IL81530A0 - Tin coating immersion solution and coating process using the same - Google Patents

Tin coating immersion solution and coating process using the same

Info

Publication number
IL81530A0
IL81530A0 IL81530A IL8153087A IL81530A0 IL 81530 A0 IL81530 A0 IL 81530A0 IL 81530 A IL81530 A IL 81530A IL 8153087 A IL8153087 A IL 8153087A IL 81530 A0 IL81530 A0 IL 81530A0
Authority
IL
Israel
Prior art keywords
coating
same
immersion solution
tin
coating process
Prior art date
Application number
IL81530A
Original Assignee
Techno Chemica Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Techno Chemica Ltd filed Critical Techno Chemica Ltd
Priority to IL81530A priority Critical patent/IL81530A0/en
Publication of IL81530A0 publication Critical patent/IL81530A0/en
Priority to JP63026720A priority patent/JPH02153074A/en
Priority to EP88301123A priority patent/EP0278752A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
IL81530A 1987-02-10 1987-02-10 Tin coating immersion solution and coating process using the same IL81530A0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IL81530A IL81530A0 (en) 1987-02-10 1987-02-10 Tin coating immersion solution and coating process using the same
JP63026720A JPH02153074A (en) 1987-02-10 1988-02-09 Dipping-solution for coating tin and coating-method by dipping using its solution
EP88301123A EP0278752A1 (en) 1987-02-10 1988-02-10 A tin coating immersion solution and a coating process using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL81530A IL81530A0 (en) 1987-02-10 1987-02-10 Tin coating immersion solution and coating process using the same

Publications (1)

Publication Number Publication Date
IL81530A0 true IL81530A0 (en) 1987-09-16

Family

ID=11057536

Family Applications (1)

Application Number Title Priority Date Filing Date
IL81530A IL81530A0 (en) 1987-02-10 1987-02-10 Tin coating immersion solution and coating process using the same

Country Status (3)

Country Link
EP (1) EP0278752A1 (en)
JP (1) JPH02153074A (en)
IL (1) IL81530A0 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4422756C1 (en) 1994-06-29 1995-04-20 Goldschmidt Ag Th Self-regulating, acid electrolyte for dip tinning of aluminium alloys
DE4429127C1 (en) * 1994-08-17 1995-08-31 Goldschmidt Ag Th Acidic electrolyte for tin@ plating of aluminium@ alloy substrates
US5601695A (en) * 1995-06-07 1997-02-11 Atotech U.S.A., Inc. Etchant for aluminum alloys
DE19828811C1 (en) * 1998-06-27 1999-12-09 Goldschmidt Ag Th Mordant activation solution for aluminum-steel compound material to be tin-plated
US7156904B2 (en) * 2003-04-30 2007-01-02 Mec Company Ltd. Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
US7029761B2 (en) 2003-04-30 2006-04-18 Mec Company Ltd. Bonding layer for bonding resin on copper surface

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3917486A (en) * 1973-07-24 1975-11-04 Kollmorgen Photocircuits Immersion tin bath composition and process for using same
US4170525A (en) * 1978-04-28 1979-10-09 Gould Inc. Process for plating a composite structure
DE3425214A1 (en) * 1984-07-09 1986-02-06 Riedel-De Haen Ag, 3016 Seelze MEANS FOR THE DEFLECTIVE DEPOSITION OF TIN AND / OR LEAD
US4618513A (en) * 1984-12-17 1986-10-21 Texo Corporation Tin plating immersion process

Also Published As

Publication number Publication date
JPH02153074A (en) 1990-06-12
EP0278752A1 (en) 1988-08-17

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