US2956901A - Copper coating composition and method of coating - Google Patents
Copper coating composition and method of coating Download PDFInfo
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- US2956901A US2956901A US753402A US75340258A US2956901A US 2956901 A US2956901 A US 2956901A US 753402 A US753402 A US 753402A US 75340258 A US75340258 A US 75340258A US 2956901 A US2956901 A US 2956901A
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- United States
- Prior art keywords
- solution
- copper
- alkali metal
- cyanide
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000010949 copper Substances 0.000 title claims description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 22
- 229910052802 copper Inorganic materials 0.000 title claims description 22
- 238000000034 method Methods 0.000 title claims description 16
- 239000011248 coating agent Substances 0.000 title claims description 11
- 238000000576 coating method Methods 0.000 title claims description 11
- 239000008199 coating composition Substances 0.000 title description 2
- 239000000243 solution Substances 0.000 claims description 50
- 229910052783 alkali metal Inorganic materials 0.000 claims description 17
- -1 ALKALI METAL SALTS Chemical class 0.000 claims description 14
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 11
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 claims description 11
- 239000003638 chemical reducing agent Substances 0.000 claims description 10
- 229960001484 edetic acid Drugs 0.000 claims description 10
- 150000001340 alkali metals Chemical class 0.000 claims description 6
- GRWZHXKQBITJKP-UHFFFAOYSA-N dithionous acid Chemical compound OS(=O)S(O)=O GRWZHXKQBITJKP-UHFFFAOYSA-N 0.000 claims description 5
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 239000011259 mixed solution Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000004033 plastic Substances 0.000 description 8
- 229920003023 plastic Polymers 0.000 description 8
- 239000007921 spray Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 description 6
- 229910052708 sodium Inorganic materials 0.000 description 5
- 239000011734 sodium Substances 0.000 description 5
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical group [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 4
- 239000004141 Sodium laurylsulphate Substances 0.000 description 4
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 235000010288 sodium nitrite Nutrition 0.000 description 3
- 125000000129 anionic group Chemical group 0.000 description 2
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- JVBXVOWTABLYPX-UHFFFAOYSA-L sodium dithionite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])=O JVBXVOWTABLYPX-UHFFFAOYSA-L 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010288 cold spraying Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000002650 laminated plastic Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- HEZHYQDYRPUXNJ-UHFFFAOYSA-L potassium dithionite Chemical compound [K+].[K+].[O-]S(=O)S([O-])=O HEZHYQDYRPUXNJ-UHFFFAOYSA-L 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910021653 sulphate ion Inorganic materials 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Definitions
- the invention relates to coating surfaces with copper and more particularly relates to a composition and process of spray metallizing conductors and non-conductors with chemically reduced copper.
- An object of this invention is to provide a simple and inexpensive process of providing a smooth, uniform coating of copper.
- Another object is to provide copper solutions and reducer solutions particularly suitable for spray metalliz-
- a further object is to provide copper solutions particularly suitable for making printed circuits.
- aqueous solution of copper cyanide containing at least 2 grams per liter of solution of ethylenediamine tetracetic acid (EDTA) or its sodium or potassium salts, or where no EDTA is used, the solution should contain an alkaline metal cyanide, such as sodium or potassium cyanide in a molar ratio of alkali metal cyanide to copper cyanide of between approximately .2 and 2.89.
- EDTA ethylenediamine tetracetic acid
- the copper solution is used in conjunction with a reducer solution in such manner that the solutions converge on the article to be coated.
- the molar ratio of alkali metal cyanide to Cu (CN) must be below approximately 2.89.
- the lower limit is the lowest ratio in which the Cu (CN) will dissolve and is approximately .2.
- any excess of free NaCN will prevent the reduction of copper.
- the preferred ratio is approximately 2.5.
- the range of EDTA, or its alkali metal salts is about 2 to 12 grams per liter, but it may be omitted entirely when the alkali metal cyanide is present.
- a suitable surface active agent is sodium lauryl sulphate.
- any of the anionic agents are suitable, particularly the fatty alcohol sulphates.
- the reducing solution which we have found gives highly satisfactory results with the copper cyanide solution is an alkaline solution of an alkali metal hydrosulphite, such as sodium or potassium hydrosulphite.
