US3743584A - Acid bright copper plating bath - Google Patents
Acid bright copper plating bath Download PDFInfo
- Publication number
- US3743584A US3743584A US00149335A US3743584DA US3743584A US 3743584 A US3743584 A US 3743584A US 00149335 A US00149335 A US 00149335A US 3743584D A US3743584D A US 3743584DA US 3743584 A US3743584 A US 3743584A
- Authority
- US
- United States
- Prior art keywords
- acid
- liter
- copper
- compounds
- electrolyte
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D241/00—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings
- C07D241/36—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings condensed with carbocyclic rings or ring systems
- C07D241/38—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings condensed with carbocyclic rings or ring systems with only hydrogen or carbon atoms directly attached to the ring nitrogen atoms
- C07D241/46—Phenazines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0683—Polycondensates containing six-membered rings, condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0694—Polycondensates containing six-membered rings, condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring, e.g. polyquinoxalines
Definitions
- the invention relates to new polymeric phenazonium compounds, methods for their production, as well as their use in acid electrolytes for the deposition of bright, leveling copper coatings.
- an acid copper electrolyte which is characterized by a content of at least one compound of the general formula wherein R R,, R R R R R R and R, are identical or different and represent hydrogen, a low alkyl or possibly substituted aryl, and R and R represent moreover monomeric or polymeric phenazonium radicals, A is an acid radical, and n an integer from 2 to 100, preferably from 4 to 20.
- An aryl radical may be, for example, phenyl, which may be substituted by methyl, ethyl, methoxy or ethoxy, etc.
- acid radicals there enter into consideration, for example, those of hydro-chloric acid (Cl'), sulfuric acid (HSOf), nitric acid (NO and acetic acid (Cl-[,coo), etc. a
- the radicals R and R may signify moreover, for example phenazonium radicals of the parent substance.
- the quantities in which the identified compounds must be added to the copper baths in order to obtain a clear improvement of the copper deposition are surprisingly very small and amount to about 0.0005 to 0.1 g/liter, preferably 0.0005 to 0.03 g/liter.
- Table l contains examples for substances according to the invention and data on the preferred concentrations in the electrolyte.
- the linkage points of the radicals are not fully clarified.
- the linkage may take place, besides through the 3-position of the phenazonium radical, also through the disadvantages of the known acid copper baths and S-and the 7-position.
- the invention therefore, further relates to a method for the production of the compounds identified above.
- A is an acid radical, from which then the desired reaction products are formed by diazotizing in acid solution and subsequent boiling down of the resulting diazonium salts.
- the diazotizing of the amino compounds is effected in sulfuric acid, hydrochloric acid, or acetic acid solution. These acids then form the above-mentioned acid radical A.
- diazotizing agents that are suitable are sodium nitrite or nitrosylsulfuric acid, etc.
- the so-called boiling down of the formed diazonium salts may take place at temperatures of about 5 to C, preferably about 10 to 25 C.
- reaction products precipitate from the acid reaction solution or can be precipitated therefrom by neutralization with bases, e.g., ammonia, soda or potash lye. Isolation is then effected by common methods.
- bases e.g., ammonia, soda or potash lye.
- Copper sulfate CuSo 5 H,O -260 g/liter Sulfuric'acid l-l SO 20-85 g/liter instead of copper sulfate, at least in part, other copper salts may be used.
- the sulfuric acid may be replaced partly or wholly by fluoroboric acid, phosphoric acid and/or other suitable acids.
- the electrolyte may be chloride-free, or this being usually advantageous for improving the luster and the leveling, it may contain chlorides, such as, alkali chlorides or hydrochloric acid, in quantities of 0.001 to 0.2 g/liter.
- the normally crystallinedull precipitate turns out bright in a wide current density range.
- the cathodic current density may be increased by about 50 percent without the formation of flaws, in particular budding, in the range of high current densities. To attain a certain layer thickness, therefore, the time of exposure may be reduced accordingly and in a unit of given size more merchandise can be put through.
- the substances according to the invention are also particularly suited for depositing haze-free and highbrighteners coatings in conjunction with other common luster-formers and/or wetting agents. Electrolytes containing the substances of Table I show also excellent ageing. Even after a current passage of 200-400 Ah/ltr and more, the copper coatings turn out just as highly lustrous, leveling and ductile as in a fresh batch of electrolyte. No harmful decomposition products of these substances are formed that would require purification, for example, with active carbon.
- Organic thio compounds with water solubilizing groups 0.0005-0.2 g/liter, preferably0.0l-0.l g/liter.
- Table II below contains examples of oxygencontaining, high-molecular compounds and their preferred concentrations.
- Table III contains examples of organic thio compounds with water-colubilizing groups and their preferred concentrations.
- the applicable cathodic current density is increased up to 50 percent
- the leveling effect i.e., the reduction of roughness of the ground material, is increased (measured at a layer thickness of 24 microns) from 40-50 percent to about 70-80 percent.
- the concentration ratios of the individual compounds in the copper electrolyte may vary within wide limits. It has proved favorable to have a weight ratio of the substances, listed by way of example in Tables I, II and Ill, of about I l 2 to about I 200 20.
