overflader af bærere.

Info

Publication number
DK107852C
DK107852C DK295164AA DK295164A DK107852C DK 107852 C DK107852 C DK 107852C DK 295164A A DK295164A A DK 295164AA DK 295164 A DK295164 A DK 295164A DK 107852 C DK107852 C DK 107852C
Authority
DK
Denmark
Prior art keywords
carriers
bath
copper coatings
electroless
separation
Prior art date
Application number
DK295164AA
Other languages
English (en)
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Application granted granted Critical
Publication of DK107852C publication Critical patent/DK107852C/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
DK295164AA 1963-06-12 1964-06-11 Bad til strømløs udskillelse af kobberovertræk på overflader af bærere. DK107852C (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US287220A US3326700A (en) 1963-06-12 1963-06-12 Electroless copper plating

Publications (1)

Publication Number Publication Date
DK107852C true DK107852C (da) 1967-07-10

Family

ID=23101954

Family Applications (1)

Application Number Title Priority Date Filing Date
DK295164AA DK107852C (da) 1963-06-12 1964-06-11 Bad til strømløs udskillelse af kobberovertræk på overflader af bærere.

Country Status (6)

Country Link
US (1) US3326700A (da)
DE (1) DE1521434A1 (da)
DK (1) DK107852C (da)
GB (1) GB1070328A (da)
NL (1) NL147191B (da)
SE (1) SE314266B (da)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3408226A (en) * 1965-02-03 1968-10-29 Minnesota Mining & Mfg Metal-simulating film product
US3416992A (en) * 1965-06-28 1968-12-17 Dow Chemical Co Molded plastic article
US3485643A (en) * 1966-05-06 1969-12-23 Photocircuits Corp Electroless copper plating
DE1521350C3 (de) * 1966-08-06 1975-09-11 Hoechst Ag, 6000 Frankfurt Verfahren zur chemischen Vernickelung von nichtmetallischen Gegenständen
DE1621206B2 (de) * 1967-01-18 1971-12-16 Friedr. Blasberg Gmbh & Co, Kg, 5650 Solingen Verfahren zur beschichtung gleitend reibend auf verschleiss beanspruchter werkstuecke
US3457089A (en) * 1967-04-07 1969-07-22 Shipley Co Electroless copperplating
US3765936A (en) * 1968-08-13 1973-10-16 Shipley Co Electroless copper plate
USRE31694E (en) * 1976-02-19 1984-10-02 Macdermid Incorporated Apparatus and method for automatically maintaining an electroless copper plating bath
US4096301A (en) * 1976-02-19 1978-06-20 Macdermid Incorporated Apparatus and method for automatically maintaining an electroless copper plating bath
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
US4857233A (en) * 1988-05-26 1989-08-15 Potters Industries, Inc. Nickel particle plating system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2773022A (en) * 1953-08-17 1956-12-04 Westinghouse Electric Corp Electrodeposition from copper electrolytes containing dithiocarbamate addition agents
US2938805A (en) * 1958-03-31 1960-05-31 Gen Electric Process of stabilizing autocatalytic copper plating solutions
US2996408A (en) * 1958-03-31 1961-08-15 Gen Electric Copper plating process and solution
US2956901A (en) * 1958-08-06 1960-10-18 Alpha Metal Lab Inc Copper coating composition and method of coating
US3095309A (en) * 1960-05-03 1963-06-25 Day Company Electroless copper plating
US3230098A (en) * 1962-10-09 1966-01-18 Engelhard Ind Inc Immersion plating with noble metals

Also Published As

Publication number Publication date
NL6406669A (da) 1964-12-14
US3326700A (en) 1967-06-20
SE314266B (da) 1969-09-01
GB1070328A (en) 1967-06-01
NL147191B (nl) 1975-09-15
DE1521434A1 (de) 1971-10-14

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