AT270331B - Bad zum Abscheiden von Kupferüberzügen - Google Patents

Bad zum Abscheiden von Kupferüberzügen

Info

Publication number
AT270331B
AT270331B AT388566A AT388566A AT270331B AT 270331 B AT270331 B AT 270331B AT 388566 A AT388566 A AT 388566A AT 388566 A AT388566 A AT 388566A AT 270331 B AT270331 B AT 270331B
Authority
AT
Austria
Prior art keywords
bath
deposition
copper coatings
coatings
copper
Prior art date
Application number
AT388566A
Other languages
English (en)
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Application granted granted Critical
Publication of AT270331B publication Critical patent/AT270331B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
AT388566A 1965-04-27 1966-04-25 Bad zum Abscheiden von Kupferüberzügen AT270331B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US45133565A 1965-04-27 1965-04-27

Publications (1)

Publication Number Publication Date
AT270331B true AT270331B (de) 1969-04-25

Family

ID=23791808

Family Applications (1)

Application Number Title Priority Date Filing Date
AT388566A AT270331B (de) 1965-04-27 1966-04-25 Bad zum Abscheiden von Kupferüberzügen

Country Status (6)

Country Link
AT (1) AT270331B (de)
CH (1) CH476856A (de)
DE (1) DE1521444B1 (de)
DK (1) DK131998C (de)
GB (1) GB1126327A (de)
SE (1) SE339372B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2747562A1 (de) * 1977-10-20 1979-05-03 Schering Ag Verfahren und anlage zur wiedergewinnung von im abwasser von anlagen zur chemischen oberflaechenbehandlung befindlichen metallen und anderen wertstoffen
EP0132594B1 (de) * 1983-07-25 1988-09-07 Hitachi, Ltd. Lösung zum stromlosen Plattieren mit Kupfer

Also Published As

Publication number Publication date
SE339372B (de) 1971-10-04
DK131998C (da) 1976-05-03
GB1126327A (en) 1968-09-05
CH476856A (de) 1969-08-15
DK131998B (da) 1975-10-06
DE1521444B1 (de) 1969-11-06

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