- EXAMPLE 2 To a copper bath of the composition 200 g/liter copper sulfate (CuSO, 5 H 0) 60 g/liter sulfuric acid, concentrated 0.05 g/liter sodium chloride there are added as brighteners 0.6 g/liter polypropylene glycol and 0.02 g/liter sodium 3-mercaptopropane-l sulfonate.
- CuSO copper sulfate
- 5 H 0 sulfuric acid
- concentrated 0.05 g/liter sodium chloride there are added as brighteners 0.6 g/liter polypropylene glycol and 0.02 g/liter sodium 3-mercaptopropane-l sulfonate.
- an acid electrolyte for the deposition of bright copper coatings comprising (a) an oxygen containing high molecular weight compound selected from the group consisting of polyvinyl alcohol, carboxymethyl cellulose, polyethylene glycol, stearic acid polyglycol ester, oleic acid polycol ester, and nonylphenol polyglycol ester; (b) an organic thio compound selected from the group consisting of sodium salt of N N-diethyl-dithiocarbamic acid (sulfopropyl ester), sodium mercaptobenzothiazol-S-propanesulfonate, sodium S-mercapto-propane-l-sulfonate, bis-(S-sodium sulfopropyl)-disulfide, disodium salt of thiophosphoric acidacid-O-ethyl-bis-(sulfopropyl) ester, trisodium salt of thiophosphoric acid-tri-(sulfo
- An electrolyte according to claim 2 characterized in that it additionally contains oxygen-containing, highmolecular compounds and organic thio compounds with water-solubilizing groups.
- Electrolyte according to claim 3 characterized in that it contains the oxygen-containing, high-molecular compounds in quantities of 0.01 to 20.0 g/liter, preferably 0.02 to 8.0 g/liter and the organic thio compounds with water-solubilizlng groups in quantities of 0.0005 to 0.2 g/liter, preferably 0.01 to 0.1 g/liter.
- An electrolyte for the deposition of bright copper coatings comprising at least one compound of the wherein R through R, are individually selected from the group-consisting of hydrogen, lower alkyl, aryl, and substituted aryl, R and R being additionally a monomeric or polymeric phenazonium radical; A is an acid radical; and n is an integer from 2 to 100.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Paints Or Removers (AREA)
- Detergent Compositions (AREA)
Abstract
Polymeric phenazonium compounds, their method of preparation and their use in acid electrolytes for the deposition of bright, leveling, copper coatings on surfaces.
Description
United States Patent Todt et al. July 3, 1973 ACID BRIGHT COPPER PLATING BATH [5 6] References Cited [75] Inventors: l-lans-Giinther Todt; Wolfgang UNITED STATES PATENTS Clauss; Wolfgang Dahms, all of 2,707,166 4/1955 Brown et a1 204/52 R Berlin, Germany 2,707,167 4/1955 Hoover 204/52 R 3,267,010 8/1966 Creutz et al. 204/52 R 1 Asslgnw Scherina AG, Berlm, Germany 3,328,273 6/1967 Creutz et al. 204/52 R J 2 3,502,55l 3/l970 Todt ef al. R
[21] App]. No.: 149,335 Primary ExaminerF. C. Edmundson Attorney-Joseph F. Padlon [30] J Fzrilaiggliz) Apglication Priority Dagazo 28 803 3 ABSTRACT um ermany Polymeric phenazonium compounds, their method of [52] Cl 204/52 R 204/1316 2 preparation and their use in acid electrolytes for the de- [51] Int Cl IIIIIIIIIIIIIIIIIIII H C23b position of bright, leveling, copper coatings on sur- [58] faces v Field of Search 204/52 R, DIG. 2
5 Claims, No Drawings ACID BRIGHT COPPER PLATING BATH The invention relates to new polymeric phenazonium compounds, methods for their production, as well as their use in acid electrolytes for the deposition of bright, leveling copper coatings. I
It has long been known that certain organic substances can be added in small quantities to acid copper electrolytes, in particular to the most widely used copper sulfate electrolytes, in order to obtain bright copper coatings instead of a crystalline-dull deposition. For this purpose there have become known, for example, polyethylene glycol, thiourea and derivatives thereof, thiohydantoin, thiocarbaminic acid ester and thiophosphoric acid ester, which, however, no longer have any practical importance since the quality of the copper coatings obtained with them does not meet today's requirements. Thus the coatings are either too brittle or they have too little luster or, within certain current density ranges, they turn out with a relief type finish.
Also the addition of certain safranines, either alone according to the proposal of German Pat. No. 947,656 or in mixture with thiourea or the substitution products thereof according to German Pat. No. 1,004,880, leads to copper coatings with such unsatisfactory properties.
Further there has been proposed the addition of thiourea-formaldehyde condensates (German Pat. Nos. 1,152,863 and 1,165,962) and of certain compounds with C==S groups in the molecule (German Pat. No. 1,218,247).
While one obtains bright copper deposits with these additions, they do not always satisfy the increased requirements of the practice either, since their leveling action is unsatisfactory.