- the hydrosulphite can be present in between approximately 10 to 50 grams per liter of solution with between approximately 2 to 15 grams per liter of an alkali metal hydroxide.
- an alkali metal nitrite is also present as a stabilizer for the hydrosulphite, particularly when the copper solution and reducer solution are air atomized by spraying with air through nozzles.
- a suitable con- 2,956,90l Patented Oct. 18, 1960 centration of nitrite is 5 to 10 grams per liter.
- the molar ratio of Na S O to NaNO can range from .3 to 2.0 for good operation.
- the temperatures of the solutions can vary widely. Satisfactory results have been obtained with metal solutions at 68 F. to 180 F., and reducer solutions at 68 F. to F.
- the spray application can be done by air atomization of solutions, air pressure feed of spray nozzles, or hydraulic pressure in spray nozzles.
- compositions are for a one gallon concentrated solution of each, which in turn is diluted to make 20 gallons of solution for spraying.
- the metal and reducer solutions are used in equal volumes in spraying or a batch reduction process.
- the resultant solution is clear and has a residue of undissolved Cu (CN) in it. Upon standing and aging, the solution turns a clear blue color and still has the residue. Evidently we are forming a copper cyanide complex in which the Cu (CN) is found on both sides of the equation. However, it is well to note that, when any excess of NaCN above the molar ratio of 2.89 is added, copper will not reduce.
- the Cu (CN) undissolved in the metal solution can be dissolved by the addition of l to 2 grams per liter of Tetrine acid (ethylenediam-ine tetracetic acid), Di-sodium Tetrine, and Tetra-sodium Tetrine.
- Tetrine acid ethylenediam-ine tetracetic acid
- Di-sodium Tetrine Di-sodium Tetrine
- Tetra-sodium Tetrine Tetra-sodium Tetrine
- EXAMPLE II The solution and procedures are the same as for Example I, except that 2.75 oz. of EDTA is added to the metal solution. We may omit the sodium cyanide when EDTA is added, but prefer to use both.
- Example I As a specific example of copper coating, the solutions of Example I (or Example II) are sprayed separately at 140 F. at 12 p.s.i. for approximately 5 minutes on an electrical grade phenolic or other plastic laminate, and masked in such a way as to give an electrical circuit by means well known to the art.
- the article can be coated by dipping into a solution formed by mixing the copper solution and reducer solutions, agitating the solutions, and then removing the coated article. This procedure is not as fast and does not give a coating which is quite as uniform as the spray process.
- the process of coating a surface with copper which comprises mixing together a solution consisting essentially of copper cyanide and a substance selected from the group consisting of 2.0 to 12.0 grams per liter of ethylenediamine tetracetic acid, 2.0 to 12.0 grams per liter of the alkali metal salts thereof, and from 2.0 to 10.0 grams per liter of an alkali metal cyanide, the alkali metal cyanide being present in a molar ratio of alkali metal cyanide to copper cyanide of below approximately 2.89,
- a reducer solution composition consisting essentially of a solution of an alkali metal hydrosulphite, and contacting said surface with the mixed solution.
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Treatment Of Metals (AREA)
Description
COPPER COATING COMPOSITION AND METHOD OF COATING Arthur M. Carlson, Chicago, and Carl E. Prymnla, Zion,
Ill., assignors to Alpha Metal Laboratories, Inc., Chicago, 111., a corporation of Illinois No Drawing. Filed Aug. 6, 1958, Ser. No. 753,402
6 Claims. (Cl. 117-50) The invention relates to coating surfaces with copper and more particularly relates to a composition and process of spray metallizing conductors and non-conductors with chemically reduced copper.
An object of this invention is to provide a simple and inexpensive process of providing a smooth, uniform coating of copper.
Another object is to provide copper solutions and reducer solutions particularly suitable for spray metalliz- A further object is to provide copper solutions particularly suitable for making printed circuits.
These and other objects and advantages are accomplished by spraying an aqueous solution of copper cyanide containing at least 2 grams per liter of solution of ethylenediamine tetracetic acid (EDTA) or its sodium or potassium salts, or where no EDTA is used, the solution should contain an alkaline metal cyanide, such as sodium or potassium cyanide in a molar ratio of alkali metal cyanide to copper cyanide of between approximately .2 and 2.89. The copper solution is used in conjunction with a reducer solution in such manner that the solutions converge on the article to be coated.
