FI54500C - ICKE-ELEKTRISK BELAEGGNING MED KOPPAR - Google Patents

ICKE-ELEKTRISK BELAEGGNING MED KOPPAR

Info

Publication number
FI54500C
FI54500C FI117/73A FI11773A FI54500C FI 54500 C FI54500 C FI 54500C FI 117/73 A FI117/73 A FI 117/73A FI 11773 A FI11773 A FI 11773A FI 54500 C FI54500 C FI 54500C
Authority
FI
Finland
Prior art keywords
koppar
belaeggning
elektrisk
icke
med
Prior art date
Application number
FI117/73A
Other languages
Finnish (fi)
Other versions
FI54500B (en
Inventor
Michael Nicholas Gilano
Original Assignee
Dynachem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynachem Corp filed Critical Dynachem Corp
Application granted granted Critical
Publication of FI54500B publication Critical patent/FI54500B/en
Publication of FI54500C publication Critical patent/FI54500C/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
FI117/73A 1972-01-17 1973-01-16 ICKE-ELEKTRISK BELAEGGNING MED KOPPAR FI54500C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21845972A 1972-01-17 1972-01-17

Publications (2)

Publication Number Publication Date
FI54500B FI54500B (en) 1978-08-31
FI54500C true FI54500C (en) 1978-12-11

Family

ID=22815208

Family Applications (1)

Application Number Title Priority Date Filing Date
FI117/73A FI54500C (en) 1972-01-17 1973-01-16 ICKE-ELEKTRISK BELAEGGNING MED KOPPAR

Country Status (23)

Country Link
US (1) US3790392A (en)
JP (1) JPS5519983B2 (en)
AT (1) AT320372B (en)
AU (1) AU464729B2 (en)
BE (1) BE794048A (en)
CH (1) CH599981A5 (en)
DD (1) DD107490A5 (en)
DE (1) DE2300748C3 (en)
DK (1) DK143948C (en)
ES (1) ES410652A1 (en)
FI (1) FI54500C (en)
FR (1) FR2168364B1 (en)
GB (1) GB1414896A (en)
HK (1) HK65076A (en)
IL (1) IL41331A (en)
IT (1) IT980460B (en)
LU (1) LU66834A1 (en)
NL (1) NL177330C (en)
NO (1) NO135188C (en)
PL (1) PL94000B1 (en)
RO (1) RO69172A (en)
SE (1) SE387664B (en)
ZA (1) ZA73328B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL164906C (en) * 1975-08-19 1981-02-16 Philips Nv PROCESS FOR PREPARING AN AQUEOUS ALKALINE SELLER BATH.
JPS60159328U (en) * 1984-03-31 1985-10-23 株式会社　高津製作所 Oil level gauge with drain alarm
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
US5626736A (en) 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
EP2639335B1 (en) * 2012-03-14 2015-09-16 Atotech Deutschland GmbH Alkaline plating bath for electroless deposition of cobalt alloys
CN103225092A (en) * 2013-05-22 2013-07-31 南通鑫平制衣有限公司 Plated copper for plastics
JP6176841B2 (en) * 2013-07-19 2017-08-09 ローム・アンド・ハース電子材料株式会社 Electroless copper plating solution
US10060034B2 (en) 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1192021B (en) * 1963-01-12 1965-04-29 Dehydag Gmbh Galvanic baths
US3457089A (en) * 1967-04-07 1969-07-22 Shipley Co Electroless copperplating
US3635758A (en) * 1969-08-04 1972-01-18 Photocircuits Corp Electroless metal deposition

Also Published As

Publication number Publication date
ZA73328B (en) 1973-10-31
IT980460B (en) 1974-09-30
DK143948B (en) 1981-11-02
NL7300599A (en) 1973-07-19
BE794048A (en) 1973-07-16
CH599981A5 (en) 1978-06-15
DE2300748B2 (en) 1975-03-13
HK65076A (en) 1976-10-22
GB1414896A (en) 1975-11-19
JPS4999934A (en) 1974-09-20
NO135188C (en) 1977-02-23
PL94000B1 (en) 1977-07-30
IL41331A0 (en) 1973-03-30
JPS5519983B2 (en) 1980-05-30
NL177330B (en) 1985-04-01
DE2300748C3 (en) 1975-10-30
FR2168364B1 (en) 1975-03-28
NL177330C (en) 1985-09-02
US3790392A (en) 1974-02-05
SE387664B (en) 1976-09-13
RO69172A (en) 1980-01-15
LU66834A1 (en) 1973-03-19
NO135188B (en) 1976-11-15
AU5076873A (en) 1974-07-11
FR2168364A1 (en) 1973-08-31
AU464729B2 (en) 1975-09-04
FI54500B (en) 1978-08-31
DD107490A5 (en) 1974-08-05
IL41331A (en) 1975-11-25
ES410652A1 (en) 1976-01-01
DE2300748A1 (en) 1973-07-26
AT320372B (en) 1975-02-10
DK143948C (en) 1982-04-19

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