There has been proposed moreover the addition of polyalkylenimines in conjunction with organic thio compounds (German Pat. No. 1,246,374) and polyvinyl compounds in mixture with oxygen-containing high-molecular compounds and organic thiocompounds (German Pat. application No. 1,521,062). Such copper electrolytes, however, do not permit the use of higher cathodic current densities, and the deposited copper coatings can be nickel-plated only after intermediate treatment.
It is the object of the present invention to avoid the moreover to improve these baths so that they can be operated also at higher current densities and in conjunction with other known brighteners to permit the deposition of especially uniform copper deposits, which can be nickel-plated without intermediate treatment.
This is solved accordingwto the invention by an acid copper electrolyte which is characterized by a content of at least one compound of the general formula wherein R R,, R R R R R R and R, are identical or different and represent hydrogen, a low alkyl or possibly substituted aryl, and R and R represent moreover monomeric or polymeric phenazonium radicals, A is an acid radical, and n an integer from 2 to 100, preferably from 4 to 20.
As lower alkyl radicals there may be named for example methyl and ethyl propyl, etc.
An aryl radical may be, for example, phenyl, which may be substituted by methyl, ethyl, methoxy or ethoxy, etc.
As acid radicals there enter into consideration, for example, those of hydro-chloric acid (Cl'), sulfuric acid (HSOf), nitric acid (NO and acetic acid (Cl-[,coo), etc. a
The radicals R and R may signify moreover, for example phenazonium radicals of the parent substance.
The quantities in which the identified compounds must be added to the copper baths in order to obtain a clear improvement of the copper deposition are surprisingly very small and amount to about 0.0005 to 0.1 g/liter, preferably 0.0005 to 0.03 g/liter.
Table l contains examples for substances according to the invention and data on the preferred concentrations in the electrolyte. I
The linkage points of the radicals are not fully clarified. The linkage may take place, besides through the 3-position of the phenazonium radical, also through the disadvantages of the known acid copper baths and S-and the 7-position.
TABLE I Preferred concenii: (for tration, N0. Substance instance) lL/litm- (()ll:;)gN O Ulla Substance l1 s (for lllStZlllCO) Fran.
These substances can be prepared, for example, as follows:
2 moles of an amine sulfate, e.g., 2-methyl-3-amino- 6-dimethylamino-9-phenyl-phenazonium sulfate, are suspended with 4.5 liter of percent sulfuric acid and diazotized within 3 hours at 5 C with 650 ml nitrosylsulfuric acid containing 2.2 moles of nitrous acid. The excess nitrous acid is destroyed with amino-sulfonic acid and the reaction solution is heated to 20 C, nitrogen evolving vigorously. After the nitrogen evolution has come to an end, one neutralizes with a base, e.g., potash lye.
On standing, 800 g of a blue reaction product of substance No. 3 (Table I) crystallize out. After drying, and after proper dilution, this product can be charged immediately into acid copper electrolyte. The molecular weight is about 8,000.
In the following, the preparation of some other substances according to the invention is described. Preparation of substance No. l
1 mole of 3-amino-S-methyl-6-dimethylamino-9- phenyl-phena'zonium-hydrogen sulfate is suspended in 2 liters of percent sulfuric acid and diazotized within 4 hours at -10 C with 300 ml nitrosylsulfuric acid containing 1.1 mole of nitrous acid. The excess nitrous acid is destroyed with urea and the reaction solution slowly heated to C, nitrogen evolving vigorously. After the nitrogen evolution has come to an end, one neutralizes with gaseous ammonia. On standing, 350 g of a polymeric blue phenyl phenazonium salt crystallize out. After drying, this polymeric dye, which has a mean molecular weight of about 5,000, can be charged in proper dilution directly into acid copper electrolyte. Preparation of substance No. 2
1 mole of 2-methyl-3-amino-6-diethylamino-9- phenyl-phenazonium chloride is suspended in 2 liters of 30% HCI and carefully diazotized within 5 hours at 10 C with 1.1 mole NaNo t dissolved in 250 ml of water. The excess nitrous acid is destroyed with aminosulfonic acid and the reaction solution heated to 20 C, nitrogen evolving vigorously. After the nitrogen evolution has come to an end, one neutralizes with potassium hydroxide. After letting stand, 300 g of the blue polymeric dye having a mean molecular weight of 4,000 can be suctioned off. Preparation of substance No. 4
0.1 mole of 3-amino-6-dimethylemino-9-methylphenazonium acetate is suspended in 250 ml of glacial acetic acid and carefully diazotized at --5 C with 0.12 mole of sodium nitrite, dissolved in 50 ml of water. The excess nitrous acid is destroyed with urea and the reaction solution briefly heated to boiling. After concentrating to ml and cooling, the precipitated polymeric dye of a mean molecular weight of about 8,000 can be suctioned off. The yield is: 20g. Preparation of substance No. 5
