CH464643A - Stabilisiertes Bad zur chemischen Verkupferung - Google Patents

Stabilisiertes Bad zur chemischen Verkupferung

Info

Publication number
CH464643A
CH464643A CH189366A CH189366A CH464643A CH 464643 A CH464643 A CH 464643A CH 189366 A CH189366 A CH 189366A CH 189366 A CH189366 A CH 189366A CH 464643 A CH464643 A CH 464643A
Authority
CH
Switzerland
Prior art keywords
copper plating
chemical copper
stabilized
stabilized bath
bath
Prior art date
Application number
CH189366A
Other languages
English (en)
Inventor
Kurt Dr Heymann
Guenter Dr Woldt
Gruendel Helga
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of CH464643A publication Critical patent/CH464643A/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CH189366A 1965-02-20 1966-02-10 Stabilisiertes Bad zur chemischen Verkupferung CH464643A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DESCH36568A DE1266099B (de) 1965-02-20 1965-02-20 Bad fuer die reduktive Kupferabscheidung

Publications (1)

Publication Number Publication Date
CH464643A true CH464643A (de) 1968-10-31

Family

ID=7433913

Family Applications (1)

Application Number Title Priority Date Filing Date
CH189366A CH464643A (de) 1965-02-20 1966-02-10 Stabilisiertes Bad zur chemischen Verkupferung

Country Status (6)

Country Link
US (1) US3454416A (de)
BE (1) BE676720A (de)
CH (1) CH464643A (de)
DE (1) DE1266099B (de)
GB (1) GB1128306A (de)
NL (1) NL149857B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110983309A (zh) * 2019-12-26 2020-04-10 广东东硕科技有限公司 2-硫代海因类化合物或其盐的应用

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3649350A (en) * 1970-06-29 1972-03-14 Gen Electric Electroless copper plating
US3793038A (en) * 1973-01-02 1974-02-19 Crown City Plating Co Process for electroless plating
NL164906C (nl) * 1975-08-19 1981-02-16 Philips Nv Werkwijze voor de bereiding van een waterig alkalische verkoperbad.
DE2635457C2 (de) * 1976-08-04 1985-06-05 Schering AG, 1000 Berlin und 4709 Bergkamen Katalytischer Lack und seine Verwendung zur Herstellung von gedruckten Schaltungen
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
NL8702219A (nl) * 1987-09-16 1989-04-17 Philips Nv Werkwijze voor het lokaal aanbrengen van metaal op een oppervlak van een substraat.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2609339A (en) * 1948-11-02 1952-09-02 United Chromium Inc Bright copper plating from cyanide baths
DE1243493B (de) * 1961-02-04 1967-06-29 Bayer Ag Waessriges Bad zur chemischen Abscheidung von borhaltigen Metallueberzuegen
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110983309A (zh) * 2019-12-26 2020-04-10 广东东硕科技有限公司 2-硫代海因类化合物或其盐的应用
CN110983309B (zh) * 2019-12-26 2023-01-03 广东东硕科技有限公司 2-硫代海因类化合物或其盐的应用

Also Published As

Publication number Publication date
GB1128306A (en) 1968-09-25
DE1266099B (de) 1968-04-11
BE676720A (de) 1966-08-18
NL6602102A (de) 1966-08-22
US3454416A (en) 1969-07-08
NL149857B (nl) 1976-06-15

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