AT332188B - ELECTRONIC TINNING BATH - Google Patents
ELECTRONIC TINNING BATHInfo
- Publication number
- AT332188B AT332188B AT609174A AT609174A AT332188B AT 332188 B AT332188 B AT 332188B AT 609174 A AT609174 A AT 609174A AT 609174 A AT609174 A AT 609174A AT 332188 B AT332188 B AT 332188B
- Authority
- AT
- Austria
- Prior art keywords
- electronic
- tinning bath
- tinning
- bath
- electronic tinning
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US382056A US3917486A (en) | 1973-07-24 | 1973-07-24 | Immersion tin bath composition and process for using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ATA609174A ATA609174A (en) | 1975-12-15 |
| AT332188B true AT332188B (en) | 1976-09-10 |
Family
ID=23507363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT609174A AT332188B (en) | 1973-07-24 | 1974-07-24 | ELECTRONIC TINNING BATH |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US3917486A (en) |
| JP (1) | JPS5624713B2 (en) |
| AT (1) | AT332188B (en) |
| CA (1) | CA1037207A (en) |
| CH (1) | CH606499A5 (en) |
| DK (1) | DK397374A (en) |
| FR (1) | FR2238772B1 (en) |
| GB (1) | GB1436645A (en) |
| IT (1) | IT1016948B (en) |
| NL (1) | NL7410019A (en) |
| SE (1) | SE411228B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4170525A (en) * | 1978-04-28 | 1979-10-09 | Gould Inc. | Process for plating a composite structure |
| US4381228A (en) * | 1981-06-16 | 1983-04-26 | Occidental Chemical Corporation | Process and composition for the electrodeposition of tin and tin alloys |
| US4405663A (en) * | 1982-03-29 | 1983-09-20 | Republic Steel Corporation | Tin plating bath composition and process |
| IL81530A0 (en) * | 1987-02-10 | 1987-09-16 | Techno Chemica Ltd | Tin coating immersion solution and coating process using the same |
| JPH0453710U (en) * | 1990-09-11 | 1992-05-08 | ||
| US5196053A (en) * | 1991-11-27 | 1993-03-23 | Mcgean-Rohco, Inc. | Complexing agent for displacement tin plating |
| US5562950A (en) * | 1994-03-24 | 1996-10-08 | Novamax Technologies, Inc. | Tin coating composition and method |
| EP2298960A1 (en) * | 2009-08-24 | 2011-03-23 | ATOTECH Deutschland GmbH | Method for electroless plating of tin and tin alloys |
| CN103540972A (en) * | 2013-10-29 | 2014-01-29 | 常熟市伟达电镀有限责任公司 | High-hardness electroplating liquid |
| CN110139948B (en) * | 2016-12-28 | 2022-09-30 | 德国艾托特克公司 | Tin plating bath and method for depositing tin or tin alloy on surface of substrate |
| US10774425B2 (en) * | 2017-05-30 | 2020-09-15 | Macdermid Enthone Inc. | Elimination of H2S in immersion tin plating solution |
| EP3800277B1 (en) * | 2019-10-02 | 2023-05-10 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for performing immersion tin process in the production of a component carrier |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2369620A (en) * | 1941-03-07 | 1945-02-13 | Battelle Development Corp | Method of coating cupreous metal with tin |
| US2891871A (en) * | 1956-09-21 | 1959-06-23 | Westinghouse Electric Corp | Tin immersion plating composition and process for using the same |
| US3303029A (en) * | 1964-01-23 | 1967-02-07 | Shipley Co | Tin coating of copper surfaces by replacement plating |
| US3672923A (en) * | 1970-06-29 | 1972-06-27 | Kollmorgen Corp | Solid precious metal sensitizing compositions |
-
1973
- 1973-07-24 US US382056A patent/US3917486A/en not_active Expired - Lifetime
-
1974
- 1974-04-26 CA CA199,110A patent/CA1037207A/en not_active Expired
- 1974-05-17 JP JP5607274A patent/JPS5624713B2/ja not_active Expired
- 1974-07-11 CH CH958174A patent/CH606499A5/xx not_active IP Right Cessation
- 1974-07-15 GB GB3120874A patent/GB1436645A/en not_active Expired
- 1974-07-19 FR FR7425180A patent/FR2238772B1/fr not_active Expired
- 1974-07-22 SE SE7409520A patent/SE411228B/en unknown
- 1974-07-23 DK DK397374A patent/DK397374A/da not_active Application Discontinuation
- 1974-07-23 IT IT52221/74A patent/IT1016948B/en active
- 1974-07-24 NL NL7410019A patent/NL7410019A/en not_active Application Discontinuation
- 1974-07-24 AT AT609174A patent/AT332188B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| AU6664174A (en) | 1975-09-18 |
| CH606499A5 (en) | 1978-10-31 |
| SE411228B (en) | 1979-12-10 |
| JPS5624713B2 (en) | 1981-06-08 |
| FR2238772B1 (en) | 1978-03-24 |
| US3917486A (en) | 1975-11-04 |
| DE2433820A1 (en) | 1975-01-30 |
| CA1037207A (en) | 1978-08-29 |
| JPS5033935A (en) | 1975-04-02 |
| DE2433820B2 (en) | 1977-04-28 |
| DK397374A (en) | 1975-03-03 |
| GB1436645A (en) | 1976-05-19 |
| ATA609174A (en) | 1975-12-15 |
| NL7410019A (en) | 1975-01-28 |
| FR2238772A1 (en) | 1975-02-21 |
| IT1016948B (en) | 1977-06-20 |
| SE7409520L (en) | 1975-01-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ELJ | Ceased due to non-payment of the annual fee |