0.! mole of 2-m35hyl-3-amino-6-phenylamino-9- phenyl-phenazonium-hydrogen sulfate is suspended in '250 ml of 35 percent sulfuric acid and diazotized at 20 C with 30 ml of nitrosylsulfuric acid containing 0.12 mole of nitrous acid. The excess nitrous acid is destroyed with aminosulfonic acid and the reaction mixture slowly heated to 50 C. After the nitrogen evolution has come to an. end, one neutralizes with soda lye, and the polymeric dye contaminated with some sodium sulfate and having a mean molecular weight of about 300 is suctioned off. The yield is: 15g. Preparation of substance No. 6
0.05 mole of 2-methyl-3-amino-6-dimethylaminophenazonium hydrogen sulfate is suspended in 50 ml of 40 percent sulfuric acid and diazotized at 5 C with 15 ml of nitrosylsulfuric acid containing 0.06 mole of nitrous acid. The excess nitrous acid is destroyed with aminosulfuric acid and the acid neutralized with ammonia. After standing for a short time, a blue polymeric dye having a mean molecular weight of about 10,000 can be suctioned off. The yield is: 5g. Preparation of substance No. 7
0.05 mole of 3-amino-6-methylamino-9- phenylphenazonium acetate is suspended in 200 ml of glacial acetic acid and diazotized at 10 C with 0.06 mole of sodium nitrite, dissolved in little water. After destruction of the excess nitrous acid with urea, the reaction solution is heated to 40 C, concentrated, and the precipitated dye having a mean molecular weight of about 5,000 is suctioned off. The yield is 8g. Preparation of substance No. 8
0.05 mole of 2-phenyl-3-amino-6-3thylamino-9- phenyl-phenazonium chloride is suspended in 400 ml of 30 percent hydrochloric acid and diazotized within 1 hour with 0.06 mole of sodium nitrite, dissolved in little water. After destruction of the excess nitrous acid with aminosulfonic acid, the temperature is raised to 30 C; after the nitrogen evolution has come to an end, the product is extensively concentrated, and the precipitated dye having a mean molecular weight of about 2,000 is suctioned off. The yield is: 4g.
Preparation of Substance No. 9
0.05 mole of l,2,5,8-6365amethyl-3-amino-6- diethylamino-9-phenyl-phenazonium hydrogen sulfate is dissolved in 500 ml of 50 percent sulfuric acid and diazotized at -10 C with 15 ml of nitrosylsulfuric acid containing 0.06 mole of nitrous acid. The excess nitrous acid is destroyed with aminosulfonic acid, the diazonium salt is boiled down, and the sulfuric acid neutralized with ammonia. The precipitated dye having a mean molecular weight of about 2,000 is suctioned off. The yield is: 10g. Preparation of substance No. 10
0.05 mole of 2,7-dimethyl-3-amino-6-diethylamino- 9-tolyl-phenazonium chloride is suspended in 50 ml of 30 percent hydrochloric acid and carefully diazotized at 5 C with 0.06 mole of sodium nitrite. dissolved in little water. The excess nitrous acid is destroyed with aminosulfonic acid, the reaction solution heated to 80 C, extensively concentrated, and the precipitated dye having a mean molecular weight of about 4,000 is suctioned off. The yield is: 8g. Preparation of substance No. 11
0.05 mole of 2,8-diphenyl-3-amino-5-methyl-6- dimethylamino-9-phenyl-phenazonium hydrogen sulfate is dissolved in 500 ml of 50 percent sulfuric acid and diazotized at l C with 15 ml nitrosylsulfuric acid which contains 0.06 mole of nitrous acid, and then the excess nitrous acid is destroyed with aminosulfonic acid. After the diazonium compound has been boiled down, one neutralizes with ammonia and the precipitated blue dye having a mean molecular weight of about 1,500 is suctioned off. The yield is: 9g. Preparation of substance No. 12
2 moles of 2,7-dimethyl-3,6-diamino-9-phenylphenazonium hydrogen sulfate are suspended with 4.5 liter of 20 percent sulfuric acid and diazotized within hours at l0 C with 650 ml of nitrosylsulfuric acid which contains 2.2 moles of nitrous acid. The excess nitrous acid is destroyed with aminosulfonic acid and the reaction solution is heated to 25 C, nitrogen evolving vigorously. After the nitrogen evolution has come to an end, one neutralizes with ammonia, and the polymeric red-brown dye precipitated upon standing having a mean molecular weight of about 5,000 is suctioned off. The yield is: 750g of dye (contaminated with ammonium sulfate).
The invention, therefore, further relates to a method for the production of the compounds identified above.
Ashas been described, this method proceeds from compounds of the general formula in which the radicals R R R R R R R R R,
signify hydrogen, a low alkyl or possibly substituted aryl, and A is an acid radical, from which then the desired reaction products are formed by diazotizing in acid solution and subsequent boiling down of the resulting diazonium salts.
Advantageously the diazotizing of the amino compounds is effected in sulfuric acid, hydrochloric acid, or acetic acid solution. These acids then form the above-mentioned acid radical A. As diazotizing agents that are suitable are sodium nitrite or nitrosylsulfuric acid, etc.
The so-called boiling down of the formed diazonium salts may take place at temperatures of about 5 to C, preferably about 10 to 25 C.
The reaction products precipitate from the acid reaction solution or can be precipitated therefrom by neutralization with bases, e.g., ammonia, soda or potash lye. Isolation is then effected by common methods.
