SE387664B - WAY AND BATH TO CARRY OUT STROMLESS COPPER PLATING - Google Patents

WAY AND BATH TO CARRY OUT STROMLESS COPPER PLATING

Info

Publication number
SE387664B
SE387664B SE7300440A SE7300440A SE387664B SE 387664 B SE387664 B SE 387664B SE 7300440 A SE7300440 A SE 7300440A SE 7300440 A SE7300440 A SE 7300440A SE 387664 B SE387664 B SE 387664B
Authority
SE
Sweden
Prior art keywords
stromless
bath
way
carry out
copper plating
Prior art date
Application number
SE7300440A
Other languages
Swedish (sv)
Inventor
M N Gilano
Original Assignee
Dynachem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynachem Corp filed Critical Dynachem Corp
Publication of SE387664B publication Critical patent/SE387664B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
SE7300440A 1972-01-17 1973-01-12 WAY AND BATH TO CARRY OUT STROMLESS COPPER PLATING SE387664B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21845972A 1972-01-17 1972-01-17

Publications (1)

Publication Number Publication Date
SE387664B true SE387664B (en) 1976-09-13

Family

ID=22815208

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7300440A SE387664B (en) 1972-01-17 1973-01-12 WAY AND BATH TO CARRY OUT STROMLESS COPPER PLATING

Country Status (23)

Country Link
US (1) US3790392A (en)
JP (1) JPS5519983B2 (en)
AT (1) AT320372B (en)
AU (1) AU464729B2 (en)
BE (1) BE794048A (en)
CH (1) CH599981A5 (en)
DD (1) DD107490A5 (en)
DE (1) DE2300748C3 (en)
DK (1) DK143948C (en)
ES (1) ES410652A1 (en)
FI (1) FI54500C (en)
FR (1) FR2168364B1 (en)
GB (1) GB1414896A (en)
HK (1) HK65076A (en)
IL (1) IL41331A (en)
IT (1) IT980460B (en)
LU (1) LU66834A1 (en)
NL (1) NL177330C (en)
NO (1) NO135188C (en)
PL (1) PL94000B1 (en)
RO (1) RO69172A (en)
SE (1) SE387664B (en)
ZA (1) ZA73328B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL164906C (en) * 1975-08-19 1981-02-16 Philips Nv PROCESS FOR PREPARING AN AQUEOUS ALKALINE SELLER BATH.
JPS60159328U (en) * 1984-03-31 1985-10-23 株式会社　高津製作所 Oil level gauge with drain alarm
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
US5626736A (en) 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
EP2639335B1 (en) * 2012-03-14 2015-09-16 Atotech Deutschland GmbH Alkaline plating bath for electroless deposition of cobalt alloys
CN103225092A (en) * 2013-05-22 2013-07-31 南通鑫平制衣有限公司 Plated copper for plastics
JP6176841B2 (en) * 2013-07-19 2017-08-09 ローム・アンド・ハース電子材料株式会社 Electroless copper plating solution
US10060034B2 (en) 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1192021B (en) * 1963-01-12 1965-04-29 Dehydag Gmbh Galvanic baths
US3457089A (en) * 1967-04-07 1969-07-22 Shipley Co Electroless copperplating
US3635758A (en) * 1969-08-04 1972-01-18 Photocircuits Corp Electroless metal deposition

Also Published As

Publication number Publication date
FI54500B (en) 1978-08-31
DE2300748A1 (en) 1973-07-26
HK65076A (en) 1976-10-22
JPS5519983B2 (en) 1980-05-30
GB1414896A (en) 1975-11-19
PL94000B1 (en) 1977-07-30
FI54500C (en) 1978-12-11
ZA73328B (en) 1973-10-31
NL7300599A (en) 1973-07-19
NL177330B (en) 1985-04-01
DD107490A5 (en) 1974-08-05
FR2168364A1 (en) 1973-08-31
DE2300748B2 (en) 1975-03-13
AT320372B (en) 1975-02-10
NO135188C (en) 1977-02-23
NL177330C (en) 1985-09-02
US3790392A (en) 1974-02-05
AU5076873A (en) 1974-07-11
RO69172A (en) 1980-01-15
ES410652A1 (en) 1976-01-01
IT980460B (en) 1974-09-30
DK143948B (en) 1981-11-02
DE2300748C3 (en) 1975-10-30
JPS4999934A (en) 1974-09-20
BE794048A (en) 1973-07-16
AU464729B2 (en) 1975-09-04
FR2168364B1 (en) 1975-03-28
LU66834A1 (en) 1973-03-19
IL41331A (en) 1975-11-25
NO135188B (en) 1976-11-15
CH599981A5 (en) 1978-06-15
IL41331A0 (en) 1973-03-30
DK143948C (en) 1982-04-19

Similar Documents

Publication Publication Date Title
BE833384A (en) COPPER ELECTRODEPOSITION
BR7200024D0 (en) DIALISE BATH MONITOR-GENERATOR SET
BE812507A (en) CIRCUIT ARRANGEMENTS
BE754235A (en) SUPERVISION CIRCUIT FOR TELEPHONE LINES
SE373678B (en) RIVER EQUIPMENT
SE387664B (en) WAY AND BATH TO CARRY OUT STROMLESS COPPER PLATING
IT946822B (en) NOT ELECTROLYTIC COPPER
AT332188B (en) ELECTRONIC TINNING BATH
IT1044885B (en) COPPER PLATING WITHOUT ELECTRICITY
AT293132B (en) Stabilized reductive nickel bath
BE802853A (en) ELECTRODEPOSITION
BR7305054D0 (en) GALVANIC BATH
AT290241B (en) Plated molding
AT326970B (en) ELECTRIC WATER COPPER BATH
SE385536B (en) ELECTRONRAL HORIZONTAL DIVERCENT CIRCUIT
JPS51110281A (en) DENKAI KOKATORAN JISUTA
SU467126A1 (en) Copper based alloy
BE808412A (en) PROVISION TO IMPROVE THE CONNECTIONS OF THE PRINTED CIRCUITS
BE763626A (en) ELECTROLYTIC COPPER BATH
BE831442A (en) COPPER ELECTRODEPOSITION
JPS51110279A (en) DENKAI KOKATORAN JISUTA
BE744272A (en) ELECTRODEPOSITION
IL32304A0 (en) Acid plating baths
CH529842A (en) Electrolytic bath composition
FR2009939A1 (en) UNDERWATER VOICE CARRIER