GB2201916B - Solder coating processes - Google Patents

Solder coating processes

Info

Publication number
GB2201916B
GB2201916B GB8805207A GB8805207A GB2201916B GB 2201916 B GB2201916 B GB 2201916B GB 8805207 A GB8805207 A GB 8805207A GB 8805207 A GB8805207 A GB 8805207A GB 2201916 B GB2201916 B GB 2201916B
Authority
GB
United Kingdom
Prior art keywords
coating processes
solder coating
solder
processes
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB8805207A
Other versions
GB2201916A (en
GB8805207D0 (en
Inventor
William H Baker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems PLC
Original Assignee
British Aerospace PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Aerospace PLC filed Critical British Aerospace PLC
Publication of GB8805207D0 publication Critical patent/GB8805207D0/en
Publication of GB2201916A publication Critical patent/GB2201916A/en
Application granted granted Critical
Publication of GB2201916B publication Critical patent/GB2201916B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
GB8805207A 1987-03-12 1988-03-04 Solder coating processes Expired - Lifetime GB2201916B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB878705931A GB8705931D0 (en) 1987-03-12 1987-03-12 Solder coating processes

Publications (3)

Publication Number Publication Date
GB8805207D0 GB8805207D0 (en) 1988-04-07
GB2201916A GB2201916A (en) 1988-09-14
GB2201916B true GB2201916B (en) 1990-10-24

Family

ID=10613860

Family Applications (2)

Application Number Title Priority Date Filing Date
GB878705931A Pending GB8705931D0 (en) 1987-03-12 1987-03-12 Solder coating processes
GB8805207A Expired - Lifetime GB2201916B (en) 1987-03-12 1988-03-04 Solder coating processes

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB878705931A Pending GB8705931D0 (en) 1987-03-12 1987-03-12 Solder coating processes

Country Status (1)

Country Link
GB (2) GB8705931D0 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0203623A2 (en) * 1985-03-06 1986-12-03 ITALTEL SOCIETA ITALIANA TELECOMUNICAZIONI s.p.a. Wavesoldering device, particularly for printed circuits

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0203623A2 (en) * 1985-03-06 1986-12-03 ITALTEL SOCIETA ITALIANA TELECOMUNICAZIONI s.p.a. Wavesoldering device, particularly for printed circuits

Also Published As

Publication number Publication date
GB2201916A (en) 1988-09-14
GB8705931D0 (en) 1987-04-15
GB8805207D0 (en) 1988-04-07

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930304