As electrolyte for the deposition of copper coatings with addition of the substances according to the invention, there is generally used a sulfuric acid copper sulfate solution of the following composition:
Copper sulfate CuSo 5 H,O -260 g/liter Sulfuric'acid l-l SO 20-85 g/liter Instead of copper sulfate, at least in part, other copper salts may be used. The sulfuric acid may be replaced partly or wholly by fluoroboric acid, phosphoric acid and/or other suitable acids. The electrolyte may be chloride-free, or this being usually advantageous for improving the luster and the leveling, it may contain chlorides, such as, alkali chlorides or hydrochloric acid, in quantities of 0.001 to 0.2 g/liter.
If one or more of the substances of the invention are added to such copper baths, the normally crystallinedull precipitate turns out bright in a wide current density range. Besides, the cathodic current density may be increased by about 50 percent without the formation of flaws, in particular budding, in the range of high current densities. To attain a certain layer thickness, therefore, the time of exposure may be reduced accordingly and in a unit of given size more merchandise can be put through.
The substances according to the invention are also particularly suited for depositing haze-free and highbrighteners coatings in conjunction with other common luster-formers and/or wetting agents. Electrolytes containing the substances of Table I show also excellent ageing. Even after a current passage of 200-400 Ah/ltr and more, the copper coatings turn out just as highly lustrous, leveling and ductile as in a fresh batch of electrolyte. No harmful decomposition products of these substances are formed that would require purification, for example, with active carbon.
One obtains an especially clear and sudden improvement of the luster and of the leveling effect by adding the substances according to the invention to copper electrolytes which contain as brighteners oxygencontaining, high-molecular compounds and organic thio compounds, preferably comprising one or more water-solubilizing groups.
The quantities of these compounds to be added to the copper electrolyte are comprised approximately within the following limits:
Oxygen containing high molecular compounds-0.-
(ll-20.0 g/liter prcferably-0.02-8.0 g/liter.
Organic thio compounds with water solubilizing groups 0.0005-0.2 g/liter, preferably0.0l-0.l g/liter.
Table II below contains examples of oxygencontaining, high-molecular compounds and their preferred concentrations.
TABLE II No. Substance Preferred concentration g/liter l Polyvinyl alcohol 0.05-0.4 2 Carboxymethyl cellulose 0.05-0.! 3 Polyethylene glycol 0.1-5.0 4 Polypropylene glycol 0.05-1.0 5 Stearic acid polyglycol ester 0.5-8.0 6 Oleic acid pol glycol ester 0.5-5.0 7 Stearyl alcoho pol glycol ether 0.5-8.0 8 Nonylphenol-polyg ycol ether 0.5-6.0
Table III below contains examples of organic thio compounds with water-colubilizing groups and their preferred concentrations.
TABLE III No. Substance Preferred concentration g/liter l N,N-diethyl-dithiocarbaminic acid-(sulfopropyl)-ester,
sodium salt 0.0l0.l
2 Sodium mercaptobenzothiazol- S-propanesulfonate 0.02-0. l
3 Sodium 3-mercaptopropane-l sulfonate 0005-01 4 Bis-(S-sodium sulfopropyl)- disulfide 0005-02 5 Thiophosphoric acid-O-ethylbis-(sulfopropyl(-ester,
disodium salt 0.01-0.15
6 Thiophosphoric acid-tris- (sulfopropyU-ester, trisodium sulfonate 0.05-0.2
8 Thioglycolic acid 0001-0003 The addition of substances of Table I to copper electrolytes which contain brighteners of Tables II and Ill thus brings about two decisive technical advantages:
1. The applicable cathodic current density is increased up to 50 percent;
2. The leveling effect, i.e., the reduction of roughness of the ground material, is increased (measured at a layer thickness of 24 microns) from 40-50 percent to about 70-80 percent.
The concentration ratios of the individual compounds in the copper electrolyte may vary within wide limits. It has proved favorable to have a weight ratio of the substances, listed by way of example in Tables I, II and Ill, of about I l 2 to about I 200 20.
The following examples will elucidate the use of the products according to the invention:
EXAMPLE 1 In a copper bath of the composition 220 g/liter copper sulfate (CuSO, H
50 g/liter sulfuric acid, concentrated brass sheets or pre-nickel-plated steel sheets are copper plated at an electrolyte temperature of 20 to 25 C with cathode movement. The deposits are crystalline-dull. When the current density exceeds 4 A/dm, there occur at the corners of the cathode sheets loosely adhering powdery copper depositions. if one now adds to the electrolyte 0.06 g/liter of substance No. 1 (Table l), the current density can be increased to 6 A/dm under the same operating conditions without causing the flaws referred to above. Besides, the deposit turns out bright.
EXAMPLE 2 To a copper bath of the composition 200 g/liter copper sulfate (CuSO, 5 H 0) 60 g/liter sulfuric acid, concentrated 0.05 g/liter sodium chloride there are added as brighteners 0.6 g/liter polypropylene glycol and 0.02 g/liter sodium 3-mercaptopropane-l sulfonate.
Although at an electrolyte temperature of 20 to 25 C one obtains with a current density of 6.0 A/dm and air agitation bright and haze-free copper coatings, the leveling of rugosities of the ground material at a layer thickness of 24 microns is only 45 percent. When adding to the bath 0.008 g/liter of substance No. 3 (Table l), the leveling increases under the same operating conditions to 76 percent, that is, it increases by percent.
