GB1070328A - Electroless copper plating - Google Patents
Electroless copper platingInfo
- Publication number
- GB1070328A GB1070328A GB23758/64A GB2375864A GB1070328A GB 1070328 A GB1070328 A GB 1070328A GB 23758/64 A GB23758/64 A GB 23758/64A GB 2375864 A GB2375864 A GB 2375864A GB 1070328 A GB1070328 A GB 1070328A
- Authority
- GB
- United Kingdom
- Prior art keywords
- moles
- solutions
- complexing agent
- copper plating
- salts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
An aqueous alkaline copper plating solution comprises e.g 0.002 to 0.15 moles of a water soluble copper salt; 0.03 to 1.3 moles of formaldehyde; 0.7 to 2.5 times the moles of copper of nitrilotriacetic acid or its salts; 0.00001 to 0.06 moles of a cuprous complexing agent; alkali metal hydroxide to give a pH of 10 to 13.3 and water to 1 litre. The cuprous complexing agent may be one of:- cyanides such as those of sodium and potassium; organic nitriles such as chloroacetonitrile; alpha hydroxynitriles such as glycolnitrile and laconitrile; and dinitriles such as succinonitrile, iminodiacetonitrile, and 3, 3' - iminodipropionitrile. Less than 5 g/1 of surfactants such as organic phosphate esters and oxyethylated sodium salts may also be added. The solutions are preferably used at 25 DEG -65 DEG C. The surfaces coated may be metal such as steel and stainless steel, ceramics, insulating material and plastics such as epoxy or polyethylene terephthalate, polystyrene, nylon, melamine resin. The plastic materials are first treated with solutions of stannous chloride and palladium chloride.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US287220A US3326700A (en) | 1963-06-12 | 1963-06-12 | Electroless copper plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1070328A true GB1070328A (en) | 1967-06-01 |
Family
ID=23101954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB23758/64A Expired GB1070328A (en) | 1963-06-12 | 1964-06-09 | Electroless copper plating |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3326700A (en) |
| DE (1) | DE1521434A1 (en) |
| DK (1) | DK107852C (en) |
| GB (1) | GB1070328A (en) |
| NL (1) | NL147191B (en) |
| SE (1) | SE314266B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3408226A (en) * | 1965-02-03 | 1968-10-29 | Minnesota Mining & Mfg | Metal-simulating film product |
| US3416992A (en) * | 1965-06-28 | 1968-12-17 | Dow Chemical Co | Molded plastic article |
| US3485643A (en) * | 1966-05-06 | 1969-12-23 | Photocircuits Corp | Electroless copper plating |
| DE1521350C3 (en) * | 1966-08-06 | 1975-09-11 | Hoechst Ag, 6000 Frankfurt | Process for chemical nickel plating of non-metallic objects |
| DE1621206B2 (en) * | 1967-01-18 | 1971-12-16 | Friedr. Blasberg Gmbh & Co, Kg, 5650 Solingen | PROCESS FOR COATING WITH SLIDING FRICTION ON WORKPIECES STRESSED BY WEAR |
| US3457089A (en) * | 1967-04-07 | 1969-07-22 | Shipley Co | Electroless copperplating |
| US3765936A (en) * | 1968-08-13 | 1973-10-16 | Shipley Co | Electroless copper plate |
| USRE31694E (en) * | 1976-02-19 | 1984-10-02 | Macdermid Incorporated | Apparatus and method for automatically maintaining an electroless copper plating bath |
| US4096301A (en) * | 1976-02-19 | 1978-06-20 | Macdermid Incorporated | Apparatus and method for automatically maintaining an electroless copper plating bath |
| US4666858A (en) * | 1984-10-22 | 1987-05-19 | International Business Machines Corporation | Determination of amount of anionic material in a liquid sample |
| US4857233A (en) * | 1988-05-26 | 1989-08-15 | Potters Industries, Inc. | Nickel particle plating system |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2773022A (en) * | 1953-08-17 | 1956-12-04 | Westinghouse Electric Corp | Electrodeposition from copper electrolytes containing dithiocarbamate addition agents |
| US2996408A (en) * | 1958-03-31 | 1961-08-15 | Gen Electric | Copper plating process and solution |
| US2938805A (en) * | 1958-03-31 | 1960-05-31 | Gen Electric | Process of stabilizing autocatalytic copper plating solutions |
| US2956901A (en) * | 1958-08-06 | 1960-10-18 | Alpha Metal Lab Inc | Copper coating composition and method of coating |
| US3095309A (en) * | 1960-05-03 | 1963-06-25 | Day Company | Electroless copper plating |
| US3230098A (en) * | 1962-10-09 | 1966-01-18 | Engelhard Ind Inc | Immersion plating with noble metals |
-
1963
- 1963-06-12 US US287220A patent/US3326700A/en not_active Expired - Lifetime
-
1964
- 1964-06-09 GB GB23758/64A patent/GB1070328A/en not_active Expired
- 1964-06-10 DE DE19641521434 patent/DE1521434A1/en active Pending
- 1964-06-11 SE SE7146/64A patent/SE314266B/xx unknown
- 1964-06-11 DK DK295164AA patent/DK107852C/en active
- 1964-06-12 NL NL646406669A patent/NL147191B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE1521434A1 (en) | 1971-10-14 |
| NL6406669A (en) | 1964-12-14 |
| NL147191B (en) | 1975-09-15 |
| DK107852C (en) | 1967-07-10 |
| SE314266B (en) | 1969-09-01 |
| US3326700A (en) | 1967-06-20 |
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