DK131478B - Bath for electroless separation of copper coatings on surfaces of carriers. - Google Patents

Bath for electroless separation of copper coatings on surfaces of carriers.

Info

Publication number
DK131478B
DK131478B DK304664A DK304664A DK131478B DK 131478 B DK131478 B DK 131478B DK 304664 A DK304664 A DK 304664A DK 304664 A DK304664 A DK 304664A DK 131478 B DK131478 B DK 131478B
Authority
DK
Denmark
Prior art keywords
carriers
bath
copper coatings
electroless
separation
Prior art date
Application number
DK304664A
Other languages
Danish (da)
Other versions
DK131478C (en
Inventor
F W Schneble Jr
R J Zeblisky
J F Mccormack
J D Williamson
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US288633A external-priority patent/US3361580A/en
Priority claimed from US288618A external-priority patent/US3257215A/en
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of DK131478B publication Critical patent/DK131478B/en
Application granted granted Critical
Publication of DK131478C publication Critical patent/DK131478C/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
DK304664A 1963-06-18 1964-06-17 Bath for electroless separation of copper coatings on surfaces of carriers. DK131478B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US288633A US3361580A (en) 1963-06-18 1963-06-18 Electroless copper plating
US288618A US3257215A (en) 1963-06-18 1963-06-18 Electroless copper plating

Publications (2)

Publication Number Publication Date
DK131478B true DK131478B (en) 1975-07-21
DK131478C DK131478C (en) 1975-12-08

Family

ID=26965129

Family Applications (1)

Application Number Title Priority Date Filing Date
DK304664A DK131478B (en) 1963-06-18 1964-06-17 Bath for electroless separation of copper coatings on surfaces of carriers.

Country Status (6)

Country Link
AT (1) AT254649B (en)
CH (1) CH467341A (en)
DE (1) DE1521435B2 (en)
DK (1) DK131478B (en)
GB (1) GB1041975A (en)
NL (1) NL143282B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4066809A (en) * 1976-06-28 1978-01-03 International Business Machines Corporation Method for preparing substrate surfaces for electroless deposition

Also Published As

Publication number Publication date
DE1521435A1 (en) 1970-12-03
GB1041975A (en) 1966-09-07
CH467341A (en) 1969-01-15
NL6406858A (en) 1964-12-21
AT254649B (en) 1967-05-26
DK131478C (en) 1975-12-08
DE1521435B2 (en) 1972-06-15
NL143282B (en) 1974-09-16

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