EXAMPLES To the electrolyte according to Example 2 there are added 4.0 g/liter nonylphenol-polyglycol ether and 0.02 g/liter N,N-diethyl-dithiocarbaminic (sulfopropyl)-ester, sodium salt. At an electrolyte temperature of 20 to 25 C, a current density of 5.0 A/dm and movement of the cathode rod, the leveling effect at a layer thickness of 24 microns copper is about 50 percenLBy adding 0.01 g/liter of substance No. 6 (Table I), the leveling increases to 78 percent, the increase thus being 56 percent.
What we claim is:
1. in an acid electrolyte for the deposition of bright copper coatings comprising (a) an oxygen containing high molecular weight compound selected from the group consisting of polyvinyl alcohol, carboxymethyl cellulose, polyethylene glycol, stearic acid polyglycol ester, oleic acid polycol ester, and nonylphenol polyglycol ester; (b) an organic thio compound selected from the group consisting of sodium salt of N N-diethyl-dithiocarbamic acid (sulfopropyl ester), sodium mercaptobenzothiazol-S-propanesulfonate, sodium S-mercapto-propane-l-sulfonate, bis-(S-sodium sulfopropyl)-disulfide, disodium salt of thiophosphoric acidacid-O-ethyl-bis-(sulfopropyl) ester, trisodium salt of thiophosphoric acid-tri-(sulfopropyl) ester, and thioglycollic acid; the improvement which comprises a compound of the formula:
ties of 0.0005 to 0.1 g/liter, preferably 0.0005 to 0.03 g/liter.
3. An electrolyte according to claim 2, characterized in that it additionally contains oxygen-containing, highmolecular compounds and organic thio compounds with water-solubilizing groups.
4. Electrolyte according to claim 3, characterized in that it contains the oxygen-containing, high-molecular compounds in quantities of 0.01 to 20.0 g/liter, preferably 0.02 to 8.0 g/liter and the organic thio compounds with water-solubilizlng groups in quantities of 0.0005 to 0.2 g/liter, preferably 0.01 to 0.1 g/liter.
5. An electrolyte for the deposition of bright copper coatings comprising at least one compound of the wherein R through R, are individually selected from the group-consisting of hydrogen, lower alkyl, aryl, and substituted aryl, R and R being additionally a monomeric or polymeric phenazonium radical; A is an acid radical; and n is an integer from 2 to 100.
t t i t
Claims (4)
- 2. An electrolyte as set forth in claim 1, characterized in that it contains the identified compounds in quantities of 0.0005 to 0.1 g/liter, preferably 0.0005 to 0.03 g/liter.
- 3. An electrolyte according to claim 2, characterized in that it additionally contains oxygen-containing, high-molecular compounds and organic thio compounds with water-solubilizing groups.
- 4. Electrolyte according to claim 3, characterized in that it contains the oxygen-containing, high-molecular compounds in quantities of 0.01 to 20.0 g/liter, preferably 0.02 to 8.0 g/liter anD the organic thio compounds with water-solubilizIng groups in quantities of 0.0005 to 0.2 g/liter, preferably 0.01 to 0.1 g/liter.
- 5. An electrolyte for the deposition of bright copper coatings comprising at least one compound of the structure:
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2028803A DE2028803C3 (en) | 1970-06-06 | 1970-06-06 | Polymeric phenazonium compounds |
DE2039831A DE2039831C3 (en) | 1970-06-06 | 1970-06-06 | Acid bath for the galvanic deposition of shiny copper coatings |
Publications (1)
Publication Number | Publication Date |
---|---|
US3743584A true US3743584A (en) | 1973-07-03 |
Family
ID=25759264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US00149335A Expired - Lifetime US3743584A (en) | 1970-06-06 | 1971-06-02 | Acid bright copper plating bath |
Country Status (8)
Country | Link |
---|---|
US (1) | US3743584A (en) |
AT (1) | AT302764B (en) |
CA (1) | CA961494A (en) |
CH (1) | CH556347A (en) |
DE (2) | DE2039831C3 (en) |
FR (1) | FR2095876A5 (en) |
GB (1) | GB1357442A (en) |
NL (1) | NL173277C (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50104143A (en) * | 1974-01-23 | 1975-08-16 | ||
US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
US4786746A (en) * | 1987-09-18 | 1988-11-22 | Pennsylvania Research Corporation | Copper electroplating solutions and methods of making and using them |
US4948474A (en) * | 1987-09-18 | 1990-08-14 | Pennsylvania Research Corporation | Copper electroplating solutions and methods |
US5433840A (en) * | 1991-08-07 | 1995-07-18 | Atotech Deutschland Gmbh | Acid bath for the galvanic deposition of copper, and the use of such a bath |
US5730854A (en) * | 1996-05-30 | 1998-03-24 | Enthone-Omi, Inc. | Alkoxylated dimercaptans as copper additives and de-polarizing additives |