We have found in order to reduce copper from a copper cyanide complex and obtain a suitable coating on the article that the molar ratio of alkali metal cyanide to Cu (CN) must be below approximately 2.89. The lower limit is the lowest ratio in which the Cu (CN) will dissolve and is approximately .2. At above the molar ratio of 2.89, any excess of free NaCN will prevent the reduction of copper. In order to have high speed of reduction with maximum thickness of copper coating, the preferred ratio is approximately 2.5.
We have obtained satisfactory results with concentrations of copper cyanide ranging from approximately 2 to 12 grams per liter of solution, and alkali metal cyanide from about 2.0 to 10 grams per liter, but the latter may be omitted when EDTA is present.
The range of EDTA, or its alkali metal salts, is about 2 to 12 grams per liter, but it may be omitted entirely when the alkali metal cyanide is present.
We prefer to use a minor proportion, such as .25 to 1.2 grams per liter of an anionic surface active agent in the copper solution. A suitable surface active agent is sodium lauryl sulphate. However, any of the anionic agents are suitable, particularly the fatty alcohol sulphates.
The reducing solution which we have found gives highly satisfactory results with the copper cyanide solution is an alkaline solution of an alkali metal hydrosulphite, such as sodium or potassium hydrosulphite.
The hydrosulphite can be present in between approximately 10 to 50 grams per liter of solution with between approximately 2 to 15 grams per liter of an alkali metal hydroxide.
Preferably, an alkali metal nitrite is also present as a stabilizer for the hydrosulphite, particularly when the copper solution and reducer solution are air atomized by spraying with air through nozzles. A suitable con- 2,956,90l Patented Oct. 18, 1960 centration of nitrite is 5 to 10 grams per liter. The molar ratio of Na S O to NaNO can range from .3 to 2.0 for good operation.
The temperatures of the solutions can vary widely. Satisfactory results have been obtained with metal solutions at 68 F. to 180 F., and reducer solutions at 68 F. to F.
For cold spraying of plastics, that is, temperatures of 60 F. to 100 F., we obtain preferred results by sensitizing the plastic surface with 2 to 10 grams of SnCl per liter of aqueous solution, preferably containing .5 to 2 grams per liter of sodium lauryl sulphate, or other fatty alcohol sulphate. The plastic is then rinsed with water and then sprayed with 2 to 10 grams of silver nitrate per liter of aqueous solution, also preferably containing .5 to 2 grams per liter of sodium lauryl sulphate or other fatty alcohol sulphates; then without rinsing, the plastic is sprayed with the copper salt solution.
For metals or hot spraying of plastics, the results are about the same without the sensitizer.
In general, the higher the temperature is, the faster is the rate of deposition and the thicker and more opaque the coating.
The spray application can be done by air atomization of solutions, air pressure feed of spray nozzles, or hydraulic pressure in spray nozzles.
The following examples are given to illustrate the invention:
EXAMPLE I Solution make-up Metal solution:
Sodium cyanide (NaCN) 1 1b., 8 oz. Copper cyanide (Cu (CN) 2 lbs. Sodium lauryl sulphate 2.75 oz.
Water to make 1 gal.
Reducer solution:
Sodium hydroxide (NaOH) 1 lb., 5.5 oz. Sodium hydrosulphite (Na S O 5 lbs., 0.5 oz. Sodium nitrite (NaNO 11b., 11 oz.
Water to make 1 gal.
The above compositions are for a one gallon concentrated solution of each, which in turn is diluted to make 20 gallons of solution for spraying. The metal and reducer solutions are used in equal volumes in spraying or a batch reduction process.
In the make-up of the metal solution, we use the following procedure:
(I) Dissolve the required amount of NaCN in water; (2) Heat the NaCN solution to about to 200 F.; (3) Slowly add the Cu (CN) to the above.
The resultant solution is clear and has a residue of undissolved Cu (CN) in it. Upon standing and aging, the solution turns a clear blue color and still has the residue. Evidently we are forming a copper cyanide complex in which the Cu (CN) is found on both sides of the equation. However, it is well to note that, when any excess of NaCN above the molar ratio of 2.89 is added, copper will not reduce.
