AT293132B - Stabilized reductive nickel bath - Google Patents
Stabilized reductive nickel bathInfo
- Publication number
- AT293132B AT293132B AT455270A AT455270A AT293132B AT 293132 B AT293132 B AT 293132B AT 455270 A AT455270 A AT 455270A AT 455270 A AT455270 A AT 455270A AT 293132 B AT293132 B AT 293132B
- Authority
- AT
- Austria
- Prior art keywords
- stabilized
- nickel bath
- reductive nickel
- reductive
- bath
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19691926100 DE1926100C3 (en) | 1969-05-22 | Stabilized reductive nickel bath |
Publications (1)
Publication Number | Publication Date |
---|---|
AT293132B true AT293132B (en) | 1971-09-27 |
Family
ID=5734868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT455270A AT293132B (en) | 1969-05-22 | 1970-05-21 | Stabilized reductive nickel bath |
Country Status (10)
Country | Link |
---|---|
US (1) | US3661596A (en) |
JP (1) | JPS4943172B1 (en) |
AT (1) | AT293132B (en) |
CH (1) | CH533172A (en) |
ES (1) | ES379897A1 (en) |
FR (1) | FR2048610A5 (en) |
GB (1) | GB1315548A (en) |
IE (1) | IE34219B1 (en) |
NL (1) | NL165508C (en) |
SE (1) | SE356764B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3889017A (en) * | 1971-02-02 | 1975-06-10 | Ppg Industries Inc | Chemical filming solution and process for plating therewith |
US3915717A (en) * | 1973-11-12 | 1975-10-28 | Rca Corp | Stabilized autocatalytic metal deposition baths |
US4189324A (en) * | 1978-06-02 | 1980-02-19 | Michael Gulla | Stabilized electroless plating solutions |
JPS5658321U (en) * | 1979-10-09 | 1981-05-19 | ||
US5300330A (en) * | 1981-04-01 | 1994-04-05 | Surface Technology, Inc. | Stabilized composite electroless plating compositions |
US5145517A (en) * | 1981-04-01 | 1992-09-08 | Surface Technology, Inc. | Composite electroless plating-solutions, processes, and articles thereof |
EP0063946A1 (en) * | 1981-04-21 | 1982-11-03 | AMERSHAM INTERNATIONAL plc | Diagnosis of kidney function |
US20110192316A1 (en) * | 2010-02-05 | 2011-08-11 | E-Chem Enterprise Corp. | Electroless plating solution for providing solar cell electrode |
CN106176721B (en) * | 2016-07-14 | 2021-04-30 | 深圳福山生物科技有限公司 | Cancer prevention and treatment use of organic selenium compound |
CN106146372B (en) * | 2016-07-14 | 2019-05-14 | 深圳福山生物科技有限公司 | For preventing and treating the organic selenium compounds of cancer |
TW201816183A (en) * | 2016-10-14 | 2018-05-01 | 日商上村工業股份有限公司 | Electroless nickel plating bath which can inhibit the nickel leakage plating and the outside of pattern deposition |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2762723A (en) * | 1953-06-03 | 1956-09-11 | Gen American Transporation Cor | Processes of chemical nickel plating and baths therefor |
US2929742A (en) * | 1957-03-05 | 1960-03-22 | Minjer Clara Hinderina De | Electroless deposition of nickel |
DE1243493B (en) * | 1961-02-04 | 1967-06-29 | Bayer Ag | Aqueous bath for chemical deposition of boron-containing metal coatings |
US3492135A (en) * | 1967-02-01 | 1970-01-27 | Schering Ag | Stabilized bath for deposition of copper by chemical reduction |
-
1970
- 1970-04-07 CH CH510870A patent/CH533172A/en not_active IP Right Cessation
- 1970-04-29 US US33088A patent/US3661596A/en not_active Expired - Lifetime
- 1970-05-21 ES ES379897A patent/ES379897A1/en not_active Expired
- 1970-05-21 FR FR7018460A patent/FR2048610A5/fr not_active Expired
- 1970-05-21 IE IE670/70A patent/IE34219B1/en unknown
- 1970-05-21 GB GB2464570A patent/GB1315548A/en not_active Expired
- 1970-05-21 AT AT455270A patent/AT293132B/en not_active IP Right Cessation
- 1970-05-21 SE SE06994/70A patent/SE356764B/xx unknown
- 1970-05-22 JP JP45043898A patent/JPS4943172B1/ja active Pending
- 1970-05-22 NL NL7007482.A patent/NL165508C/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
NL7007482A (en) | 1970-11-24 |
IE34219L (en) | 1970-11-22 |
SE356764B (en) | 1973-06-04 |
GB1315548A (en) | 1973-05-02 |
US3661596A (en) | 1972-05-09 |
NL165508C (en) | 1981-04-15 |
FR2048610A5 (en) | 1971-03-19 |
IE34219B1 (en) | 1975-03-05 |
JPS4943172B1 (en) | 1974-11-19 |
ES379897A1 (en) | 1972-09-01 |
NL165508B (en) | 1980-11-17 |
DE1926100B2 (en) | 1977-04-28 |
DE1926100A1 (en) | 1970-12-03 |
CH533172A (en) | 1973-01-31 |
SU381231A3 (en) | 1973-05-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ELJ | Ceased due to non-payment of the annual fee |