US5849171A (en) * | 1990-10-13 | 1998-12-15 | Atotech Deutschland Gmbh | Acid bath for copper plating and process with the use of this combination |
EP1054080A2 (en) * | 1999-05-17 | 2000-11-22 | Shipley Company LLC | Electrolytic copper plating solutions |
US20040231995A1 (en) * | 2003-05-23 | 2004-11-25 | Kenji Murao | Printed circuit boards and the methods of their production |
WO2005049584A1 (en) * | 2003-11-19 | 2005-06-02 | Atotech Deutschland Gmbh | Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds |
US20080142370A1 (en) * | 2003-08-08 | 2008-06-19 | Wolfgang Dahms | Aqueous, Acidic Solution and Method for Electrolytically Depositing Copper Coatings as Well as Use of Said Solution |
CN101899687A (en) * | 2010-08-03 | 2010-12-01 | 济南德锡科技有限公司 | Single dye type bright acidic copper plating additive and preparation method and application thereof |
WO2012040417A1 (en) | 2010-09-24 | 2012-03-29 | Macdermid Acumen, Inc. | Improved method of producing polymeric phenazonium compounds |
US8735580B2 (en) | 2010-09-24 | 2014-05-27 | Andrew M. Krol | Method of producing polymeric phenazonium compounds |
US20150030873A1 (en) * | 2013-07-23 | 2015-01-29 | Chang Chun Petrochemical Co., Ltd. | Electrolytic copper foil |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU559896B2 (en) * | 1983-06-10 | 1987-03-26 | Omi International Corp. | Electrolytic copper depositing processes |
DE4032864A1 (en) * | 1990-10-13 | 1992-04-16 | Schering Ag | ACIDIC BATH FOR THE GALVANIC DEPOSITION OF COPPER COVERS AND METHODS USING THIS COMBINATION |
DE19758121C2 (en) * | 1997-12-17 | 2000-04-06 | Atotech Deutschland Gmbh | Aqueous bath and method for electrolytic deposition of copper layers |
DE10261852B3 (en) * | 2002-12-20 | 2004-06-03 | Atotech Deutschland Gmbh | Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling |
DE102005011708B3 (en) | 2005-03-11 | 2007-03-01 | Atotech Deutschland Gmbh | A polyvinylammonium compound and process for the production thereof, and an acidic solution containing the compound and a process for electrolytically depositing a copper precipitate |
PL3483307T3 (en) * | 2017-11-09 | 2020-11-16 | Atotech Deutschland Gmbh | Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2707167A (en) * | 1952-05-26 | 1955-04-26 | Udylite Corp | Electrodeposition of copper from an acid bath |
US2707166A (en) * | 1952-05-26 | 1955-04-26 | Udylite Corp | Electrodeposition of copper from an acid bath |
US3267010A (en) * | 1962-04-16 | 1966-08-16 | Udylite Corp | Electrodeposition of copper from acidic baths |
US3328273A (en) * | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
US3502551A (en) * | 1966-08-20 | 1970-03-24 | Schering Ag | Acid electrolyte for the deposition of bright,levelling copper coatings |
-
1970
- 1970-06-06 DE DE2039831A patent/DE2039831C3/en not_active Expired
- 1970-06-06 DE DE2028803A patent/DE2028803C3/en not_active Expired
-
1971
- 1971-05-24 CH CH755871A patent/CH556347A/en not_active IP Right Cessation
- 1971-06-02 CA CA114,600A patent/CA961494A/en not_active Expired
- 1971-06-02 US US00149335A patent/US3743584A/en not_active Expired - Lifetime
- 1971-06-03 FR FR7120152A patent/FR2095876A5/fr not_active Expired
- 1971-06-03 AT AT482371A patent/AT302764B/en not_active IP Right Cessation
- 1971-06-07 GB GB1917271*[A patent/GB1357442A/en not_active Expired
- 1971-06-07 NL NLAANVRAGE7107804,A patent/NL173277C/en not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2707167A (en) * | 1952-05-26 | 1955-04-26 | Udylite Corp | Electrodeposition of copper from an acid bath |
US2707166A (en) * | 1952-05-26 | 1955-04-26 | Udylite Corp | Electrodeposition of copper from an acid bath |
US3267010A (en) * | 1962-04-16 | 1966-08-16 | Udylite Corp | Electrodeposition of copper from acidic baths |
US3328273A (en) * | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
US3502551A (en) * | 1966-08-20 | 1970-03-24 | Schering Ag | Acid electrolyte for the deposition of bright,levelling copper coatings |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50104143A (en) * | 1974-01-23 | 1975-08-16 | ||
US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
US4786746A (en) * | 1987-09-18 | 1988-11-22 | Pennsylvania Research Corporation | Copper electroplating solutions and methods of making and using them |
US4948474A (en) * | 1987-09-18 | 1990-08-14 | Pennsylvania Research Corporation | Copper electroplating solutions and methods |
US5849171A (en) * | 1990-10-13 | 1998-12-15 | Atotech Deutschland Gmbh | Acid bath for copper plating and process with the use of this combination |
US5433840A (en) * | 1991-08-07 | 1995-07-18 | Atotech Deutschland Gmbh | Acid bath for the galvanic deposition of copper, and the use of such a bath |