Moreover, we have found that the Cu (CN) undissolved in the metal solution can be dissolved by the addition of l to 2 grams per liter of Tetrine acid (ethylenediam-ine tetracetic acid), Di-sodium Tetrine, and Tetra-sodium Tetrine. The Cu (CN) is dissolved and the solution turns a clear blue without losing its ability to reduce copper.
EXAMPLE II The solution and procedures are the same as for Example I, except that 2.75 oz. of EDTA is added to the metal solution. We may omit the sodium cyanide when EDTA is added, but prefer to use both.
As a specific example of copper coating, the solutions of Example I (or Example II) are sprayed separately at 140 F. at 12 p.s.i. for approximately 5 minutes on an electrical grade phenolic or other plastic laminate, and masked in such a way as to give an electrical circuit by means well known to the art.
We have obtained satisfactory results on aluminum, stainless steel, steel, brass, and plastics. So far as we know, all types of articles can be copper coated with our solutions.
Instead of using a spray process, the article can be coated by dipping into a solution formed by mixing the copper solution and reducer solutions, agitating the solutions, and then removing the coated article. This procedure is not as fast and does not give a coating which is quite as uniform as the spray process.
While we have disclosed certain preferred embodiments of our invention, many modifications thereto may be made without departing from the spirit of the invention; and we do not wish to be limited to the detailed examples, formulas, and proportions of ingredients set forth, but desire to avail ourselves of all changes within the scope of the appended claims.
We claim:
1. The process of coating a surface with copper which comprises mixing together a solution consisting essentially of copper cyanide and a substance selected from the group consisting of 2.0 to 12.0 grams per liter of ethylenediamine tetracetic acid, 2.0 to 12.0 grams per liter of the alkali metal salts thereof, and from 2.0 to 10.0 grams per liter of an alkali metal cyanide, the alkali metal cyanide being present in a molar ratio of alkali metal cyanide to copper cyanide of below approximately 2.89,
and a reducer solution composition, consisting essentially of a solution of an alkali metal hydrosulphite, and contacting said surface with the mixed solution.
2. The process of claim 1, wherein the solutions are sprayed onto the surface.
3. The process of claim 1, wherein the copper solution contains sodium nitrite in a molar ratio of sodium hydrosulphite to sodium nitrite of from .3 to 2.0.
4. The process of claim 3, wherein the copper solution and the reducer solution are separately sprayed and directed toward the surface, so that they converge on the surface to be coated.
5. The process of claim 8, wherein the surface is a plastic and the temperature of the solutions is between F. to F.
6. The process of claim 9, wherein the plastic surface is sensitized with tin chloride.
References Cited in the file of this patent UNITED STATES PATENTS 2,766,138 Talney Oct. 9, 1956 2,776,918 Bersworth Jan. 8, 1957 2,813,066 Ostrow Nov. 12, 1957 2,814,590 Portzer Nov. 26, 1957 FOREIGN PATENTS 4,804 Great Britain AD. 1900 794,261 Great Britain Apr. 30, 1958 OTHER REFERENCES Marboe: The Glass Industry, March 1945, pgs. 119- 138, 142, 149.
Narcus: Metal Finishing, March 1942, pgs. 54-62 of interest.
Blandes: Metal Finishing, March 1946, pgs. -115.
UNITED STATES PATENT OFFICE CERTIFICATE OF CORRECTION Patent No z 2 956 9Ol Arthur M Carlson et al0 It is herebfi certified that error appears in the-printed specification of the above "numbered patent requiring correction and that the said Letters Patent should read as corrected below.