US5730854A (en) * | 1996-05-30 | 1998-03-24 | Enthone-Omi, Inc. | Alkoxylated dimercaptans as copper additives and de-polarizing additives |
EP1054080A2 (en) * | 1999-05-17 | 2000-11-22 | Shipley Company LLC | Electrolytic copper plating solutions |
EP1054080A3 (en) * | 1999-05-17 | 2004-03-03 | Shipley Company LLC | Electrolytic copper plating solutions |
US20040231995A1 (en) * | 2003-05-23 | 2004-11-25 | Kenji Murao | Printed circuit boards and the methods of their production |
US20080142370A1 (en) * | 2003-08-08 | 2008-06-19 | Wolfgang Dahms | Aqueous, Acidic Solution and Method for Electrolytically Depositing Copper Coatings as Well as Use of Said Solution |
WO2005049584A1 (en) * | 2003-11-19 | 2005-06-02 | Atotech Deutschland Gmbh | Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds |
US20070108062A1 (en) * | 2003-11-19 | 2007-05-17 | Atotech Deutschland Gmbh | Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds |
US7786303B2 (en) | 2003-11-19 | 2010-08-31 | Atotech Deutschland Gmbh | Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds |
CN1882550B (en) * | 2003-11-19 | 2012-04-18 | 埃托特克德国有限公司 | Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds |
CN101899687A (en) * | 2010-08-03 | 2010-12-01 | 济南德锡科技有限公司 | Single dye type bright acidic copper plating additive and preparation method and application thereof |
WO2012040417A1 (en) | 2010-09-24 | 2012-03-29 | Macdermid Acumen, Inc. | Improved method of producing polymeric phenazonium compounds |
CN103270081A (en) * | 2010-09-24 | 2013-08-28 | 麦克德米德尖端有限公司 | Improved method of producing polymeric phenazonium compounds |
US8691987B2 (en) | 2010-09-24 | 2014-04-08 | Andrew M. Krol | Method of producing polymeric phenazonium compounds |
US8735580B2 (en) | 2010-09-24 | 2014-05-27 | Andrew M. Krol | Method of producing polymeric phenazonium compounds |
CN103270081B (en) * | 2010-09-24 | 2014-12-03 | 麦克德米德尖端有限公司 | Improved method of producing polymeric phenazonium compounds |
US20150030873A1 (en) * | 2013-07-23 | 2015-01-29 | Chang Chun Petrochemical Co., Ltd. | Electrolytic copper foil |
US9209485B2 (en) * | 2013-07-23 | 2015-12-08 | Chang Chun Petrochemical Co. Ltd. | Electrolytic copper foil |
Also Published As
Publication number | Publication date |
---|---|
AT302764B (en) | 1972-10-25 |
FR2095876A5 (en) | 1972-02-11 |
DE2039831A1 (en) | 1972-01-05 |
CH556347A (en) | 1974-11-29 |
DE2039831C3 (en) | 1979-09-06 |
NL173277B (en) | 1983-08-01 |
DE2039831B2 (en) | 1979-01-04 |
NL7107804A (en) | 1971-12-08 |
DE2028803C3 (en) | 1980-08-14 |
DE2028803A1 (en) | 1971-12-16 |
DE2028803B2 (en) | 1979-11-29 |
CA961494A (en) | 1975-01-21 |
NL173277C (en) | 1984-01-02 |
GB1357442A (en) | 1974-06-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3743584A (en) | Acid bright copper plating bath | |
US3905878A (en) | Electrolyte for and method of bright electroplating of tin-lead alloy | |
EP0611840B1 (en) | Cyanide-free plating solutions for monovalent metals | |
US3502551A (en) | Acid electrolyte for the deposition of bright,levelling copper coatings | |
US4347108A (en) | Electrodeposition of copper, acidic copper electroplating baths and additives therefor | |
US2882209A (en) | Electrodeposition of copper from an acid bath | |
US2707166A (en) | Electrodeposition of copper from an acid bath | |
CA1104152A (en) | Nitrogen and sulfur compositions and acid copper plating baths | |
US4515663A (en) | Acid zinc and zinc alloy electroplating solution and process | |
GB2096175A (en) | Electrodeposition of tin and tin alloys | |
US3006822A (en) | Electro-deposition of nickel coatings | |
DE2231988C2 (en) | Galvanic bath for the deposition of shiny tin | |
US3149057A (en) | Acid gold plating | |
US3296105A (en) | Zinc cyanide electroplating bath and process | |
US4252619A (en) | Brightener for zinc electroplating solutions and process | |
US3891520A (en) | Acid, galvanic zinc bath | |
TW202035799A (en) | Electrolytic gold plating solution, method of manufacturing the same, gold plating method and gold complex excellent in oxidative stability without containing a cyanide and advantageous in current efficiency at the time of gold plating | |
US3453186A (en) | Additives for tin electroplating bath | |
US3580821A (en) | Bright silver electroplating | |
US3492135A (en) | Stabilized bath for deposition of copper by chemical reduction | |
US3092559A (en) | Gold plating | |
EP2619244B1 (en) | Improved method of producing polymeric phenazonium compounds | |
JPH06501986A (en) | Method of using acid baths and combinations for electrolytically depositing copper coatings | |
US3179578A (en) | Acid copper electroplating baths | |
US3767539A (en) | Acid galvanic copper bath |