Column 4, line 13, for the claim reference numeral "'8" read 4 line 16 for the claim reference numeral "9" read 5 s Signed and sealed this llth day of April 1961;
(SEAL) Aitest:
ERNEST W. SWIDER a THUR W. CROCKER Arresting flfiicer Actmg Commissioner of Patents October 18, 1960
Claims (1)
1. THE PROCESS OF COATING A SURFACE WITH COPPER WHICH COMPRISES MIXING TOGETHER A SOLUTION CONSISTING ESSENTIALLY OF COPPER CYANIDE AND A SUBSTANCE SELECTED FROM THE GROUP CONSISTING OF 2.0 TO 12.0 GRAMS PER LITEWR OF ETHYLENEDIAMINE TETRACETIC ACID, 2.0 TO 12.0 GRAMS PER LITER OF THE ALKALI METAL SALTS THEREOF, AND FROM 2.0 TO 10.0 GRAMS PER LITER OF AN ALKALI METAL CYANIDE, THE ALKALI METAL CYANIDE BEING PRESENT IN A MOLAR RATIO OF ALKALI METAL CYANIDE TO COPPER CYANIDE OF BELOW APPROXIMATELY 2.89, AND A REDUCER SOLUTION COMPOSITION, CONSISTING ESSENTIALLY OF A SOLUTION OF AN ALKALI METAL HYDROSULPHITE, AND CONTACTING SAID SURFACE WITH THE MIXED SOLUTION.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US753402A US2956901A (en) | 1958-08-06 | 1958-08-06 | Copper coating composition and method of coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US753402A US2956901A (en) | 1958-08-06 | 1958-08-06 | Copper coating composition and method of coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2956901A true US2956901A (en) | 1960-10-18 |
Family
ID=25030482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US753402A Expired - Lifetime US2956901A (en) | 1958-08-06 | 1958-08-06 | Copper coating composition and method of coating |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2956901A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3095309A (en) * | 1960-05-03 | 1963-06-25 | Day Company | Electroless copper plating |
| US3296012A (en) * | 1965-04-30 | 1967-01-03 | Corning Glass Works | Electroless copper plating on ceramic material |
| US3326700A (en) * | 1963-06-12 | 1967-06-20 | Rudolph J Zeblisky | Electroless copper plating |
| US3967010A (en) * | 1973-11-30 | 1976-06-29 | Kuraray Co., Ltd. | Process for the production of metal-plated staple fibers |
| US4451505A (en) * | 1981-05-29 | 1984-05-29 | U.S. Philips Corporation | Method of producing printed circuit boards |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB190004804A (en) * | 1900-03-13 | 1900-04-21 | Bernhard Jung | Paste for Cleansing, Polishing, and Silvering. |
| US2766138A (en) * | 1953-09-18 | 1956-10-09 | Gen Am Transport | Processes of chemical nickel plating |
| US2776918A (en) * | 1952-07-21 | 1957-01-08 | Dow Chemical Co | Method and composition for application of protective chelate-containing coating to surfaces and article formed thereby |
| US2813066A (en) * | 1955-11-14 | 1957-11-12 | Barnet D Ostrow | Alkylpolyamine-modified cyanide copper plating bath |
| US2814590A (en) * | 1954-07-20 | 1957-11-26 | Lloyd B Portzer | Electrodeposition of copper |
| GB794261A (en) * | 1954-12-09 | 1958-04-30 | Bruno Friedrich Schweig | Improvements relating to coating metals with copper |
-
1958
- 1958-08-06 US US753402A patent/US2956901A/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB190004804A (en) * | 1900-03-13 | 1900-04-21 | Bernhard Jung | Paste for Cleansing, Polishing, and Silvering. |
| US2776918A (en) * | 1952-07-21 | 1957-01-08 | Dow Chemical Co | Method and composition for application of protective chelate-containing coating to surfaces and article formed thereby |
| US2766138A (en) * | 1953-09-18 | 1956-10-09 | Gen Am Transport | Processes of chemical nickel plating |
| US2814590A (en) * | 1954-07-20 | 1957-11-26 | Lloyd B Portzer | Electrodeposition of copper |
| GB794261A (en) * | 1954-12-09 | 1958-04-30 | Bruno Friedrich Schweig | Improvements relating to coating metals with copper |
| US2813066A (en) * | 1955-11-14 | 1957-11-12 | Barnet D Ostrow | Alkylpolyamine-modified cyanide copper plating bath |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3095309A (en) * | 1960-05-03 | 1963-06-25 | Day Company | Electroless copper plating |
| US3326700A (en) * | 1963-06-12 | 1967-06-20 | Rudolph J Zeblisky | Electroless copper plating |
| US3296012A (en) * | 1965-04-30 | 1967-01-03 | Corning Glass Works | Electroless copper plating on ceramic material |
| US3967010A (en) * | 1973-11-30 | 1976-06-29 | Kuraray Co., Ltd. | Process for the production of metal-plated staple fibers |
| US4451505A (en) * | 1981-05-29 | 1984-05-29 | U.S. Philips Corporation | Method of producing printed circuit boards |
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